Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/22/2005US20050282306 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
12/22/2005US20050282297 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids
12/22/2005US20050282021 Composition for forming coating film comprising carbosilane based polymer and coating film obtained from the composition
12/22/2005US20050281994 Metallic material for electric or electronic parts
12/22/2005US20050281666 Hybrid fluid-dynamic apparatus
12/22/2005US20050281102 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
12/22/2005US20050281101 Semiconductor structure processing using multiple laterally spaced laser beam spots with on-axis offset
12/22/2005US20050281012 Mirror image electrical packages and system for using same
12/22/2005US20050281011 Heat spreader in integrated circuit package
12/22/2005US20050281008 Extended thin film capacitor (TFC)
12/22/2005US20050281001 Heat sink and chip sandwich system
12/22/2005US20050281000 Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
12/22/2005US20050280999 Wire form heat sink retention module
12/22/2005US20050280997 Power component cooling device
12/22/2005US20050280996 Heat dissipating device with enhanced boiling/condensation structure
12/22/2005US20050280995 Electronic component cooling apparatus
12/22/2005US20050280994 Apparatus, method, and control program for cooling electronic devices
12/22/2005US20050280993 Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
12/22/2005US20050280992 Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
12/22/2005US20050280991 Fast mountable screw assembly for CPU heat sink
12/22/2005US20050280988 Method and apparatus for cooling a portable computer
12/22/2005US20050280503 Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unit
12/22/2005US20050280490 Semiconductor and electronic device with spring terminal
12/22/2005US20050280486 Transmission line and semiconductor integrated circuit device
12/22/2005US20050280434 Method and apparatus for die testing on wafer
12/22/2005US20050280165 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
12/22/2005US20050280164 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
12/22/2005US20050280163 Semiconductor device module with flip chip devices on a common lead frame
12/22/2005US20050280162 Thermal interposer for thermal management of semiconductor devices
12/22/2005US20050280161 Unmolded package for a semiconductor device
12/22/2005US20050280160 Method for manufacturing wafer level chip stack package
12/22/2005US20050280159 Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device
12/22/2005US20050280158 Prefabricated semiconductor chip carrier
12/22/2005US20050280157 Novel conductor geometry for electronic circuits fabricated on flexible substrates
12/22/2005US20050280156 Semiconductor device with base support structure
12/22/2005US20050280155 Semiconductor bonding and layer transfer method
12/22/2005US20050280154 Semiconductor memory device
12/22/2005US20050280152 Interlayer connector for preventing delamination of semiconductor device and methods of forming same
12/22/2005US20050280149 Semiconductor device
12/22/2005US20050280148 Device mounting board and semiconductor apparatus using the same
12/22/2005US20050280146 Interposer containing bypass capacitors for reducing voltage noise in an IC device
12/22/2005US20050280145 Semiconductor die package with internal bypass capacitors
12/22/2005US20050280144 Thermal apparatus for engaging electronic device
12/22/2005US20050280143 Apparatus for molding a semiconductor die package with enhanced thermal conductivity
12/22/2005US20050280142 Electronic assembly having an indium wetting layer on a thermally conductive body
12/22/2005US20050280141 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
12/22/2005US20050280140 Packaging for enhanced thermal and structural performance of electronic chip modules
12/22/2005US20050280139 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
12/22/2005US20050280138 Ground plane for integrated circuit package
12/22/2005US20050280137 Method and apparatus for providing wafer-level capacitive decoupling
12/22/2005US20050280136 Method for producing Z-axis interconnection assembly of printed wiring board elements
12/22/2005US20050280135 Stacking system and method
12/22/2005US20050280134 Multi-frequency noise suppression capacitor set
12/22/2005US20050280133 Multiple device package
12/22/2005US20050280132 Semiconductor package with heat sink
12/22/2005US20050280131 Memory card
12/22/2005US20050280130 Printed wiring board and production method for printed wiring board
12/22/2005US20050280129 Semiconductor device and manufacturing method therefor
12/22/2005US20050280128 Thermal interposer for thermal management of semiconductor devices
12/22/2005US20050280127 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
12/22/2005US20050280126 Flip chip in leaded molded package and method of manufacture thereof
12/22/2005US20050280125 Co-packaged control circuit, transistor and inverted diode
12/22/2005US20050280124 Semiconductor package having integrated metal parts for thermal enhancement
12/22/2005US20050280123 Semiconductor devices and methods of manufacturing the same
12/22/2005US20050280120 Semiconductor device
12/22/2005US20050280119 Integrated circuit chip manufacturing method and semiconductor device
12/22/2005US20050280118 Methods of manufacturing metal-silicide features
12/22/2005US20050280112 Semiconductor assembly having substrate with electroplated contact pads
12/22/2005US20050280093 Modulated trigger device
12/22/2005US20050280092 Electrostatic discharge (esd) protection mos device and esd circuitry thereof
12/22/2005US20050280091 Semiconductor structure and method for ESD protection
12/22/2005US20050280087 Laterally diffused MOS transistor having source capacitor and gate shield
12/22/2005US20050280061 Vertical memory device structures
12/22/2005US20050280047 Fuse of a semiconductor memory device and repair process for the same
12/22/2005US20050280042 Wafer bonding method
12/22/2005US20050280038 Semiconductor integrated circuit device
12/22/2005US20050280036 Semiconductor product having a first and at least one further semiconductor circuit and method
12/22/2005US20050280034 Semiconductor device
12/22/2005US20050279812 Semiconductor device, manufacturing method and apparatus for the same
12/22/2005US20050279739 Semiconductor structure processing using multiple laser beam spots spaced on-axis to increase single-blow throughput
12/22/2005US20050279736 Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
12/22/2005US20050279640 Method of forming a lead-free bump and a plating apparatus therefor
12/22/2005US20050279530 Compliant spring contacts, methods of making, and utilization as electrical contacts in probe card and flip-chip applications
12/22/2005US20050279521 Electronic assembly packaging
12/22/2005US20050279491 Bubble generator
12/22/2005US20050279486 Fan duct
12/22/2005US20050279166 Semiconductor acceleration sensor device and method for manufacturing the same
12/22/2005US20050279104 Thermoelectric module
12/22/2005US20050278946 Large scale simultaneous circuit encapsulating apparatus and method of use
12/22/2005US20050278837 Breathable article of clothing that resists insect bites
12/22/2005DE4437761B4 Verfahren zum Bilden eines Kontakts in einer Halbleitervorrichtung A method of forming a contact in a semiconductor device
12/22/2005DE202005013751U1 Wärmeleitfähige Verbundstruktur für ein LED-Gehäuse Heat conductive composite structure for an LED housing
12/22/2005DE19742120B4 Verfahren zum Herstellen einer Verdrahtung für eine Halbleitervorrichtung A method of manufacturing a wiring for a semiconductor device
12/22/2005DE19546953B4 Halbleitervorrichtung beziehungsweise Digital-Analog-Wandler mit Widerstandsreihe A semiconductor device or digital-to-analog converter with series resistor
12/22/2005DE10355921B4 Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers An electrical circuit arrangement with an electronic chip in a receiving device of the circuit substrate
12/22/2005DE10245534B4 Teststruktur zum Bestimmen eines Bereiches einer Deep-Trench-Ausdiffusion in einem Speicherzellenfeld Test structure for determining a region of a deep trench outdiffusion in a memory cell array
12/22/2005DE102004028695B3 Breakage sensor for installation near edge of semiconductor substrate has isolation layer and several electrode layers with terminals connected to sensor circuit
12/22/2005DE102004026092A1 Verfahren zur Herstellung einer mit einem Moldcompound versehenen Chip-Anordnung A method for preparing a molding compound provided with a chip arrangement
12/22/2005DE102004025911A1 Kontakatbehaftete Chipkarte, Verfahren zur Herstellung einer solchen und deren Verwendung Kontakatbehaftete chip card, processes for preparing such and the use thereof
12/22/2005DE102004025609A1 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module
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