Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/13/2005US6974604 Method of self-latching for adhesion during self-assembly of electronic or optical components
12/13/2005US6974558 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact
12/13/2005US6974069 Solder ball attaching system and method
12/13/2005US6973962 Radiator with airflow guiding structure
12/13/2005US6973801 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
12/13/2005US6973719 Method of making a thermal management for a circuit board panel
12/13/2005US6973717 Method for producing a semiconductor device in chip format
12/08/2005WO2005117510A1 Multilayer printed wiring board
12/08/2005WO2005117153A1 Thermoelectric converter and its manufacturing method
12/08/2005WO2005117129A1 Improved dielectric passivation for semiconductor devices
12/08/2005WO2005117116A1 Semiconductor device
12/08/2005WO2005117115A1 Chips with useful lines and dummy lines
12/08/2005WO2005117114A2 Programming semiconductor dies for pin map compatibility
12/08/2005WO2005117113A1 Switching element and method for protecting a circuit comprising a load
12/08/2005WO2005117112A1 Lead frame for semiconductor device
12/08/2005WO2005117111A2 Adhesive/spacer island structure for multiple die package
12/08/2005WO2005117110A1 Packaged integrated circuit with mlp leadframe and method of making same
12/08/2005WO2005117109A1 Chip having two groups of chip contacts
12/08/2005WO2005117108A1 A cooling arrangement
12/08/2005WO2005117107A2 Power semiconductor module and method for cooling a power semiconductor module
12/08/2005WO2005117106A2 Heat sink assembly
12/08/2005WO2005117096A1 Circuit module manufacturing method and circuit module manufactured by the method
12/08/2005WO2005117094A1 Plasma processing method and method for fabricating electronic component module using the same
12/08/2005WO2005117092A2 Stacked semiconductor package having adhesive/spacer structure and insulation
12/08/2005WO2005116920A1 Secure electronic entity such as a passport
12/08/2005WO2005116300A1 External palladium plating structure of semiconductor component and semiconductor device manufacturing method
12/08/2005WO2005116104A1 Semiconductor sealing resin composition and semiconductor device
12/08/2005WO2005115943A2 Preparation of cement films by strip casting
12/08/2005WO2005115911A1 Nanotube position controlling method, nanotube position controlling flow path pattern and electronic element using nanotube
12/08/2005WO2005115742A2 Improved thermal interface material
12/08/2005WO2005098940A3 Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
12/08/2005WO2005098939A3 Combination insulator and organic semiconductor formed from self-assembling block co-polymers
12/08/2005WO2005098402A3 High throughput measurement of via defects in interconnects
12/08/2005WO2005081757A3 A novel thin laminate as embedded capacitance material in printed circuit boards
12/08/2005WO2005038861B1 High density integrated circuit package architecture
12/08/2005WO2005010452A3 Thermal diffusion apparatus
12/08/2005WO2005002032A3 Integrated circuit devices having on-chip adaptive bandwidth buses and related methods
12/08/2005US20050273744 Ic tiling pattern method, ic so formed and analysis method
12/08/2005US20050273680 Semiconductor device having buffer layer pattern and method of forming same
12/08/2005US20050273208 Electronic device cooling apparatus and method for cooling electronic device with temperature prediction
12/08/2005US20050272896 Resin composition for sealing light emitting device
12/08/2005US20050272893 A polysiloxane with at least one alkenyl group; a polysiloxane at least one silicon-bonded hydrogen; platinum-containing catalyst; and an additive that may be a crosslinking retarder; can be cured even at low temperatures; cured product has no surface wrinkling; excellent storage stability
12/08/2005US20050272399 Radio-frequency circuit module and radio communication apparatus
12/08/2005US20050272378 Spread spectrum isolator
12/08/2005US20050272341 Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
12/08/2005US20050272307 Mounting element
12/08/2005US20050272282 Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
12/08/2005US20050272257 Semiconductor device with reduced contact resistance
12/08/2005US20050272256 Semiconductor device and fabricating method thereof
12/08/2005US20050272253 Method for alloy-electroplating group IB metals with refractory metals for interconnections
12/08/2005US20050272252 Circuit device
12/08/2005US20050272250 Method of forming self-aligned contact and method of manufacturing semiconductor memory device by using the same
12/08/2005US20050272248 Low-k dielectric structure and method
12/08/2005US20050272247 Substrate processing method and fabrication process of a semiconductor device
12/08/2005US20050272246 Integrated capacitor for RF applications
12/08/2005US20050272244 Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
12/08/2005US20050272243 Method of manufacturing semiconductor device
12/08/2005US20050272242 Formation method for conductive bump
12/08/2005US20050272226 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
12/08/2005US20050272221 Method of reducing alignment measurement errors between device layers
12/08/2005US20050272218 Method of forming metal lower electrode of a capacitor and method of selectively etching a metal layer for the same
12/08/2005US20050272182 Methods of making microelectronic packages
12/08/2005US20050272181 Process for producing a flat panel radiation detector and a flat panel radiation detector
12/08/2005US20050272174 Test structures in unused areas of semiconductor integrated circuits and methods for designing the same
12/08/2005US20050271884 Applying polysiloxane, hydrosilylation catalyst, fluoroorganosilicone, and adhesion promoter on electronic substrate, attaching semiconductor die, curing to bond composite
12/08/2005US20050271330 Three-dimensional mounted assembly and optical transmission device
12/08/2005US20050271149 RF isolator for isolating voltage sensing and gate drivers
12/08/2005US20050271148 RF isolator with differential input/output
12/08/2005US20050271147 Transformer isolator for digital power supply
12/08/2005US20050270758 Semiconductor device, noise reduction method, and shield cover
12/08/2005US20050270748 Substrate structure integrated with passive components
12/08/2005US20050270746 Insulating structure having combined insulating and heat spreading capabilities
12/08/2005US20050270744 Compliant thermal interface for electronic equipment
12/08/2005US20050270743 Cooling module for electronic devices
12/08/2005US20050270742 Semi-compliant joining mechanism for semiconductor cooling applications
12/08/2005US20050270741 Large-area planar heat dissipation structure
12/08/2005US20050270740 Heat-dissipating structure inside the computer mainframe
12/08/2005US20050270712 Multi-domain ESD protection circuit structure
12/08/2005US20050270404 Semiconductor device and electronic apparatus
12/08/2005US20050270390 Solid-state image pickup apparatus, solid-state image sensor chip and package
12/08/2005US20050270194 Coding information in integrated circuits
12/08/2005US20050270135 Method of making photolithographically-patterned out-of-plane coil structures
12/08/2005US20050270097 RF generator with voltage regulator
12/08/2005US20050270096 RF generator with phase controlled mosfets
12/08/2005US20050270088 Active phase cancellation for inductor/capacitor networks
12/08/2005US20050270049 Semiconductor device
12/08/2005US20050270035 Short detection circuit and short detection method
12/08/2005US20050269749 Aluminum nitride sintered compact, metallized substrate, heater, jig and method for producing aluminum nitride sintered compact
12/08/2005US20050269726 Thermal interface material with aligned carbon nanotubes
12/08/2005US20050269720 Crack protection for silicon die
12/08/2005US20050269719 Integrated circuit device
12/08/2005US20050269718 Optimized driver layout for integrated circuits with staggered bond pads
12/08/2005US20050269717 Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
12/08/2005US20050269716 Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules
12/08/2005US20050269715 Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
12/08/2005US20050269714 Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
12/08/2005US20050269713 Apparatus and method for wire bonding and die attaching
12/08/2005US20050269712 Semiconductor device including interconnection structure in which lines having different widths are connected with each other
12/08/2005US20050269711 Semiconductor device
12/08/2005US20050269710 Semiconductor package and packaging method using flip-chip bonding technology
1 ... 1279 1280 1281 1282 1283 1284 1285 1286 1287 1288 1289 1290 1291 1292 1293 1294 1295 1296 1297 1298 1299 ... 2262