Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/08/2005US20050269709 Interconnect structure including tungsten nitride and a method of manufacture therefor
12/08/2005US20050269707 Transparent conductive film
12/08/2005US20050269706 Metal interconnects for image sensors
12/08/2005US20050269705 Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
12/08/2005US20050269704 Semiconductor device and manufacturing method of the same
12/08/2005US20050269703 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS
12/08/2005US20050269702 Method for fabricating semiconductor device capable of scribing chips with high yield
12/08/2005US20050269701 Semiconductor device
12/08/2005US20050269700 Semiconductor component and system having thinned, encapsulated dice
12/08/2005US20050269698 Semiconductor device having adhesion increasing film and method of fabricating the same
12/08/2005US20050269697 Semiconductor device, circuit board, and electronic instrument
12/08/2005US20050269696 Semiconductor device and manufacturing method of the same
12/08/2005US20050269695 Surface-mount chip-scale package
12/08/2005US20050269694 Ribbon bonding in an electronic package
12/08/2005US20050269693 Assembly including vertical and horizontal joined circuit panels
12/08/2005US20050269692 Stacked semiconductor package having adhesive/spacer structure and insulation
12/08/2005US20050269691 Counter flow micro heat exchanger for optimal performance
12/08/2005US20050269690 Ball grid array housing having a cooling foil
12/08/2005US20050269689 Conductor device and method of manufacturing thereof
12/08/2005US20050269688 Microelectromechanical systems (MEMS) devices integrated in a hermetically sealed package
12/08/2005US20050269687 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
12/08/2005US20050269685 Buried array capacitor and microelectronic structure incorporating the same
12/08/2005US20050269684 Semiconductor package including redistribution pattern and method of manufacturing the same
12/08/2005US20050269683 High-voltage module and method for producing same
12/08/2005US20050269682 Carrier for stacked type semiconductor device and method of fabricating the same
12/08/2005US20050269681 Component built-in module and method for producing the same
12/08/2005US20050269680 System-in-package (SIP) structure and fabrication thereof
12/08/2005US20050269679 Supporting frame for surface-mount diode package
12/08/2005US20050269678 Package for sealing an integrated circuit die
12/08/2005US20050269677 Preparation of front contact for surface mounting
12/08/2005US20050269676 Adhesive/spacer island structure for stacking over wire bonded die
12/08/2005US20050269675 Internal package heat dissipator
12/08/2005US20050269674 Semiconductor equipment having multiple semiconductor devices and multiple lead frames
12/08/2005US20050269673 Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same
12/08/2005US20050269672 Gate stack and gate stack etch sequence for metal gate integration
12/08/2005US20050269670 Semiconductor device and fabrication method thereof
12/08/2005US20050269668 Method and structure for forming relatively dense conductive layers
12/08/2005US20050269666 Electrical fuses as programmable data storage
12/08/2005US20050269665 Three dimensional integrated circuits
12/08/2005US20050269660 Voltage booster transistor
12/08/2005US20050269659 Esd performance using separate diode groups
12/08/2005US20050269657 On chip transformer isolator
12/08/2005US20050269647 Flip chip FET device
12/08/2005US20050269641 Electrostatic protection circuit
12/08/2005US20050269590 Semiconductor device
12/08/2005US20050269589 Power LED package module
12/08/2005US20050269571 Method of forming thin-film transistor devices with electro-static discharge protection
12/08/2005US20050269567 Test key for monitoring gate conductor to deep trench misalignment
12/08/2005US20050269287 Multilayer electronic component and method for producing the same
12/08/2005US20050269128 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
12/08/2005US20050269118 EMI gasket
12/08/2005US20050269065 Heat pipe with hydrophilic layer and/or protective layer and method for making same
12/08/2005US20050269063 Heat pipe having a wick structure containing phase change materials
12/08/2005US20050269061 Apparatus and method of efficient fluid delivery for cooling a heat producing device
12/08/2005US20050269060 Heat dissipation device assembly with fan cover
12/08/2005DE202005013750U1 Led-gehäuse Led housing
12/08/2005DE19702532B4 Chipkarte und Verfahren zum Erzeugen von Anschlußkontakten auf zwei Hauptoberflächen Chip card and method for generating connection contacts on two major surfaces
12/08/2005DE10332096B4 Kühlanordnung zur Kühlung eines wärmeerzeugenden Bauteils Cooling means for cooling a heat generating component
12/08/2005DE102005021513A1 Abschirmvorrichtung für ein elektronisches, funktechnisches Modul Screening device for an electronic, funk technical module
12/08/2005DE102005006086A1 Verfahren zur Erkennung von Chipfehlpositionen Method for detecting faulty chip positions
12/08/2005DE102004062472A1 Fabrication of metal interconnection line in semiconductor device by nitriding the metal layer to form a barrier metal layer, and forming metal interconnection line on barrier metal layer by burying the contact openings
12/08/2005DE102004022884A1 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing
12/08/2005DE102004021541A1 Passivierung von Brennstrecken Passivation of focal distances
12/08/2005DE102004005255B4 Verfahren zum Anordnen einer Leitungsstruktur mit Nanoröhren auf einem Substrat A method of disposing a line structure with nanotubes on a substrate
12/08/2005DE10019489B4 Gehäuse für ein oberflächenmontierbares elektronisches Bauelement A housing for a surface-mountable electronic component
12/08/2005CA2508190A1 Process for producing a flat panel radiation detector and a flat panel radiation detector
12/07/2005EP1603380A2 Electronic device cooling apparatus, electronic device cooling system and method for cooling electronic device
12/07/2005EP1603374A1 Method and device for mounting conductive ball
12/07/2005EP1603231A1 RF generator with voltage regulator
12/07/2005EP1603163A2 Three-dimensional semiconductor device
12/07/2005EP1603160A2 Semiconductor integrated circuit device
12/07/2005EP1603159A2 Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
12/07/2005EP1603158A1 Printed wiring board, method for manufacturing same, lead frame package and optical module
12/07/2005EP1603157A1 Vertical conduction power electronic device package and corresponding assembling method
12/07/2005EP1603155A1 Semiconductor device and radiation detector employing it
12/07/2005EP1602979A2 Lithography apparatus and pattern forming method using the same
12/07/2005EP1602750A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY
12/07/2005EP1602749A1 Metal photo-etching product and production method therefor
12/07/2005EP1602714A1 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
12/07/2005EP1602265A2 Solder on a sloped surface
12/07/2005EP1602155A2 Integrated thermal sensor for optoelectronic modules
12/07/2005EP1602131A1 Via and trench structures for semiconductor substrates bonded to metallic substrates
12/07/2005EP1602130A2 Lead frame with included passive devices
12/07/2005EP1602129A1 Split fin heat sink
12/07/2005EP1601739A1 Electronic device containing thermal interface material
12/07/2005EP1601631A1 Method for producing a composite material
12/07/2005EP1601630A1 Heat sink having a high thermal conductivity
12/07/2005EP1430525B1 Dual-damascene interconnects without an etch stop layer by alternating ilds
12/07/2005EP1260125A4 Thermal management system
12/07/2005EP0878024B1 Adaptable mmic array
12/07/2005CN2745219Y A four-faced flat packaging structure
12/07/2005CN2745218Y Improved structure of heat collector
12/07/2005CN2745217Y IC wafer package
12/07/2005CN1706041A Method for producing a stepped edge profile comprised of a layered construction
12/07/2005CN1706040A Non-contact ID card and the like and method for manufacturing same
12/07/2005CN1706039A Backside contact for integrated circuit and method of forming same
12/07/2005CN1705177A Optical modulator module
12/07/2005CN1705129A Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same
12/07/2005CN1705124A Semiconductor device and method of fabricating the same
12/07/2005CN1705123A Semiconductor device
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