Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/15/2005US20050275070 Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material
12/15/2005US20050275069 Method to harden shallow trench isolation against total ionizing dose radiation
12/15/2005US20050275068 Method and structures for indexing dice
12/15/2005US20050275061 Semiconductor device having inductor
12/15/2005US20050275057 Schottky diode with dielectric isolation
12/15/2005US20050275050 Ultra thin image sensor package structure and method for fabrication
12/15/2005US20050275049 Packaged microelectronic imagers and methods of packging microelectronic imagers
12/15/2005US20050275048 Microelectronic imagers and methods of packaging microelectronic imagers
12/15/2005US20050275032 MOS type semiconductor device having electrostatic discharge protection arrangement
12/15/2005US20050275031 Protection of an integrated circuit against electrostatic discharges
12/15/2005US20050275028 Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection
12/15/2005US20050275027 ESD protection for integrated circuits
12/15/2005US20050275023 Semiconductor device and method of manufacturing same
12/15/2005US20050275005 Metal-insulator-metal (MIM) capacitor and method of fabricating the same
12/15/2005US20050275001 Integrated circuit and method of manufacturing same
12/15/2005US20050274990 Whole chip ESD protection
12/15/2005US20050274989 Integrated test circuit arrangement and test method
12/15/2005US20050274987 Inexpensive method of fabricating a higher performance capacitance density mimcap integrable into a copper interconnect scheme
12/15/2005US20050274982 Electronic unit with a substrate where an electronic circuit is fabricated
12/15/2005US20050274979 Compound semiconductor device and manufacturing method thereof
12/15/2005US20050274966 Fuse and write method for fuse
12/15/2005US20050274963 Semiconductor protection device
12/15/2005US20050274932 Shielding for electromagnetic interference
12/15/2005US20050274882 Optical device and method for fabricating the same
12/15/2005US20050274869 Alignment method and mounting method using the alignment method
12/15/2005US20050274766 Back sack with heat dissipation effect
12/15/2005US20050274621 Method of barrier layer surface treatment to enable direct copper plating on barrier metal
12/15/2005US20050274505 Cooling element
12/15/2005US20050274498 Heat dissipation assembly with air guide device
12/15/2005US20050274496 Boiling cooler
12/15/2005US20050274490 Heatsink assembly and method of manufacturing the same
12/15/2005US20050274489 Heat exchange device and method
12/15/2005US20050274487 Method and apparatus for reducing thermal resistance in a vertical heat sink assembly
12/15/2005US20050274451 Manufacturing method for base piece made to adhere to adhesive sheet, manufacturing method for semiconductor wafer and manufacturing method for semiconductor device
12/15/2005US20050274322 Reactor for producing reactive intermediates for low dielectric constant polymer thin films
12/15/2005US20050274198 Method of evaluating adhesiveness of member
12/15/2005US20050274120 Heat pipe connection system and method
12/15/2005US20050274007 Method for increasing a production rate of printed wiring boards
12/15/2005DE4444808B4 Halbleitervorrichtung Semiconductor device
12/15/2005DE4207226B4 Integrierte Schaltung Integrated circuit
12/15/2005DE202005015650U1 Cooling fins positioning device for central processing units, has cooling fins with respective connecting units, and positioning plate with connecting unit corresponding to respective unit of fin and positioning fins parallel to one another
12/15/2005DE10249855B4 Werkstoff zum Zuführen von Strom auf Halbleiter-Bauelemente und Verfahren zum Herstellen eines solchen Material for supplying power to semiconductor devices and methods for producing such
12/15/2005DE10247315B4 TO-Gehäuse für Hochfrequenzanwendungen - Verdrahtungsträger aus Keramik TO package for high frequency applications - wiring substrate made of ceramic
12/15/2005DE102005021247A1 Eigenschaftsmessverfahren für Hochfrequenzschaltung, Kalibriermuster und Kalibriervorrichtung Property Measuring method for high frequency circuit calibration pattern and calibration
12/15/2005DE102005011863A1 Halbleitermikrovorrichtung Semiconductor micro device
12/15/2005DE102004063824A1 Leuchtdioden-Baugruppe Light-emitting diode module
12/15/2005DE102004061575A1 Semiconductor device for electric power module, has metal layer connected to bonding wire, which is provided at front surface of substrate, so that metal layer overlaps capacitor
12/15/2005DE102004033645A1 Herstellungswerkzeug für eine Waferebene-Packung und Verfahren zum Anordnen von Chips Production tool for a wafer level package and method for disposing of chips
12/15/2005DE102004025279A1 Träger mit Lotkugelelementen und ein Verfahren zum Bestücken von Substraten mit Kugelkontakten Carrier with solder ball elements and a method for loading substrates with ball contacts
12/15/2005DE102004024923A1 Manufacturing method for overvoltage protection device used in communication system, involves forming emitter region on base region, and forming electrode region on emitter region
12/15/2005DE102004024887A1 Transistor e.g. double diffusion MOS, has cell array with two active transistor cells separated by pitch, in which temperature sensor and transistor cell are located in close distance
12/15/2005DE102004024659A1 Halbleiterbauteil Semiconductor device
12/15/2005DE102004024368A1 Beleuchtbares GaAs-Schaltbauteil mit transparentem Gehäuse und Mikrowellenschaltung hiermit Illuminated GaAs switching device with transparent housing and microwave circuit hereby
12/15/2005DE102004023897A1 Manufacture of protected circuit tracks and contact pads on electronic device having diffusion barrier and copper seed layer, by making second negative-resist mask so that copper core and edge region are kept free
12/15/2005DE102004023462A1 Halbleiterchip mit Metallisierungsebenen und Verfahren zur Ausbildung von Leiterbahnstrukturen Semiconductor chip metallization and method for forming interconnect structures
12/15/2005DE102004001108B4 Permanenter oder temporärer Schutz von Bauelementen mittels Schrumpffolie Permanent or temporary protection of components by shrink film
12/15/2005DE10161043B4 Chipanordnung Chip system
12/15/2005DE10048859B4 Druckkontaktanordnung sowie deren Verwendung Pressure contact arrangement and their use
12/15/2005CA2567389A1 Method for construction of rigid photovoltaic modules
12/15/2005CA2556410A1 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method
12/14/2005EP1605741A1 Cooling element
12/14/2005EP1605736A2 Integrated circuits with copper metallization for interconnection
12/14/2005EP1605735A2 High frequency multilayer integrated circuit
12/14/2005EP1605559A1 Socket for electric component
12/14/2005EP1605521A2 Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device
12/14/2005EP1605519A2 Semiconductor device and manufacturing method of the same
12/14/2005EP1605513A1 Photodiode array, method for manufacturing same, and radiation detector
12/14/2005EP1605508A2 Surface-mount chip-scale package
12/14/2005EP1605506A2 Semiconductor device
12/14/2005EP1605295A1 Optical modulator module
12/14/2005EP1605220A1 Heat sunk, laser module, laser device, and laser-processing device
12/14/2005EP1605020A1 Curable organopolysiloxane composition
12/14/2005EP1604401A1 Semiconductor device, semiconductor body and method of manufacturing thereof
12/14/2005EP1604400A2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
12/14/2005EP1604385A2 Housing body, optoelectronic component with a housing body of this type, and plastic housing material
12/14/2005EP1360884B1 An electronic device
12/14/2005CN2746534Y Multilevel metal interconnects line distribution for reducing stress migration
12/14/2005CN2746533Y Packing structure of gamma correction integrated circuit
12/14/2005CN2746532Y Chip assembling structure capable of stable carrying
12/14/2005CN2746531Y Chip with multiple internal function block
12/14/2005CN2746530Y Conduction heat-sink structure
12/14/2005CN2746529Y Cooling device
12/14/2005CN2746528Y Heat sink support structure
12/14/2005CN2746527Y Assembled cooling fin
12/14/2005CN2746526Y Fastening-type cooling fin
12/14/2005CN2746525Y Heat sink assembly
12/14/2005CN2746524Y Heat sink
12/14/2005CN2746523Y Cooling apparatus assembly
12/14/2005CN2746522Y Filementary mental wire group cooler
12/14/2005CN2746521Y Fixing structure of seat of cooler
12/14/2005CN2746520Y Fastening device or cooler
12/14/2005CN2746439Y Improved structure of multiple cooling module
12/14/2005CN1708854A Arrangement for reducing current density in a transistor in an IC
12/14/2005CN1708850A Chip-scale schottky device
12/14/2005CN1708849A A high-performance heat sink configurations for air-cooled heat dissipation device
12/14/2005CN1708848A Thermal-conductive substrate package
12/14/2005CN1708845A Forming a copper diffusion barrier
12/14/2005CN1708841A Film carrier tape for mounting electronic component
12/14/2005CN1708840A Three-dimensional device fabrication method
12/14/2005CN1708596A Composite material, method for producing same and member using same
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