Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/27/2005US6979886 Short-prevented lead frame and method for fabricating semiconductor package with the same
12/27/2005US6979882 Heat resistance of aluminum electrodes or wires in display dvices; prevent protrusions defects by limiting carbon, nitrogen, oxide impurities; electroluminescence display device, television, computer, camera
12/27/2005US6979880 Scalable high performance antifuse structure and process
12/27/2005US6979875 Reduced surface field technique for semiconductor devices
12/27/2005US6979873 Semiconductor device having multiple substrates
12/27/2005US6979869 Substrate-biased I/O and power ESD protection circuits in deep-submicron twin-well process
12/27/2005US6979868 Bypass circuits for reducing plasma damage
12/27/2005US6979866 Semiconductor device with SOI region and bulk region and method of manufacture thereof
12/27/2005US6979854 Thin-film capacitor device, mounting module for the same, and method for fabricating the same
12/27/2005US6979850 Semiconductor device capable of avoiding latchup breakdown resulting from negative varation of floating offset voltage
12/27/2005US6979848 Memory system with conductive structures embedded in foamed insulator
12/27/2005US6979843 Power semiconductor device
12/27/2005US6979839 Electro-optical device, method for making the same, and electronic apparatus
12/27/2005US6979782 Apparatus and method for mechanical coupling of land grid array applications
12/27/2005US6979781 Semiconductor package, electronic circuit device, and mounting method of semiconductor device
12/27/2005US6979656 Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same
12/27/2005US6979651 Method for forming alignment features and back-side contacts with fewer lithography and etch steps
12/27/2005US6979648 Method for BARC over-etch time adjust with real-time process feedback
12/27/2005US6979646 Hardening of copper to improve copper CMP performance
12/27/2005US6979645 Method of producing a semiconductor device having copper wiring
12/27/2005US6979644 Method of manufacturing electronic circuit component
12/27/2005US6979640 Contact structure and method of making the same
12/27/2005US6979636 Method for forming heightened solder bumps on circuit boards
12/27/2005US6979625 Copper interconnects with metal capping layer and selective copper alloys
12/27/2005US6979606 Use of silicon block process step to camouflage a false transistor
12/27/2005US6979605 Manufacturing method for a semiconductor device using a marker on an amorphous semiconductor film to selectively crystallize a region with a laser light
12/27/2005US6979601 Methods for fabricating fuses for use in semiconductor devices and semiconductor devices including such fuses
12/27/2005US6979600 Apparatus and methods for an underfilled integrated circuit package
12/27/2005US6979599 Chip with molded cap array
12/27/2005US6979598 Method of attaching a leadframe to singulated semiconductor dice
12/27/2005US6979597 Wafer-level package with silicon gasket
12/27/2005US6979596 Method of fabricating a tape having apertures under a lead frame for conventional IC packages
12/27/2005US6979595 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
12/27/2005US6979594 Process for manufacturing ball grid array package
12/27/2005US6979593 Method of manufacturing a semiconductor device
12/27/2005US6979592 Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress
12/27/2005US6979591 Connection of integrated circuits
12/27/2005US6979585 Micro-electromechanical system
12/27/2005US6979497 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC).
12/27/2005US6979204 Pressure piece for use in a power semiconductor module
12/27/2005US6979203 IC socket
12/27/2005US6978856 Electrical apparatus, cooling system therefor, and electric vehicle
12/27/2005US6978829 Radiator assembly
12/27/2005US6978828 Heat pipe cooling system
12/27/2005US6978827 Active heat sink
12/27/2005US6978538 Method for making a microelectronic interposer
12/22/2005WO2005122663A2 Insulating structure having combined insulating and heat spreading capabilities
12/22/2005WO2005122662A2 Semi-compliant joining mechanism for semiconductor cooling applications
12/22/2005WO2005122661A2 Apparatus and method of efficient fluid delivery for cooling a heat producing device
12/22/2005WO2005122423A2 Spread spectrum isolator
12/22/2005WO2005122284A2 Semiconductor-on-diamond devices and methods of forming
12/22/2005WO2005122257A1 Semiconductor device incorporating capacitor and process for manufacturing same
12/22/2005WO2005122256A2 Voltage booster transistor
12/22/2005WO2005122255A1 Metal interconnects for image sensors
12/22/2005WO2005122254A2 Gate stack and gate stack etch sequence for metal gate integration
12/22/2005WO2005122253A2 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS
12/22/2005WO2005122252A1 Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
12/22/2005WO2005122251A1 Surface mounting electronic component and manufacturing method thereof
12/22/2005WO2005122250A2 High power mcm package with improved planarity and heat dissipation
12/22/2005WO2005122249A2 Semiconductor device module with flip chip devices on a common lead frame
12/22/2005WO2005122248A1 Semiconductor components having a plastic housing, and method for the production thereof
12/22/2005WO2005122247A1 Composite electronic component
12/22/2005WO2005122238A1 Process for fabricating semiconductor integrated circuit device
12/22/2005WO2005122236A2 Semiconductor device with reduced contact resistance
12/22/2005WO2005122195A2 Fabrication of interconnect structures
12/22/2005WO2005121684A1 Heat exchange device and method
12/22/2005WO2005121682A1 Heat transport device
12/22/2005WO2005121681A2 Counter flow micro heat exchanger for optimal performance
12/22/2005WO2005121018A1 Vent closing method and the use of an ultrasonic bonding machine for carrying out said method
12/22/2005WO2005111715A3 Cooling for light emitting diode
12/22/2005WO2005106940A3 High performance cmos transisitors using pmd linear stress
12/22/2005WO2005104814A3 Composite ground shield for passive components in a semiconductor die
12/22/2005WO2005101481A3 Power semiconductor
12/22/2005WO2005099280A3 Embedded toroidal transformers in ceramic substrates
12/22/2005WO2005099028A3 Embedded capacitors using conductor filled vias
12/22/2005WO2005081314A3 Optimisation of the number of power outputs for an integrated circuit
12/22/2005WO2005076679A3 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
12/22/2005WO2005050699A3 Method of forming a semiconductor package and structure thereof
12/22/2005WO2005041250A3 A package for microchips
12/22/2005WO2004095567A8 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material
12/22/2005US20050282975 Silicone epoxy formulations
12/22/2005US20050282472 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
12/22/2005US20050282403 Ceramic electronic device and the production method
12/22/2005US20050282396 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
12/22/2005US20050282386 Semiconductor device and fabrication process thereof
12/22/2005US20050282383 Systems for forming insulative coatings for via holes in semiconductor devices
12/22/2005US20050282381 Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer
12/22/2005US20050282377 Method of making a semiconductor device having improved contacts
12/22/2005US20050282376 Method of making a semiconductor device having improved contacts
12/22/2005US20050282374 Method of forming a thin wafer stack for a wafer level package
12/22/2005US20050282372 Semiconductor device and a method of manufacture therefor
12/22/2005US20050282361 Semiconductor wafer and manufacturing process thereof
12/22/2005US20050282360 Semiconductor wafer and manufacturing process for semiconductor device
12/22/2005US20050282356 Semiconductor layer structure and method of making the same
12/22/2005US20050282340 Semiconductor apparatus with improved ESD withstanding voltage
12/22/2005US20050282319 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
12/22/2005US20050282315 High-reliability solder joint for printed circuit board and semiconductor package module using the same
12/22/2005US20050282313 Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
12/22/2005US20050282312 Semiconductor device and manufacturing method thereof
12/22/2005US20050282310 Encapsulation of multiple integrated circuits
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