Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/22/2005DE102004025420A1 Schaltungselement und Verfahren zum Sichern einer Lastschaltung Circuit element and method for securing a load circuit
12/22/2005DE102004024644A1 Deposition of metallic structure on substrate in semiconductor device manufacture, includes ductile layer to accommodate stresses between structure and substrate by plastic deformation
12/22/2005DE10133571B4 Elektronisches Bauteil und Verfahren zu seiner Herstellung Electronic component and method for its preparation
12/22/2005DE10014306B4 Systemträger für einen Halbleiterchip mit einem Leiterrahmen System carrier for a semiconductor chip to a lead frame
12/21/2005EP1608040A1 Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
12/21/2005EP1608016A2 Capacitor-built-in-type wiring substrate, printed wiring substrate, and capacitor
12/21/2005EP1608015A2 Semiconductor device capsule
12/21/2005EP1608014A1 Heat radiator
12/21/2005EP1608013A1 Method of formation of airgaps around interconnecting line
12/21/2005EP1608010A2 Method of forming connection hole
12/21/2005EP1608009A1 Semiconductor device
12/21/2005EP1607989A2 Ceramic electronic device and the production method
12/21/2005EP1607707A1 Bubble generator and heat transfer assembly
12/21/2005EP1606983A1 Structural unit and method for the production of a structural unit
12/21/2005EP1606841A2 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
12/21/2005EP1606840A1 Wafer scale package and method of assembly
12/21/2005EP1606835A1 Semiconductor device and method of manufacturing thereof
12/21/2005EP1415335A4 Use of diverse materials in air-cavity packaging of electronic devices
12/21/2005EP1325053B1 Die-attaching paste and semiconductor device
12/21/2005EP1019925A4 Microelectronic component carrier and method of its manufacture
12/21/2005EP0943170A4 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
12/21/2005CN1711811A Multi-layer circuit assembly and process for preparing the same
12/21/2005CN1711641A Semiconductor device
12/21/2005CN1711639A Folded-flex bondwire-less multichip power package
12/21/2005CN1711638A Integrated circuit with at least one bump
12/21/2005CN1711637A Device comprising circuit elements connected by bonding bump structure
12/21/2005CN1711635A Reliable low-k interconnect structure with hybrid dielectric
12/21/2005CN1711633A Flexible device and method of manufacturing the same
12/21/2005CN1711631A Film carrier tape for mounting of electronic part
12/21/2005CN1711623A Method for producing and testing a corrosion-resistant channel in a silicon device
12/21/2005CN1711553A Data carrier with a module with a reinforcement strip
12/21/2005CN1710716A Semiconductor structure and method for ESD protection circuit
12/21/2005CN1710715A Nano-microparticle radiating apparatus
12/21/2005CN1710714A Radiating air-guiding cover
12/21/2005CN1710713A Method for making electric-heating radiator and electric-heating radiator thereby
12/21/2005CN1710679A Ceramic electronic device and the production method
12/21/2005CN1710427A Semiconductor acceleration sensor device and method for manufacturing the same
12/21/2005CN1233205C Mfg. method of circuit device
12/21/2005CN1233039C 半导体器件 Semiconductor devices
12/21/2005CN1233038C Microjet array cooling heat sink
12/21/2005CN1233036C Assembly with power semiconductor module and cooling device
12/21/2005CN1232676C Method for forming electric conductive region by ion implantation
12/20/2005US6978434 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
12/20/2005US6978407 Method and architecture for detecting random and systematic transistor degradation for transistor reliability evaluation in high-density memory
12/20/2005US6977818 Heat dissipating device for an integrated circuit chip
12/20/2005US6977816 Heat sink mounting assembly
12/20/2005US6977814 Dual material heat sink core assembly
12/20/2005US6977805 Capacitor element, semiconductor integrated circuit and method of manufacturing those
12/20/2005US6977783 Lens module and assembling method thereof
12/20/2005US6977707 Display device and wiring substrate including electric wiring formed of conductive film
12/20/2005US6977705 Structure for reducing the diffraction effect in periodic electrode arrangements and liquid crystal device including the same
12/20/2005US6977620 High frequency package
12/20/2005US6977551 Dual band power amplifier module for wireless communication devices
12/20/2005US6977516 Semi-conductor component testing system with a reduced number of test channels
12/20/2005US6977444 Methods and apparatus for improving high frequency input/output performance
12/20/2005US6977443 Substrate for carrying a semiconductor chip and semiconductor device using same
12/20/2005US6977442 a conductive layer with a plurality of wires; a bonding pad overlapping the wires, a protective film bridging adjacent wires in a region overlapping with the bonding pad so that a void is formed in the protective film between the adjacent wires
12/20/2005US6977441 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument
12/20/2005US6977440 Stacked packages
12/20/2005US6977439 Semiconductor chip stack structure
12/20/2005US6977438 Dual damascene circuit with upper wiring and interconnect line positioned in regions formed as two layers including organic polymer layer and low-permittivity layer
12/20/2005US6977436 Semiconductor packaging device
12/20/2005US6977435 Thick metal layer integrated process flow to improve power delivery and mechanical buffering
12/20/2005US6977434 Semiconductor assembly and spring member therefor
12/20/2005US6977432 Prefabricated semiconductor chip carrier
12/20/2005US6977431 semiconductor die, die pad, and inner lead portions are embedded in a hardened plastic encapsulant; can be electrically coupled; printed circuit boards; increased functionality
12/20/2005US6977429 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
12/20/2005US6977428 Semiconductor device adapted to remove noise from a signal
12/20/2005US6977427 Electronic component having stacked semiconductor chips in parallel, and a method for producing the component
12/20/2005US6977420 ESD protection circuit utilizing floating lateral clamp diodes
12/20/2005US6977403 Semiconductor apparatus having a built-in-electric coil and a method of making the semiconductor apparatus
12/20/2005US6977391 An encapsulated organic optoelectronic device comprising a substrate, an organic optoelectronic device on the substrate and includes a cathode, a diffusion layer on the organic device
12/20/2005US6977346 Vented circuit board for cooling power components
12/20/2005US6977339 Surface mounting package
12/20/2005US6977338 Underfill diffusion prevention layer of photosensitive polyimide between mounted electronic part and conductor cover layer; prevents underfill on highly wettable surface; allows high density circuit design
12/20/2005US6977337 Electronic assembly packaging
12/20/2005US6977279 polyurethane blocked with phenolic OH-group in a hydrocarbon resin, a polyamine compound, an epoxy resin, 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine catalyst; curable at room temperature to a uniform film
12/20/2005US6977224 Method of electroless introduction of interconnect structures
12/20/2005US6977220 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
12/20/2005US6977214 Die paddle clamping method for wire bond enhancement
12/20/2005US6977213 IC chip solder bump structure and method of manufacturing same
12/20/2005US6977211 Selective consolidation processes for electrically connecting contacts of semiconductor device components
12/20/2005US6977198 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same
12/20/2005US6977195 Test structure for characterizing junction leakage current
12/20/2005US6977191 Apparatus for and method of packaging semiconductor devices
12/20/2005US6977190 Semiconductor device and method for production thereof
12/20/2005US6977189 Wafer scale caps located by molding
12/20/2005US6977187 Chip package sealing method
12/20/2005US6977183 Process for locating, displaying, analyzing, and optionally monitoring potential transient defect sites in one or more integrated circuit chips of a semiconductor substrate
12/20/2005US6977128 Multi-layered semiconductor structure
12/20/2005US6977024 Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies
12/20/2005US6976616 Circuit board transferring apparatus and method and solder ball mounting method
12/20/2005US6976528 Spray cooling system for extreme environments
12/20/2005US6976527 MEMS microcapillary pumped loop for chip-level temperature control
12/20/2005US6976526 Heat transport device and electronic device
12/20/2005US6976525 Fastening device for a radiator
12/15/2005WO2005120139A1 Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil
12/15/2005WO2005119800A2 Thermoelectric nano-wire devices
12/15/2005WO2005119777A1 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method
12/15/2005WO2005119775A2 Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
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