Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2015
03/04/2015EP2842162A1 Integrated electronics module with cooling structure
03/04/2015EP2842161A1 Thermal management of integrated circuits using phase change material and heat spreaders
03/04/2015EP2842080A1 Production of a portable data storage medium
03/03/2015US8971836 Method of adjusting the receive frequency of an RF receiver die
03/03/2015US8971087 Stacked memory with interface providing offset interconnects
03/03/2015US8971056 Hermetically sealed radio-frequency front end
03/03/2015US8971054 Component assembly
03/03/2015US8971053 Wiring board and method for manufacturing the same
03/03/2015US8971037 Cooling apparatus and display device having the same
03/03/2015US8971014 Protection structure for metal-oxide-metal capacitor
03/03/2015US8971013 Electronic devices with floating metal rings
03/03/2015US8970516 Integrated passives and power amplifier
03/03/2015US8970247 Semiconductor integrated circuit device with protection against tampering
03/03/2015US8970172 Battery heating circuits and methods with resonance components in series using voltage inversion and freewheeling circuit components
03/03/2015US8970052 Semiconductor device stack with bonding layer and wire retaining member
03/03/2015US8970051 Solution to deal with die warpage during 3D die-to-die stacking
03/03/2015US8970050 Semiconductor memory device including alignment key structures
03/03/2015US8970049 Multiple chip package module having inverted package stacked over die
03/03/2015US8970048 Interconnect structure for high frequency signal transmissions
03/03/2015US8970047 Method for creating a 3D stacked multichip module
03/03/2015US8970046 Semiconductor packages and methods of forming the same
03/03/2015US8970045 Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devices
03/03/2015US8970044 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
03/03/2015US8970043 Bonded stacked wafers and methods of electroplating bonded stacked wafers
03/03/2015US8970042 Circuit board, comprising a core insulation film
03/03/2015US8970041 Co-axial restraint for connectors within flip-chip packages
03/03/2015US8970040 Contact structure and forming method
03/03/2015US8970039 Integrated circuit devices including electrode support structures and methods of fabricating the same
03/03/2015US8970038 Semiconductor substrate and method of fabricating the same
03/03/2015US8970037 Terminal structure, and semiconductor element and module substrate comprising the same
03/03/2015US8970036 Stress relieving second level interconnect structures and methods of making the same
03/03/2015US8970035 Bump structures for semiconductor package
03/03/2015US8970034 Semiconductor assemblies and structures
03/03/2015US8970033 Extending metal traces in bump-on-trace structures
03/03/2015US8970032 Chip module and method for fabricating a chip module
03/03/2015US8970031 Semiconductor die terminal
03/03/2015US8970030 Electronic assembly and method for producing same
03/03/2015US8970029 Thermally enhanced heat spreader for flip chip packaging
03/03/2015US8970028 Embedded heat spreader for package with multiple microelectronic elements and face-down connection
03/03/2015US8970027 Metallization mixtures and electronic devices
03/03/2015US8970026 Methods and structures for reducing stress on die assembly
03/03/2015US8970025 Stacked packages having through hole vias
03/03/2015US8970024 Packages with molding material forming steps
03/03/2015US8970023 Package structure and methods of forming same
03/03/2015US8970022 Organic light emitting device and manufacturing method thereof
03/03/2015US8970021 Thermally enhanced semiconductor package
03/03/2015US8970020 Semiconductor device
03/03/2015US8970019 Semiconductor device with sealed semiconductor chip
03/03/2015US8970018 Differential excitation of ports to control chip-mode mediated crosstalk
03/03/2015US8970017 High frequency monolithic microwave integrated circuit connection
03/03/2015US8970015 Method for protecting a gate structure during contact formation
03/03/2015US8970012 Semiconductor device, fabrication process, and electronic device
03/03/2015US8970011 Method and structure of forming backside through silicon via connections
03/03/2015US8970010 Wafer-level die attach metallization
03/03/2015US8970009 Semiconductor device and semiconductor wafer
03/03/2015US8970008 Wafer and integrated circuit chip having a crack stop structure
03/03/2015US8970007 Semiconductor device and process for producing semiconductor device
03/03/2015US8970006 Vertical conductive connections in semiconductor substrates
03/03/2015US8970002 Metal oxide metal capacitor structures
03/03/2015US8970001 Guard ring design for maintaining signal integrity
03/03/2015US8970000 Signal transmission arrangement
03/03/2015US8969999 Fin-like field effect transistor (FinFET) based, metal-semiconductor alloy fuse device and method of manufacturing same
03/03/2015US8969998 NAND type nonvolatile semiconductor memory device and method for manufacturing same
03/03/2015US8969985 Semiconductor chip package and method
03/03/2015US8969981 Sensor package
03/03/2015US8969968 ESD protection structure and semiconductor device comprising the same
03/03/2015US8969960 Power semiconductor device
03/03/2015US8969957 LDMOS one-time programmable device
03/03/2015US8969954 Semiconductor device having plurality of peripheral trenches in peripheral region around cell region
03/03/2015US8969937 Semiconductor device
03/03/2015US8969931 Semiconductor devices with screening coating to inhibit dopant deactivation
03/03/2015US8969923 Methods and apparatus for layout of three dimensional matrix array memory for reduced cost patterning
03/03/2015US8969919 Field-effect transistor
03/03/2015US8969915 Methods of manufacturing the gallium nitride based semiconductor devices
03/03/2015US8969914 ESD power clamp with stable power start up function
03/03/2015US8969910 Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device
03/03/2015US8969888 Flat panel display apparatus and method of manufacturing the same
03/03/2015US8969879 Solid state image pickup device and method of producing solid state image pickup device
03/03/2015US8969870 Pattern for ultra-high voltage semiconductor device manufacturing and process monitoring
03/03/2015US8969869 Integrated circuit wafer and integrated circuit die
03/03/2015US8969739 Semiconductor device
03/03/2015US8969733 High power RF circuit
03/03/2015US8969478 Curable composition
03/03/2015US8969219 UV-curable inorganic-organic hybrid resin and method for preparation thereof
03/03/2015US8969207 Methods of forming a masking layer for patterning underlying structures
03/03/2015US8969196 Semiconductor devices and methods of manufacturing the same
03/03/2015US8969194 Backside illuminated image sensor and manufacturing method thereof
03/03/2015US8969193 Method of producing a semiconductor device having an interconnect through the substrate
03/03/2015US8969191 Mechanisms for forming package structure
03/03/2015US8969176 Laminated transferable interconnect for microelectronic package
03/03/2015US8969141 Programmable poly fuse using a P-N junction breakdown
03/03/2015US8969140 Embedded semiconductive chips in reconstituted wafers, and systems containing same
03/03/2015US8969139 Lead frame array package with flip chip die attach
03/03/2015US8969138 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
03/03/2015US8969137 Solder flow-impeding plug on a lead frame
03/03/2015US8969136 Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof
03/03/2015US8969135 Semiconductor device and method of assembling same
03/03/2015US8969134 Laser ablation tape for solder interconnect formation
03/03/2015US8969133 Package-on-package assembly with wire bonds to encapsulation surface
03/03/2015US8969132 Device package and methods for the fabrication thereof
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