Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/01/2005US20050263900 Semiconductor device having silicon carbide and conductive pathway interface
12/01/2005US20050263899 Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
12/01/2005US20050263897 Reducing the migration of grain boundaries
12/01/2005US20050263896 Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device
12/01/2005US20050263895 Circuit device and manufacturing method thereof
12/01/2005US20050263894 Semiconductor chip with metallization levels, and a method for fomation of interconnect structrures
12/01/2005US20050263893 Chip structure and process for forming the same
12/01/2005US20050263892 Method of forming copper interconnection in semiconductor device and semiconductor device using the same
12/01/2005US20050263889 Semiconductor device
12/01/2005US20050263888 Integrated circuit assemblies and assembly methods
12/01/2005US20050263887 Circuit carrier and fabrication method thereof
12/01/2005US20050263886 Integrated circuit package with optimized mold shape
12/01/2005US20050263885 Semiconductor device
12/01/2005US20050263884 Multilayer printed wiring board and multilayer printed circuit board
12/01/2005US20050263883 Asymmetric bump structure
12/01/2005US20050263882 Semiconductor device and method of manufacturing the same
12/01/2005US20050263881 Semiconductor device
12/01/2005US20050263880 Circuit device and manufacturing method thereof
12/01/2005US20050263879 Patterned structure for a thermal interface
12/01/2005US20050263878 Cold weld hermetic MEMS package and method of manufacture
12/01/2005US20050263877 Laminated radiation member, power semiconductor apparatus, and method for producing the same
12/01/2005US20050263876 Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
12/01/2005US20050263874 Semiconductor package, method of production of same, and semiconductor device
12/01/2005US20050263873 Interposer substrate, semiconductor package and semiconductor device, and their producing methods
12/01/2005US20050263872 Flex-based circuit module
12/01/2005US20050263871 Method of fabricating semiconductor device and semiconductor device
12/01/2005US20050263870 High density 3-D integrated circuit package
12/01/2005US20050263869 Semiconductor device and manufacturing process therefor
12/01/2005US20050263868 Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
12/01/2005US20050263867 Intermediate substrate
12/01/2005US20050263866 Hermetic pacakging and method of manufacture and use therefore
12/01/2005US20050263865 IC chip package
12/01/2005US20050263864 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
12/01/2005US20050263863 Semiconductor device and a method of manufacturing the same
12/01/2005US20050263862 System and method for forming one or more integrated circuit packages using a flexible leadframe structure
12/01/2005US20050263861 Integrated circuit leadframe and fabrication method therefor
12/01/2005US20050263860 Semiconductor device and method for manufacturing the same
12/01/2005US20050263859 Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
12/01/2005US20050263858 Semiconductor device
12/01/2005US20050263857 Electronic device and method for fabricating the same
12/01/2005US20050263855 Integrated stress relief pattern and registration structure
12/01/2005US20050263849 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
12/01/2005US20050263847 Semiconductor device and method for fabricating the same
12/01/2005US20050263846 Circuit device
12/01/2005US20050263836 Fingerprint sensor package
12/01/2005US20050263833 Apparatus for evaluating amount of charge, method for fabricating the same, and method for evaluating amount of charge
12/01/2005US20050263822 Semiconductor device and manufacturing method thereof
12/01/2005US20050263812 Semiconductor memory device
12/01/2005US20050263811 Semiconductor device
12/01/2005US20050263810 Inspection substrate for display device
12/01/2005US20050263809 Ferroelectric memory and method of fabricating the same
12/01/2005US20050263796 Semiconductor device
12/01/2005US20050263793 Wire bonding method and apparatus for integrated circuit
12/01/2005US20050263786 Light emitting diode
12/01/2005US20050263776 Semiconductor light-emitting device and method for forming the same
12/01/2005US20050263760 Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
12/01/2005US20050263759 Semiconductor devices and method for manufacturing the same, semiconductor device modules, circuit substrates and electronic apparatuses
12/01/2005US20050263754 Substrates for growth of chemical compound semiconductors, chemical compound semiconductors using the substrates and processes for producing thereof
12/01/2005US20050263605 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
12/01/2005US20050263517 Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
12/01/2005US20050263489 Ruthenium silicide wet etch
12/01/2005US20050263482 Method of manufacturing circuit device
12/01/2005US20050263320 Circuit device and manufacturing method thereof
12/01/2005US20050263318 Structure for fixing an electronic device to a substrate
12/01/2005US20050263312 Moisture-resistant electronic device package and methods of assembly
12/01/2005US20050263311 Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
12/01/2005US20050263273 Electroformed microchannel cooler and methods of making same
12/01/2005US20050263268 Heat dissipation module with noise reduction
12/01/2005US20050263267 Cooling apparatus and method for manufacturing the same
12/01/2005US20050263265 Heat dissipating device with heat pipe
12/01/2005US20050263264 Heat sink mounting device
12/01/2005US20050263238 Placing a resin sheet in a surface recess or inner void in ceramic green sheets; laminating the sheets with the resin sheet in place; and firing the laminate, which decomposes the resin sheet; deformation and delamination in the recess or void site area is prevented
12/01/2005US20050262966 Generating an aerosol including a liquid comprising a nickel precursor and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy
12/01/2005DE19820319B4 Halbleiterbaustein Semiconductor device
12/01/2005DE102005020345A1 Dichtungsstruktur für einen Verbinder Sealing structure for a connector
12/01/2005DE102005018344A1 Schaltvorrichtung für rekonfigurierbare Zwischenverbindung und Verfahren zum Herstellen derselben Switching device for reconfigurable interconnect and method of making same
12/01/2005DE102005013687B3 ESD protective circuit for low voltages with two interconnected field effect transistors
12/01/2005DE102005007333A1 Multichip housing has housing substrate with two semiconductor shapes configured to be serially connected through a high speed communications protocol
12/01/2005DE102004034397A1 Bildsensormodul und Verfahren zum Herstellen eines Waferebenenpakets Image sensor module and method of manufacturing a wafer-level package
12/01/2005DE102004022724A1 Semiconductor element has cooling surface to couple with cooling body on a carrier pressed into a waveform
12/01/2005DE102004022596A1 Process to detect positional errors in photolithographic projections in semiconductor wafers with circuit patterns uses overlay measuring apparatus and projection simulation
12/01/2005DE102004022328A1 Controlling the temperature of a semiconductor chip, especially a DRAM, by provision of a heating resistance, temperature sensor and temperature regulation element
12/01/2005DE102004022178A1 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way
12/01/2005DE102004022177A1 Verfahren zur Herstellung eines Koplanarleitungssystem auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement zur Übertragung von elektromagnetischen Wellen A method for producing a Koplanarleitungssystem on a substrate and produced by such a process component for transmitting electromagnetic waves
12/01/2005DE102004022139A1 Verfahren zur Herstellung einer Spiralinduktivität auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement A method of manufacturing a spiral inductor on a substrate and produced by such a process component
12/01/2005DE102004021927A1 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module
12/01/2005DE102004021862A1 Current sensor has two lead frames each having a magnetic field sensor chip that are attached to the frame opposite one another
12/01/2005DE102004021810A1 Electronic component has cooling body thermally connected to insulating substrate by solder and metal foam layers
12/01/2005DE102004021633A1 Verfahren zum Verbinden eines Halbleiterchips mit einem Chipträger und Anordnung mit einem Halbleiterchip und einem Chipträger A method of connecting a semiconductor chip with a chip carrier assembly and having a semiconductor chip and a chip carrier
12/01/2005DE102004021122A1 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
12/01/2005DE102004020877A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
12/01/2005DE10014299B4 Chipverbund und Verfahren zu dessen Herstellung Chip composite and process for its preparation
11/2005
11/30/2005EP1601099A1 RF generator with phase controlled mosfets
11/30/2005EP1601098A1 RF generator with commutation inductor
11/30/2005EP1601097A1 RF generator with reduced size and weight
11/30/2005EP1601021A1 Lead frame and light receiving module comprising it
11/30/2005EP1601017A1 Multilayer printed wiring board
11/30/2005EP1601016A2 Apparatus in screw pressure contact with a power semiconductor module
11/30/2005EP1601015A1 Heatsink for power devices
11/30/2005EP1601014A1 Electronic component holder
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