Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/06/2005US6972218 Semiconductor device and fabricating method thereof
12/06/2005US6972217 Low k polymer E-beam printable mechanical support
12/06/2005US6972216 Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
12/06/2005US6972214 Method for fabricating a semiconductor package with multi layered leadframe
12/06/2005US6972210 Method for making a color image sensor with pad-to-pad soldered supporting substrate
12/06/2005US6972209 Stacked via-stud with improved reliability in copper metallurgy
12/06/2005US6972152 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
12/06/2005US6972097 Various strength of anisotropic magnetic fields; soft magentic powder in binder
12/06/2005US6971791 Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
12/06/2005US6971443 Thermal module with temporary heat storage
12/06/2005US6971442 Method and apparatus for dissipating heat from an electronic device
12/06/2005US6971441 Device and method for removing heat from object by spraying cooling agent
12/06/2005US6971243 Heat sink
12/06/2005US6971163 used for attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulation
12/06/2005US6971160 Hybrid electrical circuit method with mated substrate carrier method
12/01/2005WO2005115072A2 Support with solder globule elements and a method for assembly of substrates with globule contacts
12/01/2005WO2005115069A1 Ic socket
12/01/2005WO2005114750A1 Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers
12/01/2005WO2005114737A2 Illuminable gaas switching component with a transparent housing, and microwave circuit therewith
12/01/2005WO2005114733A1 System for shielding integrated circuits
12/01/2005WO2005114732A1 Semiconductor integrated circuit including metal mesh structure
12/01/2005WO2005114731A2 Double density method for wirebond interconnect
12/01/2005WO2005114730A1 Process for producing semiconductor device and semiconductor device
12/01/2005WO2005114729A1 Semiconductor device and wiring board
12/01/2005WO2005114728A1 Semiconductor device, wiring board and manufacturing method thereof
12/01/2005WO2005114727A2 Semiconductor die attachment for high vaccum tubes
12/01/2005WO2005114726A2 Stacked module systems and methods
12/01/2005WO2005114721A1 Encapsulation method and device which is intended, for example, for micromechanical devices
12/01/2005WO2005114084A1 Integrated circuit heat pipe heat spreader with through mounting holes
12/01/2005WO2005112583A2 Integrated ball and via package and formation process
12/01/2005WO2005112576A2 Method of bumping die pads for wafer testing
12/01/2005WO2005096379A3 System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
12/01/2005WO2005078769A3 Manufacturing integrated circuits
12/01/2005WO2005055278A3 Customized microelectronic device and method for making customized electrical interconnections
12/01/2005WO2005031860A3 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
12/01/2005WO2004100169A3 Mram architecture with a bit line located underneath the magnetic tunneling junction device
12/01/2005WO2004075254A3 Electronic component and method of manufacturing same
12/01/2005US20050268257 Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
12/01/2005US20050267237 Resin composition for encapsulating semiconductor chip and semiconductor device therewith
12/01/2005US20050267236 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics; minimizing electrical failure such as defective insulation due to a migration phenomenon
12/01/2005US20050266790 Air scoop cooler
12/01/2005US20050266699 Organosilicate polymer and insulating film therefrom
12/01/2005US20050266679 Barrier structure for semiconductor devices
12/01/2005US20050266677 Semiconductor device and method of manufacturing the same
12/01/2005US20050266675 Wafer-level thick film standing-wave clocking
12/01/2005US20050266674 Screen printing method of forming conductive bumps
12/01/2005US20050266673 Reduced electromigration and stressed induced migration of copper wires by surface coating
12/01/2005US20050266672 Wire-bonding method for chips with copper interconnects by introducing a thin layer
12/01/2005US20050266671 Manufacturing method of semiconductor device
12/01/2005US20050266670 Chip bonding process
12/01/2005US20050266669 Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
12/01/2005US20050266667 Structure and method of forming metal buffering layer
12/01/2005US20050266652 High density mimcap with a unit repeatable structure
12/01/2005US20050266650 Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same
12/01/2005US20050266624 Boron incorporated diffusion barrier material
12/01/2005US20050266618 Plasma processing method and method for fabricating electronic component module using the same
12/01/2005US20050266617 Module with multiple power amplifiers and power sensors
12/01/2005US20050266616 Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
12/01/2005US20050266614 Method of manufacturing semiconductor device and method of manufacturing electronic device
12/01/2005US20050266613 Integrated circuit packages with reduced stress on die and associated methods
12/01/2005US20050266612 Top layers of metal for high performance IC's
12/01/2005US20050266611 Flip chip packaging method and flip chip assembly thereof
12/01/2005US20050266610 Manufacturing methods for semiconductor structures having stacked semiconductor devices
12/01/2005US20050266609 Method of fabricating a built-in chip type substrate
12/01/2005US20050266608 Packaging substrate without plating bar and a method of forming the same
12/01/2005US20050266604 Integrated circuit socket corner relief
12/01/2005US20050266593 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
12/01/2005US20050266252 Low loss glass-ceramic materials, method of making same and electronic packages including same
12/01/2005US20050266251 Glass-ceramic materials and electronic packages including same
12/01/2005US20050266214 Wiring substrate and method of fabricating the same
12/01/2005US20050266212 Layered board and manufacturing method of the same, electronic apparatus having the layered board
12/01/2005US20050265410 Semiconductor laser diode package
12/01/2005US20050265100 Semiconductor device
12/01/2005US20050265001 Cooling system and projection-type image display apparatus using the same
12/01/2005US20050265000 Heat sink assembly with fixing devices
12/01/2005US20050264999 Heat sink attachment
12/01/2005US20050264998 Heat sink assembly
12/01/2005US20050264997 Method and apparatus for providing distributed fluid flows in a thermal management arrangement
12/01/2005US20050264994 [heat sink]
12/01/2005US20050264968 ESD protection module triggered by BJT punch-through
12/01/2005US20050264967 Esd protection designs with parallel lc tank for giga-hertz rf integrated circuits
12/01/2005US20050264966 Esd protection designs with parallel lc tank for giga-hertz rf integrated circuits
12/01/2005US20050264965 Semiconductor integrated circuit device and method for fabricating the same
12/01/2005US20050264963 Electrostatic discharge protective circuit and semiconductor integrated circuit using the same
12/01/2005US20050264862 Optical modulator module
12/01/2005US20050264788 Lithography apparatus and pattern forming method using the same
12/01/2005US20050264736 Substrate for display device, manufacturing method for same and display device
12/01/2005US20050264372 Integrated MMIC modules for millimeter and submillimeter wave system applications
12/01/2005US20050264352 Integrated power amplifier module with power sensor
12/01/2005US20050264307 Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
12/01/2005US20050263911 Circuit device and manufacturing method thereof
12/01/2005US20050263910 Semiconductor integrated circuit device
12/01/2005US20050263909 Semiconductor device
12/01/2005US20050263908 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
12/01/2005US20050263907 Method of manufacturing semiconductor device and support structure for semiconductor substrate
12/01/2005US20050263906 Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier
12/01/2005US20050263905 Method for manufacturing circuit device
12/01/2005US20050263904 Structure of dummy pattern in semiconductor device
12/01/2005US20050263903 forming an adhesion layer in contact with a substrate and electricoconductive surface layers using electrophotoghic imaging masks, to improve lamination, and increase the reliability and quality of electronic circuits
12/01/2005US20050263901 Semiconductor device formed by in-situ modification of dielectric layer and related methods
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