| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/29/2005 | US6969436 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements |
| 11/29/2005 | US6969234 Fan guide hood structure |
| 11/29/2005 | US6968890 Heat sink |
| 11/29/2005 | US6968889 Fastening structure of heat sink |
| 11/29/2005 | US6968762 Pipe preparing tool V |
| 11/29/2005 | US6968709 System and method for cooling multiple logic modules |
| 11/24/2005 | WO2005112533A2 Lightweight heat sink |
| 11/24/2005 | WO2005112185A1 Feed-through structure and feed-through type optical module |
| 11/24/2005 | WO2005112125A2 Misalignment-tolerant multiplexing/demultiplexing architectures |
| 11/24/2005 | WO2005112117A2 Power semiconductor assembly |
| 11/24/2005 | WO2005112116A1 Semiconductor device with a protected active die region and method therefor |
| 11/24/2005 | WO2005112115A1 Single row bond pad arrangement of an integrated circuit chip |
| 11/24/2005 | WO2005112114A2 Universal interconnect die |
| 11/24/2005 | WO2005112113A2 Mounting with auxiliary bumps |
| 11/24/2005 | WO2005112112A2 Captive socket actuator |
| 11/24/2005 | WO2005112111A1 Pressure contact type rectifier |
| 11/24/2005 | WO2005112105A1 Method for forming suspended transmission line structures in back end of line processing |
| 11/24/2005 | WO2005112103A2 Microfabricated miniature grids |
| 11/24/2005 | WO2005112102A2 Chemical-enhanced package singulation process |
| 11/24/2005 | WO2005112100A2 Stacked module systems and methods |
| 11/24/2005 | WO2005111715A2 Cooling for light emitting diode |
| 11/24/2005 | WO2005110666A1 Methods of drilling through-holes in homogeneous and non-homogeneous substrates |
| 11/24/2005 | WO2005094515A3 Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits |
| 11/24/2005 | WO2005081313A3 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 11/24/2005 | WO2005081308A3 Protective diode for protecting semiconductor switching circuits from electrostatic discharges |
| 11/24/2005 | WO2005071741A3 Coupling organic coatings in semiconductor housings |
| 11/24/2005 | WO2005038909A3 Integrated package design for a radiation sensing device and manufacturing method |
| 11/24/2005 | WO2005034235A3 Semiconductor module comprising a carrier device and method for producing a semiconductor module |
| 11/24/2005 | WO2004083742A3 Boiling temperature design in pumped microchannel cooling loops |
| 11/24/2005 | US20050261397 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same |
| 11/24/2005 | US20050260864 Method of depositing low k films |
| 11/24/2005 | US20050260858 Versatile system for limiting electric field degradation of semiconductor structures |
| 11/24/2005 | US20050260850 Low-carbon-doped silicon oxide film and damascene structure using same |
| 11/24/2005 | US20050260849 Top layers of metal for high performance IC's |
| 11/24/2005 | US20050260844 Package with barrier wall and method for manufacturing the same |
| 11/24/2005 | US20050260842 Final passivation scheme for integrated circuits |
| 11/24/2005 | US20050260822 Method of manufacturing semiconductor device |
| 11/24/2005 | US20050260797 Electronic and optoelectronic component packaging technique |
| 11/24/2005 | US20050260796 Circuit device, manufacturing method thereof, and sheet-like board member |
| 11/24/2005 | US20050260795 Method for fabricating leadless packages with mold locking characteristics |
| 11/24/2005 | US20050260794 Method for fabrication of wafer level package incorporating dual compliant layers |
| 11/24/2005 | US20050260791 Integrated ball and via package and formation process |
| 11/24/2005 | US20050260789 Method and system for applying an adhesive substance on an electronic device |
| 11/24/2005 | US20050260788 Motion detector and method of producing the same |
| 11/24/2005 | US20050260787 Dual row leadframe and fabrication method |
| 11/24/2005 | US20050260776 Structure and method for extraction of parasitic junction capacitance in deep submicron technology |
| 11/24/2005 | US20050260510 Method for determining the relative positional accuracy of two structure elements on a wafer |
| 11/24/2005 | US20050260420 Low dielectric materials and methods for making same |
| 11/24/2005 | US20050260391 Wired circuit board |
| 11/24/2005 | US20050259405 Heat dissipation device assembly |
| 11/24/2005 | US20050259402 Power stack |
| 11/24/2005 | US20050259401 Plasma display device |
| 11/24/2005 | US20050259400 Heat sinking structure of power semiconductor |
| 11/24/2005 | US20050259399 Processor heat sink retention module and assembly |
| 11/24/2005 | US20050259396 Thermal management system and method for electronic equipment mounted on coldplates |
| 11/24/2005 | US20050259379 Capacitive integrated circuit structure |
| 11/24/2005 | US20050259096 Method and structure for measuring a bonding resistance |
| 11/24/2005 | US20050258990 On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits |
| 11/24/2005 | US20050258901 System and method for linearizing a CMOS differential pair |
| 11/24/2005 | US20050258861 Programming semiconductor dies for pin map compatibility |
| 11/24/2005 | US20050258853 Semiconductor device and interposer |
| 11/24/2005 | US20050258819 Property measurement method for high frequency circuit, calibration pattern, and calibration jig |
| 11/24/2005 | US20050258552 Semiconductor molding method and structure |
| 11/24/2005 | US20050258551 Fine-pitch packaging substrate and a method of forming the same |
| 11/24/2005 | US20050258550 Circuit board and semiconductor device using the same |
| 11/24/2005 | US20050258549 Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon |
| 11/24/2005 | US20050258548 Capacitor-built-in-type printed wiring substrate printed wiring substrate, and capacitor |
| 11/24/2005 | US20050258547 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 11/24/2005 | US20050258546 Stacked dies having shared access to memory |
| 11/24/2005 | US20050258545 Multiple die package with adhesive/spacer structure and insulated die surface |
| 11/24/2005 | US20050258544 Substrate for solder joint |
| 11/24/2005 | US20050258543 Semiconductor memory device including multi-layer gate structure |
| 11/24/2005 | US20050258542 Use of a porous dielectric material as an etch stop layer for non-porous dielectric films |
| 11/24/2005 | US20050258541 Semiconductor device and manufacturing method thereof |
| 11/24/2005 | US20050258540 Semiconductor device |
| 11/24/2005 | US20050258539 Semiconductor device |
| 11/24/2005 | US20050258538 Double density method for wirebond interconnect |
| 11/24/2005 | US20050258537 Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package |
| 11/24/2005 | US20050258536 Chip heat sink device and method |
| 11/24/2005 | US20050258535 Selectively configurable circuit board |
| 11/24/2005 | US20050258534 Arrangement for receiving an electronic component capable of high power operation |
| 11/24/2005 | US20050258533 Semiconductor device mounting structure |
| 11/24/2005 | US20050258532 Semiconductor device |
| 11/24/2005 | US20050258531 Semiconductor device and manufacturing process thereof |
| 11/24/2005 | US20050258530 Micropede stacked die component assembly |
| 11/24/2005 | US20050258529 High-frequency chip packages |
| 11/24/2005 | US20050258527 Adhesive/spacer island structure for multiple die package |
| 11/24/2005 | US20050258526 Semiconductor device, method for mounting the same, and method for repairing the same |
| 11/24/2005 | US20050258524 Semiconductor device and method of manufacturing the same |
| 11/24/2005 | US20050258523 Heat dissipation module for an electronic device |
| 11/24/2005 | US20050258521 Leadless leadframe with an improved die pad for mold locking |
| 11/24/2005 | US20050258520 Packaged integrated circuit with MLP leadframe and method of making same |
| 11/24/2005 | US20050258519 Semiconductor device and method for fabricating the same |
| 11/24/2005 | US20050258518 Image sensor package module with a leadless leadframe between chips |
| 11/24/2005 | US20050258517 Configurable embedded processor |
| 11/24/2005 | US20050258516 Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same |
| 11/24/2005 | US20050258515 Embedded stressed nitride liners for CMOS performance improvement |
| 11/24/2005 | US20050258514 Microfabricated miniature grids |
| 11/24/2005 | US20050258513 Thin-film resistor and method of manufacturing the same |
| 11/24/2005 | US20050258512 Topographically elevated microelectronic capacitor structure |