Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/29/2005DE102004048203A1 Stackable semiconductor module for electronics packaging has electronic component with vertical opening provided with continuous metallization with layer of soldering paste to connect it to contact of another electronic component
12/29/2005DE102004035080A1 Anordnung zur Verringerung des elektrischen Übersprechens auf einem Chip Arrangement for reducing the electrical crosstalk on a chip
12/29/2005DE102004027489A1 Verfahren zum Anordnen von Chips eines ersten Substrats auf einem zweiten Substrat A method of disposing of chips of a first substrate on a second substrate
12/29/2005DE102004027273A1 Halbleiterbaustein mit einer ersten und mindestens einer weiteren Halbleiterschaltung und Verfahren A semiconductor device having a first and at least a further semiconductor circuit and method
12/29/2005DE102004027185A1 Niederinduktives Halbleiterbauelement mit Halbbrückenkonfiguration Niederinduktives semiconductor component with a half-bridge configuration
12/29/2005DE102004027074A1 BGA (Ball Grid Array)-Gehäuse mit einer metallischen Kühlfolie BGA (Ball Grid Array) package with a metallic film cooling
12/29/2005DE102004026061A1 Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls The power semiconductor module and method for cooling a power semiconductor module
12/29/2005DE102004025658A1 Verfahren zur Herstellung einer Halbleiterschaltung und entsprechende Halbleiterschaltung A process for producing a semiconductor circuit and corresponding semiconductor circuit
12/29/2005DE102004019609B3 Multi-stage semiconductor manufacturing process uses a combination of wet and dry chemical etching processes
12/29/2005DE102004009981B4 ESD-Schutzschaltkreis mit Kollektorstrom-gesteuerter Zündung für eine monolithisch integrierte Schaltung ESD protection circuit with collector current-controlled ignition of a monolithic integrated circuit
12/28/2005EP1610607A1 Thermal management system and method for thin membrane type antennas
12/28/2005EP1610384A2 Electronic unit with a substrate where an electronic circuit is fabricated
12/28/2005EP1610382A2 Semiconductor apparatus with self-security function
12/28/2005EP1610381A2 Electronic package employing segmented connector and solder joint
12/28/2005EP1610380A2 Hermetic seal cover and manufacturing method thereof
12/28/2005EP1610378A1 Semiconductor device
12/28/2005EP1610377A2 System for modifying small structures
12/28/2005EP1610376A1 Semiconductor device
12/28/2005EP1610375A2 Contact carriers for populating substrates with spring contacts
12/28/2005EP1610363A1 Method of heat treatment and heat treatment apparatus
12/28/2005EP1610132A2 Fabricating interconnects using sacrificial substrates
12/28/2005EP1609838A2 Thermal transient suppression material and method of production
12/28/2005EP1609835A1 Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
12/28/2005EP1609339A1 Method for manufacturing an electronic module and an electronic module
12/28/2005EP1609338A1 A method and device for protection of a component or module
12/28/2005EP1609184A1 Arrangement composed of an electrical component on a substrate, and method for the production of said arrangement
12/28/2005EP1609183A1 Thermal interface apparatus, systems, and methods
12/28/2005EP1609182A1 Insulated power semiconductor module with reduced partial discharge and manufacturing method
12/28/2005EP1609180A1 Electrical connections in substrates
12/28/2005EP1609179A1 Internally reinforced bond pads
12/28/2005EP1609011A2 Optical communication between face-to-face semiconductor chips
12/28/2005EP1608699A2 Thermally conductive adhesive composition and process for device attachment
12/28/2005EP1608481A1 Phase change lead-free super plastic solders
12/28/2005EP1512114B1 Method of producing a digital fingerprint sensor and the corresponding sensor
12/28/2005EP1261833A4 High performance cold plate for electronic cooling
12/28/2005EP1123348B1 Impact-resistant epoxide resin compositions
12/28/2005CN2749053Y Fan type chip heat sink capable of increasing air supply efficiency
12/28/2005CN2749052Y Punch embedded construction of radiating fin and baseboard
12/28/2005CN1714608A Multilayer wiring board, method for producing the came, and method for producing fiber reinforced resin board
12/28/2005CN1714489A Test by using independently controllable voltage islands
12/28/2005CN1714452A Semiconductor device and its production
12/28/2005CN1714448A Electronic memory component with protection against light attack
12/28/2005CN1714447A Forming a cap above a metal layer
12/28/2005CN1714446A IC tiling pattern method, IC so formed and analysis method
12/28/2005CN1714445A Miniature moldlocks for heatsink or flag for an overmolded plastic package
12/28/2005CN1714444A Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
12/28/2005CN1714443A Method of self-assembling electronic circuitry and circuits formed thereby
12/28/2005CN1714442A Semiconductor device
12/28/2005CN1714439A Integrated antifuse structure for FINFFT and CMOS devices
12/28/2005CN1714261A High power density thermoelectric systems
12/28/2005CN1713808A Power component cooling device
12/28/2005CN1713468A Lids for wafer-scale optoelectronic packages
12/28/2005CN1713398A Thin film transistor (TFT) device structure for reducing starting voltage deviation and its manufacture
12/28/2005CN1713383A Semiconductor device and ferroelectric memory, and method for manufacturing semiconductor device
12/28/2005CN1713380A Electrostatic discharge (ESD) protection for integrated circuit packages
12/28/2005CN1713379A Semiconductor protection device
12/28/2005CN1713378A Fuse of a semiconductor memory device and repair process for the same
12/28/2005CN1713377A Semiconductor device and method for establishing virtual assembly structure on it
12/28/2005CN1713376A Liquid-cooled radiator
12/28/2005CN1713375A Radiator and its production
12/28/2005CN1713374A Heat sink with step fin
12/28/2005CN1713373A Heat dissipation assembly and protective cover for heat conducting media
12/28/2005CN1713354A Semiconductor wafer and manufacturing process for semiconductor device
12/28/2005CN1713308A Dielectric ceramic composition, method for manufacture thereof and multilayer ceramic part
12/28/2005CN1713214A Image pickup device and production method thereof
12/28/2005CN1712732A Oil-proof device of fan
12/28/2005CN1234263C Pin grid array connector with reinforcement plate
12/28/2005CN1234194C 插座连接器 Receptacle connector
12/28/2005CN1234168C Strucuture and method for making decoupling capacitor as radiator on chip
12/28/2005CN1234167C Radiator fin, heat pipe, platter metal integrated radiator
12/28/2005CN1234158C Manufacturing method of packaging base plate and its structure
12/28/2005CN1234153C Semiconductor device and mfg. method thereof
12/27/2005US6981234 Method of ITO layout to make IC bear the high-volt electrostatic discharge
12/27/2005US6980439 EMI shield for transceiver
12/27/2005US6980438 Semiconductor package with heat dissipating structure
12/27/2005US6980436 Computer cooling system
12/27/2005US6980414 Capacitor structure in a semiconductor device
12/27/2005US6980408 ESD protection circuit having a control circuit
12/27/2005US6980085 Wireless communication devices and methods of forming and operating the same
12/27/2005US6980066 High-frequency module
12/27/2005US6979910 Semiconductor package and semiconductor package mounting method
12/27/2005US6979909 Semiconductor device and method of manufacturing same
12/27/2005US6979907 Integrated circuit package
12/27/2005US6979906 Solder on a sloped surface
12/27/2005US6979905 Semiconductor device
12/27/2005US6979904 Integrated circuit package having reduced interconnects
12/27/2005US6979903 Integrated circuit with dielectric diffusion barrier layer formed between interconnects and interlayer dielectric layers
12/27/2005US6979902 Chip size image sensor camera module
12/27/2005US6979901 Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
12/27/2005US6979900 Integrated circuit package with integral leadframe convector and method therefor
12/27/2005US6979899 System and method for high performance heat sink for multiple chip devices
12/27/2005US6979897 Package substrate for improving electrical performance
12/27/2005US6979896 Power gridding scheme
12/27/2005US6979894 Integrated chip package having intermediate substrate
12/27/2005US6979893 Packaged microelectromechanical device with lubricant
12/27/2005US6979891 Integrated circuit packaging architecture
12/27/2005US6979890 Intermediate substrate
12/27/2005US6979889 Plastic lead frames for semiconductor devices
12/27/2005US6979888 LOC semiconductor assembled with room temperature adhesive
12/27/2005US6979887 Support matrix with bonding channel for integrated semiconductors, and method for producing it
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