Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/16/2014CN102468284B Stacked semiconductor device and method for manufacturing same
04/16/2014CN102420211B Image sensor package structure of micro salient point interconnection structure and realization method of image sensor package structure
04/16/2014CN102412237B Protective device of low voltage structure for high voltage electrostatic discharge protection
04/16/2014CN102412230B Inductance ground shielding structure for radio frequency process
04/16/2014CN102341905B Semiconductor integrated circuit device and method for designing same
04/16/2014CN102339706B Tube baking machine
04/16/2014CN102299085B Packaged semiconductor device having improved locking properties
04/16/2014CN102299082B Producing method of semiconductor bearing element and producing method of package using the semiconductor bearing element
04/16/2014CN102298265B Photoetching dielectric compositions and electrical or electronic device
04/16/2014CN102263085B Packaging structure and process
04/16/2014CN102237343B Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package
04/16/2014CN102231313B Multilayer stacked inductance utilizing parallel connection of metals
04/16/2014CN102208369B Wire bonding structure of semiconductor device and wire bonding method
04/16/2014CN102201386B QFN semiconductor package and fabricating method thereof
04/16/2014CN102171823B Analyte sensors, testing apparatus and manufacturing methods
04/16/2014CN102159357B Method of manufacturing heat transfer plate
04/16/2014CN102023401B TFT-LCD array substrate and method for manufacturing the same
04/16/2014CN101719486B Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
04/16/2014CN101624514B Heat-conductive silicone composition
04/16/2014CN101127344B Integrated circuit (IC) package and stacking IC packages device and manufacture method
04/15/2014US8701068 Interconnection device in a multi-layer shielding mesh
04/15/2014US8699257 Three-dimensional writable printed memory
04/15/2014US8698327 Substrate handler
04/15/2014US8698326 Semiconductor package and fabrication method thereof
04/15/2014US8698325 Integrated circuit package and physical layer interface arrangement
04/15/2014US8698324 Dicing tape-integrated film for semiconductor back surface
04/15/2014US8698322 Adhesive-bonded substrates in a multi-chip module
04/15/2014US8698321 Vertically stackable dies having chip identifier structures
04/15/2014US8698320 Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
04/15/2014US8698319 Electronic component
04/15/2014US8698317 Methods of fabricating package stack structure and method of mounting package stack structure on system board
04/15/2014US8698316 Chip package
04/15/2014US8698315 Semiconductor device
04/15/2014US8698314 Semiconductor wiring patterns
04/15/2014US8698313 Nonvolatile semiconductor memory apparatus
04/15/2014US8698312 Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging
04/15/2014US8698311 Package substrate and semiconductor package including the same
04/15/2014US8698309 Semiconductor device
04/15/2014US8698307 Semiconductor package with integrated metal pillars and manufacturing methods thereof
04/15/2014US8698306 Substrate contact opening
04/15/2014US8698305 Multi-configuration GPU interface device
04/15/2014US8698304 Multi-chip package with spacer for blocking interchip heat transfer
04/15/2014US8698303 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
04/15/2014US8698302 Power switching assembly having a robust gate connection
04/15/2014US8698301 Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
04/15/2014US8698300 Chip-stacked semiconductor package
04/15/2014US8698299 Semiconductor device with wiring substrate including lower conductive pads and testing conductive pads
04/15/2014US8698298 Laminate electronic device
04/15/2014US8698297 Integrated circuit packaging system with stack device
04/15/2014US8698296 Semiconductor device
04/15/2014US8698295 Super high-density module with integrated wafer level packages
04/15/2014US8698294 Integrated circuit package system including wide flange leadframe
04/15/2014US8698293 Multi-chip package and method of manufacturing thereof
04/15/2014US8698291 Packaged leadless semiconductor device
04/15/2014US8698290 LED lamp
04/15/2014US8698289 Semiconductor device, a method of manufacturing the same and an electronic device
04/15/2014US8698288 Flexible substrate with crimping interconnection
04/15/2014US8698287 Semiconductor device
04/15/2014US8698283 Substrate for semiconductor package and semiconductor package having the same
04/15/2014US8698279 Semiconductor device including capacitor of interconnection
04/15/2014US8698277 Nonvolatile variable resistance device having metal halogen or metal sulfide layer
04/15/2014US8698276 Semiconductor device having a plurality of repair fuse units
04/15/2014US8698275 Electronic circuit arrangement with an electrical fuse
04/15/2014US8698261 Co/Ni multilayers with improved out-of-plane anisotropy for magnetic device applications
04/15/2014US8698247 Semiconductor device
04/15/2014US8698246 High-voltage oxide transistor and method of manufacturing the same
04/15/2014US8698204 Semiconductor memory device
04/15/2014US8698184 Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
04/15/2014US8698169 Organic light emitting diode display
04/15/2014US8698156 Laminating system
04/15/2014US8698141 Solid state image pickup device and manufacturing method of solid state image pickup device, and image pickup apparatus
04/15/2014US8698140 Semiconductor device, and test method for same
04/15/2014US8698139 Die-to-die power consumption optimization
04/15/2014US8697803 Epoxy resin composition and semiconductor device
04/15/2014US8697569 Non-lithographic formation of three-dimensional conductive elements
04/15/2014US8697566 Bump structure and manufacturing method thereof
04/15/2014US8697538 Method of forming pattern in substrate
04/15/2014US8697491 Semiconductor package and method of fabricating the same
04/15/2014US8696942 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
04/15/2014US8695687 Hybrid pin-fin micro heat pipe heat sink and method of fabrication
04/15/2014US8695212 Method for optimizing routing layers and board space requirements for a ball grid array land pattern
04/10/2014WO2014055777A1 Electrostatic protection for stacked multi-chip integrated circuits
04/10/2014WO2014055542A1 Mems pressure sensor assembly
04/10/2014WO2014055323A1 Device and method for temperature control
04/10/2014WO2014055315A1 Hydrogen mitigation schemes in the passivation of advanced devices
04/10/2014WO2014054842A1 Heat sink comprising metal mesh layer, and method for manufacturing same
04/10/2014WO2014054609A1 Semiconductor circuit board, semiconductor device using same, and method for producing semiconductor circuit board
04/10/2014WO2014054576A1 Semiconductor substrate cleaning method and cleaning system
04/10/2014WO2014054212A1 Semiconductor device and manufacturing method therefor
04/10/2014WO2014053091A1 Monolithic optical packages and methods using aluminum nitride
04/10/2014WO2014020479A3 Post-cmos processing and 3d integration based on dry-film lithography
04/10/2014WO2014015316A3 Thermal management of tightly integrated semiconductor device, system and/or package
04/10/2014WO2014011612A3 Non-circular under bump metallization (ubm) structure, orientation of non-circular ubm structure and trace orientation to inhibit peeling and/or cracking
04/10/2014WO2014008891A3 Metal-ceramic substrate
04/10/2014US20140099770 Semiconductor Device and a Method of Manufacturing the Same and Designing the Same
04/10/2014US20140099755 Fabrication method of stacked package structure
04/10/2014US20140099754 Compliant interconnects in wafers
04/10/2014US20140099753 Techniques for packaging multiple device components
04/10/2014US20140098507 Printed circuit board, semiconductor package using the same, and method for manufacturing the printed circuit board and the semiconductor package
04/10/2014US20140097891 Reconfiguring through silicon vias in stacked multi-die packages
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