| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/24/2005 | US20050258509 Substrate, semiconductor device, and substrate fabricating method |
| 11/24/2005 | US20050258508 Semiconductor device with inductors |
| 11/24/2005 | US20050258507 Q-factor with electrically controllable resistivity of silicon substrate layer |
| 11/24/2005 | US20050258506 Arrangement and process for protecting fuses/anti-fuses |
| 11/24/2005 | US20050258505 Mixed implantation on polysilicon fuse for CMOS technology |
| 11/24/2005 | US20050258504 Fuse structure for a semiconductor device |
| 11/24/2005 | US20050258502 Chip package, image sensor module including chip package, and manufacturing method thereof |
| 11/24/2005 | US20050258498 Semiconductor device and method for fabricating the same |
| 11/24/2005 | US20050258494 Versatile system for limiting electric field degradation of semiconductor structures |
| 11/24/2005 | US20050258489 Thin layer semi-conductor structure comprising a heat distribution layer |
| 11/24/2005 | US20050258484 Power composite integrated semiconductor device and manufacturing method thereof |
| 11/24/2005 | US20050258482 Anti-fuse device |
| 11/24/2005 | US20050258466 Capacitor and light emitting display using the same |
| 11/24/2005 | US20050258465 Semiconductor memory device including multi-layer gate structure |
| 11/24/2005 | US20050258452 Semiconductor device and manufacturing method therefor |
| 11/24/2005 | US20050258447 Electronic parts and method of manufacturing electronic parts packaging structure |
| 11/24/2005 | US20050258431 Dielectric passivation for semiconductor devices |
| 11/24/2005 | US20050258349 Photoelectric converter device and manufacturing method thereof |
| 11/24/2005 | US20050258214 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 11/24/2005 | US20050258212 Semiconductor die attachment for high vacuum tubes |
| 11/24/2005 | US20050258046 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 11/24/2005 | US20050257955 Packaging of a microchip device |
| 11/24/2005 | US20050257954 Structure for mounting electronic component on wiring board |
| 11/24/2005 | US20050257920 Heat dissipating device |
| 11/24/2005 | US20050257917 Thermal transfer devices with fluid-porous thermally conductive core |
| 11/24/2005 | US20050257916 Heat conductive pipe |
| 11/24/2005 | US20050257915 Cooling device |
| 11/24/2005 | US20050257914 Skived-fin annular heat sink |
| 11/24/2005 | US20050257913 Heat sink with fins fitted and bonded thereto by applying conductive glue |
| 11/24/2005 | US20050257821 Thermoelectric nano-wire devices |
| 11/24/2005 | DE202005007880U1 Multilayer heat conductive three dimensional diffusion plate as for power light diodes and CPU has superconductive plate between soft flexible plate and glass fiber material |
| 11/24/2005 | DE102005018736A1 Versorgungsleitungsanordnung, Off-Chip-Treiberanordnung und Halbleiterschaltungsmodul Supply line assembly, off-chip driver assembly and semiconductor circuit module |
| 11/24/2005 | DE102005018114A1 Spannungs-/Prozessbewertung bei Halbleitern Voltage / process evaluation in semiconductors |
| 11/24/2005 | DE102005018108A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Lötschicht A process for producing a semiconductor device with a solder layer |
| 11/24/2005 | DE102004062834A1 Metal pattern formation n semiconductor device manufacture, involves forming damascene trench having inclined bottom profile for exposing side wall of interconnection contact |
| 11/24/2005 | DE102004023037A1 Ribbed heat sink structure for cooling computer etc., has heat conducting medium in passages in baseplate, and radiating fins |
| 11/24/2005 | DE102004021054A1 Semiconductor component for a flip-chip structure has contact layers between a semiconductor chip and a chip carrier |
| 11/24/2005 | DE102004014753B3 Ceramic element e.g. for temperature measurement over high temperature conductor, has body, connection ports with electrical inlets attached to it and element body has connection ports and are soldered on ends of the inlets in glass body |
| 11/24/2005 | DE10035170B4 Keramikkörper mit Temperiervorrichtung, Verfahren zum Herstellen und Verwendung des Keramikkörpers Ceramic body with temperature control, methods of making and use of the ceramic body |
| 11/24/2005 | CA2605871A1 Microfabricated miniature grids |
| 11/23/2005 | EP1599081A2 Thermal management system and method for electronic equipment mounted on coldplates |
| 11/23/2005 | EP1599076A1 Wired circuit board |
| 11/23/2005 | EP1598868A1 Stacked dies having shared access to memory |
| 11/23/2005 | EP1598867A2 Test circuit under pad |
| 11/23/2005 | EP1598866A1 Cooling device |
| 11/23/2005 | EP1598863A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598862A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598861A1 Method and machine for calibrating and controlling the embedding process in the manufacturing of chip cards |
| 11/23/2005 | EP1598854A1 Semiconductor device and semiconductor production management system |
| 11/23/2005 | EP1598448A1 Lead-free bump and method for forming the same |
| 11/23/2005 | EP1598436A1 Metal material and method for production thereof |
| 11/23/2005 | EP1597950A2 Industrial ethernet switch |
| 11/23/2005 | EP1597763A1 Cooling assembly comprising micro-jets |
| 11/23/2005 | EP1597762A2 Thin multiple semiconductor die package |
| 11/23/2005 | EP1597761A2 Packaged microchip with thermal stress relief |
| 11/23/2005 | EP1597760A1 Integrated electronic component having specifically produced nanotubes in vertical structures |
| 11/23/2005 | EP1597757A2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 11/23/2005 | EP1597756A2 Internal connection system for power semiconductors comprising large-area terminals |
| 11/23/2005 | EP1597755A2 Self-supporting contacting structures that are directly produced on components without housings |
| 11/23/2005 | EP1597734A1 Semiconductor chip arrangement with rom |
| 11/23/2005 | EP1597315A2 Molding compositions containing quaternary organophosphonium salts |
| 11/23/2005 | EP1433204B1 Device with power semiconductor components for controlling the power of high currents and use of said device |
| 11/23/2005 | CN2742578Y Round heat radiation sheet module |
| 11/23/2005 | CN2742577Y Heat radiator and its radiation fin |
| 11/23/2005 | CN2742576Y Foot seat and heat radiator combined structure |
| 11/23/2005 | CN2742575Y Heat radiator plate |
| 11/23/2005 | CN2742574Y Heat radiator locking device |
| 11/23/2005 | CN1701649A Method for supplying solder |
| 11/23/2005 | CN1701613A Packaged RF power transistor having RF bypassing/output matching network |
| 11/23/2005 | CN1701471A Interposer assembly for soldered electrical connections |
| 11/23/2005 | CN1701441A Process for producing microelectromechanical components |
| 11/23/2005 | CN1701440A Economical high-frequency package |
| 11/23/2005 | CN1701439A Semiconductor device, method for manufacturing same, and power converter using such semiconductor device |
| 11/23/2005 | CN1701438A Packaged microchip |
| 11/23/2005 | CN1701437A 电子装置 Electronic devices |
| 11/23/2005 | CN1701436A 半导体装置 Semiconductor device |
| 11/23/2005 | CN1701434A Semiconductor device and method for manufacturing the same |
| 11/23/2005 | CN1701428A Internally reinforced bond pads |
| 11/23/2005 | CN1701427A LSI package, LSI element testing method, and semiconductor device manufacturing method |
| 11/23/2005 | CN1701418A Semiconductor device producing method, semiconductor wafer and semiconductor device |
| 11/23/2005 | CN1701401A Surface mounting type part |
| 11/23/2005 | CN1701240A Device and method for characterizing the version of integrated circuits and use for controlling operations |
| 11/23/2005 | CN1701238A Measurement of lateral diffusion of diffused layers |
| 11/23/2005 | CN1700973A Semiconductor-sealing-purpose epoxy resin compound producing method |
| 11/23/2005 | CN1700850A Semiconductor device, noise reduction method, and shield cover |
| 11/23/2005 | CN1700479A Photoelectric converter device and manufacturing method thereof |
| 11/23/2005 | CN1700477A Reliable semiconductor structure and method for fabricating |
| 11/23/2005 | CN1700470A Integrated circuit having a strengthened passivation structure |
| 11/23/2005 | CN1700469A Integrated circuit structure and method of providing source voltage to integrated circuit |
| 11/23/2005 | CN1700468A Topographically elevated microelectronic capacitor structure |
| 11/23/2005 | CN1700466A Overhang support for a stacked semiconductor device, and method of forming thereof |
| 11/23/2005 | CN1700464A electrostatic discharge protection assembly structure having low trigger voltage characteristics |
| 11/23/2005 | CN1700463A Real-time correct driven electrostatic discharge protecting device |
| 11/23/2005 | CN1700462A Copper conducting wire mosaic structure |
| 11/23/2005 | CN1700461A Chip having specific configuration in I/O port |
| 11/23/2005 | CN1700460A 半导体器件 Semiconductor devices |
| 11/23/2005 | CN1700459A Semiconductor chip package |
| 11/23/2005 | CN1700458A Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same |
| 11/23/2005 | CN1700457A Flip chip semiconductor package for testing bump and method of fabricating the same |
| 11/23/2005 | CN1700456A Connecting rack structure of stacked transistor and buildup structure |