Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/30/2005EP1601012A2 Microelectronic assembly having variable thickness solder joint
11/30/2005EP1599904A1 Lateral lubistor structure and method
11/30/2005EP1599903A2 Method for producing an electronic component or module and a corresponding component or module
11/30/2005EP1599902A2 Flip-chip component packaging process and flip-chip component
11/30/2005EP1360714A4 Wafer scale fiber optic termination
11/30/2005EP1292834B1 Systems for testing integrated circuits
11/30/2005EP1198836B1 Fuse for semiconductor device
11/30/2005CN2743976Y Electrostatic discharging protection circuit
11/30/2005CN2743975Y Ventilation radiator for semiconductor cooling refrigerator
11/30/2005CN2743974Y Radiating structure
11/30/2005CN2743973Y Radiator fastener
11/30/2005CN2743972Y Led座管 Led seat tube
11/30/2005CN2743971Y Spherical grid matrix packaging structure
11/30/2005CN1703889A Encryption, authentication, and key management for multimedia content pre-encryption
11/30/2005CN1703778A Method of manufacturing a data carrier
11/30/2005CN1703777A Method for cutting lead terminal of package type electronic component
11/30/2005CN1703776A Carbonaceous composite heat spreader and associated methods
11/30/2005CN1703775A Semiconductor integrated circuit device
11/30/2005CN1703768A Forming folded-stack packaged device using progressive folding tool
11/30/2005CN1703438A Epoxy resin composition for sealing optical semiconductor
11/30/2005CN1702965A Semiconductor device
11/30/2005CN1702863A Circuit device
11/30/2005CN1702861A Semiconductor device with a plurality of ground planes
11/30/2005CN1702860A Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
11/30/2005CN1702858A Multiprocessor chip with bidirectional ring interconnection
11/30/2005CN1702857A Semiconductor device and method for manufacturing the same
11/30/2005CN1702856A Wiring substrate and method of fabricating the same
11/30/2005CN1702855A Interposer substrate, semiconductor package and semiconductor device, and their producing methods
11/30/2005CN1702854A Intermediate substrate
11/30/2005CN1702853A Semiconductor device and manufacturing method of the same
11/30/2005CN1702851A Method for manufacturing microelectronic circuit component and integrated circuit component
11/30/2005CN1702839A Method of manufacturing semiconductor device and support structure for semiconductor substrate
11/30/2005CN1702826A Semiconductor device and method of manufacturing the same
11/30/2005CN1702689A Contact chip card, its production method and use thereof
11/30/2005CN1702533A Substrate for display device, manufacturing method for same and display device
11/30/2005CN1702470A Probe card for probing wafers with raised contact elements
11/30/2005CN1701952A Layer sequence for producing a composite material for electromechanical components
11/30/2005CN1230058C Casing for covering electronic element and display device containing said casing
11/30/2005CN1230052C Method for preparing high-performance lattice soldering bead array board
11/30/2005CN1230050C Electronic machine
11/30/2005CN1230048C Plane mounting circuit module
11/30/2005CN1230046C Wiring board, semiconductor device and method of producing, testing and mounting the same
11/30/2005CN1229870C Single transistor adopted high-density semiconductor memory unit and memory array
11/30/2005CN1229863C Semiconductor device, method of manufacture thereof, circuit board, and electronic device
11/30/2005CN1229862C Wiring base board and its producing method, electronic parts and electronic instrument
11/30/2005CN1229858C Semiconductor device, its production technique and detection method
11/30/2005CN1229856C Method for connecting integrated circuit with substrate and corresponding circuit configuration
11/30/2005CN1229854C Mounting device and structure for semiconductor component, electro-optical device and producing method thereof
11/30/2005CN1229827C High-frequency current inhibiting body of magnetic loss material displaying projected multiple magnetic inductivity property
11/30/2005CN1229817C Conducting metal particles, conducting composite metal particles and applied products using same
11/30/2005CN1229680C Display unit and liquid crystal display unit
11/30/2005CN1229209C Ceramic multi-layer substrate manufacturing method unfired composite multi-layer body
11/29/2005US6971081 Routing for reducing impedance distortions
11/29/2005US6971078 Semiconductor-device design method, semiconductor-device design program and semiconductor-device design apparatus
11/29/2005US6970794 Semiconductor having reduced configuration pins and method thereof
11/29/2005US6970485 Cooling device, semiconductor laser light source device, semiconductor laser source unit, method of manufacturing semiconductor laser light source unit and solid state laser device
11/29/2005US6970362 Electronic assemblies and systems comprising interposer with embedded capacitors
11/29/2005US6970360 Tamper-proof enclosure for a circuit card
11/29/2005US6970358 Stack up assembly
11/29/2005US6970355 Frame level partial cooling boost for drawer and/or node level processors
11/29/2005US6970354 Processor retention system and method
11/29/2005US6970231 Exposure apparatus and exposure method
11/29/2005US6970064 Center-tap transformers in integrated circuits
11/29/2005US6970053 Atomic layer deposition (ALD) high permeability layered magnetic films to reduce noise in high speed interconnection
11/29/2005US6969919 Semiconductor package production method and semiconductor package
11/29/2005US6969918 System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
11/29/2005US6969917 Electronic chip component with an integrated circuit and fabrication method
11/29/2005US6969916 Substrate having built-in semiconductor apparatus and manufacturing method thereof
11/29/2005US6969915 Semiconductor device, manufacturing method and apparatus for the same
11/29/2005US6969914 Electronic device package
11/29/2005US6969913 Semiconductor device and manufacturing method for the same
11/29/2005US6969912 Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
11/29/2005US6969911 dielectric tolerance of the wiring is improved by preventing diffusion of the wiring material; first insulating film containing grooves, plural wiring films formed protrusively, plural barrier films, first cap films, and a second cap film
11/29/2005US6969910 Semiconductor device, wiring board and method of making same
11/29/2005US6969909 Flip chip FET device
11/29/2005US6969908 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
11/29/2005US6969907 Cooling structure for multichip module
11/29/2005US6969906 Multi-chip package and method for manufacturing the same
11/29/2005US6969905 Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices
11/29/2005US6969904 Trimming pattern
11/29/2005US6969903 High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
11/29/2005US6969902 Integrated circuit having antenna proximity lines coupled to the semiconductor substrate contacts
11/29/2005US6969892 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit
11/29/2005US6969872 Thin film transistor array panel for liquid crystal display
11/29/2005US6969869 Programmable resistance memory element with indirect heating
11/29/2005US6969681 Method for fabricating a semiconductor component using contact printing
11/29/2005US6969680 Method for making shielded capacitor structure
11/29/2005US6969674 Structure and method for fine pitch flip chip substrate
11/29/2005US6969671 Semiconductor integrated device and method of fabrication thereof
11/29/2005US6969667 Electrical device and method of making
11/29/2005US6969654 Flash NVROM devices with UV charge immunity
11/29/2005US6969641 Method and system for integrated circuit packaging
11/29/2005US6969640 Air pocket resistant semiconductor package system
11/29/2005US6969639 Wafer level hermetic sealing method
11/29/2005US6969638 Low cost substrate for an integrated circuit device with bondpads free of plated gold
11/29/2005US6969637 Electronic semiconductor device having a thermal spreader
11/29/2005US6969636 Semiconductor package with stress inhibiting intermediate mounting substrate
11/29/2005US6969632 Method for fabricating image sensor semiconductor package
11/29/2005US6969554 Semiconductor sealing silicone composition and semiconductor device
11/29/2005US6969448 Method for forming a metallization structure in an integrated circuit
1 ... 1284 1285 1286 1287 1288 1289 1290 1291 1292 1293 1294 1295 1296 1297 1298 1299 1300 1301 1302 1303 1304 ... 2262