Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/07/2005CN1705122A Semiconductor device
12/07/2005CN1705121A ESD protection circuit and its control method
12/07/2005CN1705120A Chip protector and relevant method
12/07/2005CN1705119A Wafer structure having capacitance elements and method for forming capacitance elements on the wafer
12/07/2005CN1705118A Ultraviolet blocking layer
12/07/2005CN1705117A Semiconductor integrated circuit device
12/07/2005CN1705116A Semiconductor device
12/07/2005CN1705115A Wire rack packaging structure and manufacturing method thereof
12/07/2005CN1705114A Forktooth shaped cooling fin type heat pipe radiator
12/07/2005CN1705113A Split integrated heat pipe radiator for heating electronic component
12/07/2005CN1705112A Heat pipe radiating unit and manufacturing method thereof
12/07/2005CN1705111A Cooling system and projection-type image display apparatus using the same
12/07/2005CN1705110A Semiconductor encapsulating epoxy resin composition and semiconductor device
12/07/2005CN1705109A Device mounting board and semiconductor apparatus using the same
12/07/2005CN1705108A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705107A Circuit device
12/07/2005CN1705106A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705105A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705104A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705103A Integrated circuit package product with rubber filled conductor substrate
12/07/2005CN1705102A 半导体器件 Semiconductor devices
12/07/2005CN1705100A Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
12/07/2005CN1705099A 半导体器件 Semiconductor devices
12/07/2005CN1705096A Short detection circuit and short detection method
12/07/2005CN1705092A Method of fabricating a built-in chip type substrate
12/07/2005CN1705085A Method of manufacturing circuit device
12/07/2005CN1705081A Semiconductor device
12/07/2005CN1705080A 半导体器件 Semiconductor devices
12/07/2005CN1705076A Method of forming semiconductor parts and semiconductor parts
12/07/2005CN1231108C Cooling device for electric and/or electronic unit
12/07/2005CN1231106C Shunt power connector for integrated circuit package
12/07/2005CN1231104C Electrical component and connecting device and equipment including circuit module and at least one electrical component
12/07/2005CN1230901C Semiconductor device
12/07/2005CN1230900C Screen pattern medium layer and structure for protecting component under contact pad
12/07/2005CN1230898C Improved interconnection of devices
12/07/2005CN1230897C Semiconductor capsulation structure and its mfg. method
12/07/2005CN1230896C Method for producing portable electronic device with integrated circuit protected by photosensitive resin
12/07/2005CN1230895C Semiconductor package assembly with central lead and its packaging method
12/07/2005CN1230894C Semiconductor package and making method thereof
12/07/2005CN1230893C Moulded resin package with cavity structure
12/07/2005CN1230887C Method of manufacturing a semi conductor device having a porous dielectric layer and air gaps
12/07/2005CN1230882C Method of mfg. semiconductor device, and semiconductor device
12/07/2005CN1230483C Adhesive for bonding circuit members, circuit board, and method of producing same
12/06/2005US6973634 IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout
12/06/2005US6973205 Scratch-resistant coating for a semiconductor component
12/06/2005US6972965 Method for integrated high Q inductors in FCGBA packages
12/06/2005US6972964 Module board having embedded chips and components and method of forming the same
12/06/2005US6972963 Electronic apparatus having structure for protecting flexible printed circuit and chip thereon
12/06/2005US6972959 Heat dissipating device for electronic components of electronic control devices
12/06/2005US6972958 Multiple integrated circuit package module
12/06/2005US6972955 microelectromechanical systems; printed circuits and low temperature co-fired ceramics as interconnects; reliability, heat resistance, high density
12/06/2005US6972954 Liquid cooling system and personal computer using the same
12/06/2005US6972950 Method and apparatus for cooling a portable computer
12/06/2005US6972943 Electronic component having lead frame
12/06/2005US6972840 Method of reducing process plasma damage using optical spectroscopy
12/06/2005US6972658 Differential inductor design for high self-resonance frequency
12/06/2005US6972635 MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein
12/06/2005US6972627 High frequency power amplifier module
12/06/2005US6972612 Semiconductor device with malfunction control circuit and controlling method thereof
12/06/2005US6972579 Wafer integrated plasma probe assembly array
12/06/2005US6972576 Electrical critical dimension measurement and defect detection for reticle fabrication
12/06/2005US6972497 protective device; a ring fastened to the front face of the chip, around and at some distance from the optical sensor, an encapsulation material surrounding the chip; electrically connecting the integrated circuit chip to a support plate
12/06/2005US6972496 Chip-scaled package having a sealed connection wire
12/06/2005US6972495 Compliant package with conductive elastomeric posts
12/06/2005US6972494 Integrated circuit die for wire bonding and flip-chip mounting
12/06/2005US6972493 Semiconductor integrated circuit having reduced cross-talk noise
12/06/2005US6972491 Semiconductor device including multi-layered interconnection and method of manufacturing the device
12/06/2005US6972490 containing a stopper structure and a protection layer; a elastic polymer bump, a metal layer and a conductive layer; stopper prevents the compliant bump from cracking during bonding, retains conductive particles
12/06/2005US6972489 Flip chip package with thermometer
12/06/2005US6972488 Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin
12/06/2005US6972487 Multi chip package structure having a plurality of semiconductor chips mounted in the same package
12/06/2005US6972484 Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface
12/06/2005US6972483 Semiconductor package with improved thermal emission property
12/06/2005US6972482 Electronic package having a folded flexible substrate and method of manufacturing the same
12/06/2005US6972481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
12/06/2005US6972480 Methods and apparatus for packaging integrated circuit devices
12/06/2005US6972479 Package with stacked substrates
12/06/2005US6972477 Circuit device with conductive patterns separated by insulating resin-filled grooves
12/06/2005US6972474 Semiconductor device having a fuse and a low heat conductive section for blowout of fuse
12/06/2005US6972464 Power MOSFET
12/06/2005US6972463 Multi-finger transistor
12/06/2005US6972462 Compact high voltage ESD protection diode
12/06/2005US6972453 Method of manufacturing a semiconductor device capable of etching a multi-layer of organic films at a high selectivity
12/06/2005US6972451 Trench capacitor in a substrate with two floating electrodes independent from the substrate
12/06/2005US6972445 Input/output structure and integrated circuit using the same
12/06/2005US6972444 Wafer with saw street guide
12/06/2005US6972434 Substrate for display, method of manufacturing the same and display having the same
12/06/2005US6972427 Switching device for reconfigurable interconnect and method for making the same
12/06/2005US6972381 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
12/06/2005US6972372 Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
12/06/2005US6972268 Methods and systems for processing a device, methods and systems for modeling same and the device
12/06/2005US6972263 Fabricating a tapered hole incorporating a resinous silicon containing film
12/06/2005US6972254 Manufacturing a conformal atomic liner layer in an integrated circuit interconnect
12/06/2005US6972253 Method for forming dielectric barrier layer in damascene structure
12/06/2005US6972251 Method for fabricating copper damascene structures in porous dielectric materials
12/06/2005US6972249 Use of nitrides for flip-chip encapsulation
12/06/2005US6972244 Marking semiconductor devices through a mount tape
12/06/2005US6972243 Fabrication of semiconductor dies with micro-pins and structures produced therewith
12/06/2005US6972223 Use of atomic oxygen process for improved barrier layer
12/06/2005US6972220 Structures and methods of anti-fuse formation in SOI