Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/14/2005CN1708213A Electronic device cooling apparatus and method for forecasting and cooling temperature of electronic equipment
12/14/2005CN1708206A Chip-component-mounted device and semiconductor device
12/14/2005CN1707885A Optical device and method for fabricating the same
12/14/2005CN1707874A Connector, electronic device and connector mounting method
12/14/2005CN1707806A Spiral inductor formed in semiconductor substrate and method for forming the inductor
12/14/2005CN1707793A Semiconductor device having inductor
12/14/2005CN1707792A Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
12/14/2005CN1707791A Electrical fuses structure
12/14/2005CN1707790A Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
12/14/2005CN1707789A Special new pattern identification sign for testing film layer thickness in semiconductor device
12/14/2005CN1707788A Semiconductor device and method of manufacturing the same
12/14/2005CN1707787A Semiconductor devices
12/14/2005CN1707786A 半导体装置 Semiconductor device
12/14/2005CN1707785A Liquid-cooled radiator
12/14/2005CN1707784A Heat tube
12/14/2005CN1707783A Thermal tube and producing method thereof
12/14/2005CN1707782A Radiating substrate and producing method thereof
12/14/2005CN1707781A Radiator and producing method thereof
12/14/2005CN1707780A Semiconductor device and electronic apparatus
12/14/2005CN1707779A 半导体装置 Semiconductor device
12/14/2005CN1707777A Semiconductor device, manufacturing method of semiconductor device and module for optical device
12/14/2005CN1707775A Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device
12/14/2005CN1707769A Method of manufacturing semiconductor device
12/14/2005CN1707767A Wiring substrate and method for manufacturing the same
12/14/2005CN1707760A Semiconductor substrate and thin processing method for semiconductor substrate
12/14/2005CN1707756A Semiconductor device with low contact resistance and method for fabricating the same
12/14/2005CN1706925A Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
12/14/2005CN1706886A Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof
12/14/2005CN1706641A Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device
12/14/2005CN1231980C Luminous device
12/14/2005CN1231972C Static charging seal ring for system static protection
12/14/2005CN1231971C Surface installation type chip semiconductor device and making method thereof
12/14/2005CN1231970C Semiconductor device
12/14/2005CN1231969C Semiconductor device with embedded electric conducting layer and producing method thereof
12/14/2005CN1231968C Flip-chip bonding package structure of chip
12/14/2005CN1231967C Internal circuit structure for chip with weld pad array and its manufacturing method
12/14/2005CN1231966C Cooling system for integrated circuit chip
12/14/2005CN1231965C 半导体器件 Semiconductor devices
12/14/2005CN1231964C 半导体器件 Semiconductor devices
12/14/2005CN1231960C Semiconductor device capable of depressing current concentration on welding pad and producing method thereof
12/14/2005CN1231955C Structure of jointed pads and preparation method
12/14/2005CN1231954C IC chip installing structure and display apparatus
12/14/2005CN1231953C Method for forming packaging of flip-chip semiconductor
12/14/2005CN1231826C Method and apparatus for intensifying cooling ability of lap computer
12/13/2005US6976238 Circular vias and interconnect-line ends
12/13/2005US6975953 Analysis method for semiconductor device, analysis system and a computer program product
12/13/2005US6975924 Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures
12/13/2005US6975518 Printed circuit board housing clamp
12/13/2005US6975516 Component built-in module and method for producing the same
12/13/2005US6975514 Integrated VCSELs on traditional VLSI packaging
12/13/2005US6975513 Construction for high density power module package
12/13/2005US6975512 Thermally enhanced heat sink BGA package
12/13/2005US6975500 Capacitor having improved electrodes
12/13/2005US6975489 Circuit structure and semiconductor integrated circuit
12/13/2005US6975398 Method for determining semiconductor overlay on groundrule devices
12/13/2005US6975295 Liquid crystal display device
12/13/2005US6975200 Microconverter and laminated magnetic-core inductor
12/13/2005US6975189 On-chip multilayer metal shielded transmission line
12/13/2005US6975131 Integrated module having a delay element
12/13/2005US6975040 Fabricating semiconductor chips
12/13/2005US6975039 Method of forming a ball grid array package
12/13/2005US6975038 Chip scale pin array
12/13/2005US6975037 Semiconductor package having flex circuit with external contacts
12/13/2005US6975035 Method and apparatus for dielectric filling of flip chip on interposer assembly
12/13/2005US6975033 Semiconductor device and method for manufacturing the same
12/13/2005US6975032 Copper recess process with application to selective capping and electroless plating
12/13/2005US6975031 Semiconductor device and chip carrier
12/13/2005US6975030 Silicon carbide contact for semiconductor components
12/13/2005US6975029 Antenna-incorporated semiconductor device
12/13/2005US6975028 Thermal apparatus for engaging electronic device
12/13/2005US6975027 Multi-chip electronic package and cooling system
12/13/2005US6975026 Package for mounting semiconductor device
12/13/2005US6975025 Semiconductor chip package and method of manufacturing same
12/13/2005US6975024 Hybrid integrated circuit device and manufacturing method thereof
12/13/2005US6975023 Co-packaged control circuit, transistor and inverted diode
12/13/2005US6975022 Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof
12/13/2005US6975021 Carrier for substrate film
12/13/2005US6975020 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size
12/13/2005US6975017 Healing of micro-cracks in an on-chip dielectric
12/13/2005US6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
12/13/2005US6975015 Modulated trigger device
12/13/2005US6975002 SOI single crystalline chip structure
12/13/2005US6974970 Semiconductor device
12/13/2005US6974963 Substrate inspecting device, coating/developing device and substrate inspecting method
12/13/2005US6974916 Laminated ceramic electronic component having via-hole conductors with different sectional sizes
12/13/2005US6974775 Method and apparatus for making an imprinted conductive circuit using semi-additive plating
12/13/2005US6974772 Integrated low-k hard mask
12/13/2005US6974766 In situ deposition of a low κ dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
12/13/2005US6974765 Encapsulation of pin solder for maintaining accuracy in pin position
12/13/2005US6974744 Fringing capacitor structure
12/13/2005US6974740 Symmetric inducting device for an integrated circuit having a ground shield
12/13/2005US6974728 Encapsulant mixture having a polymer bound catalyst
12/13/2005US6974727 Method of manufacturing a hybrid integrated circuit device
12/13/2005US6974726 Silicon wafer with soluble protective coating
12/13/2005US6974725 Interconnections for a semiconductor device
12/13/2005US6974724 Shielded laminated structure with embedded chips
12/13/2005US6974723 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials
12/13/2005US6974722 Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules
12/13/2005US6974659 Protecting a semiconductor process wafer surface from contacting thermally degraded photoresist comprising the steps of: providing a semiconductor process wafer having a process surface; forming protective layer over selected areas
12/13/2005US6974635 Package for electronic component, lid material for package lid, and production method for lid material
1 ... 1278 1279 1280 1281 1282 1283 1284 1285 1286 1287 1288 1289 1290 1291 1292 1293 1294 1295 1296 1297 1298 ... 2262