Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2005
12/29/2005US20050285505 Lamp and method of producing a lamp
12/29/2005US20050285283 Angled elongated features for improved alignment process integration
12/29/2005US20050285282 Tray for semiconductor device and semiconductor device
12/29/2005US20050285281 Pad-limited integrated circuit
12/29/2005US20050285280 Electrostatic discharge (ESD) protection for integrated circuit packages
12/29/2005US20050285279 Method and structure for manufacturing improved yield semiconductor packaged devices
12/29/2005US20050285278 Markings for use with semiconductor device components
12/29/2005US20050285277 Circuit film with bump, film package using the same, and related fabrication methods
12/29/2005US20050285276 Semiconductor device and ferroelectric memory, and method for manufacturing semiconductor device
12/29/2005US20050285275 Fabrication of nano-gap electrode arrays by the construction and selective chemical etching of nano-crosswire stacks
12/29/2005US20050285274 Lead solder indicator and method
12/29/2005US20050285271 Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area
12/29/2005US20050285270 Capacitors in semiconductor devices and methods of fabricating the same
12/29/2005US20050285269 Substantially void free interconnect formation
12/29/2005US20050285268 Alternative interconnect structure for semiconductor devices
12/29/2005US20050285267 Interconnect alloys and methods and apparatus using same
12/29/2005US20050285266 Arrangement for increasing the reliability of substrate-based BGA packages
12/29/2005US20050285265 Frame scale package using contact lines through the elements
12/29/2005US20050285264 High density package with wrap around interconnect
12/29/2005US20050285263 Semiconductor device
12/29/2005US20050285262 Semiconductor device with wire bond inductor and method
12/29/2005US20050285261 Thermal management arrangement with channels structurally adapted for varying heat flux areas
12/29/2005US20050285260 Bottom heat spreader
12/29/2005US20050285259 Semiconductor device with magnetically permeable heat sink
12/29/2005US20050285258 Semiconductor package with exposed heat sink and the heat sink thereof
12/29/2005US20050285257 Encapsulated device with heat isolating structure
12/29/2005US20050285256 Methods of forming semiconductor constructions
12/29/2005US20050285255 Device and method for tilted land grid array interconnects on a coreless substrate package
12/29/2005US20050285254 Semiconducting device having stacked dice
12/29/2005US20050285253 Forming buried via hole substrates
12/29/2005US20050285252 Voltage droop suppressing active interposer
12/29/2005US20050285251 Method of fabricating TFT array panel using aluminum wiring line and TFT array panel using the same method
12/29/2005US20050285250 Stacked multi-chip semiconductor package improving connection reliability of stacked chips
12/29/2005US20050285249 Multi-chip semiconductor connector assemblies
12/29/2005US20050285248 Method and system for expanding flash storage device capacity
12/29/2005US20050285247 Substrate-based die package with BGA or BGA-like components
12/29/2005US20050285246 Microelectronic packages and methods therefor
12/29/2005US20050285245 Substrate strip for a transparent package
12/29/2005US20050285244 Method of embedding semiconductor element in carrier and embedded structure thereof
12/29/2005US20050285243 Integrated circuit packages, systems, and methods
12/29/2005US20050285242 Lids for wafer-scale optoelectronic packages
12/29/2005US20050285241 Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
12/29/2005US20050285240 Semiconductor device and method of manufacturing the same
12/29/2005US20050285239 Ultra thin dual chip image sensor package structure and method for fabrication
12/29/2005US20050285238 Integrated transistor module and method of fabricating same
12/29/2005US20050285237 Leadframe alteration to direct compound flow into package
12/29/2005US20050285236 Dual stage modular optical devices with insert digital diagnostics component
12/29/2005US20050285235 Multi-chip semiconductor connector and method
12/29/2005US20050285234 High-frequency circuit
12/29/2005US20050285233 Thin film transistor (TFT) device structure employing silicon rich silicon oxide passivation layer
12/29/2005US20050285232 Semiconductor constructions
12/29/2005US20050285231 Semiconductor device and method for manufacturing the same
12/29/2005US20050285230 Semiconductor package including a semiconductor device, and method of manufacturing the same
12/29/2005US20050285229 Semiconductor device and method of manufacturing the same
12/29/2005US20050285228 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
12/29/2005US20050285226 Parallel capacitor of semiconductor device
12/29/2005US20050285224 Semiconductor device and manufacturing method thereof
12/29/2005US20050285223 Fuse structure
12/29/2005US20050285222 New fuse structure
12/29/2005US20050285220 Packaging of electronic chips with air-bridge structures
12/29/2005US20050285214 Integrated circuit chip that supports through-chip electromagnetic communication
12/29/2005US20050285207 Nonvolatile semiconductor memory device having strap region and fabricating method thereof
12/29/2005US20050285200 Device for electrostatic discharge protection
12/29/2005US20050285199 Method for producing a semiconductor circuit, and corresponding semiconductor circuit
12/29/2005US20050285198 High voltage device and high voltage device for electrostatic discharge protection circuit
12/29/2005US20050285173 Semiconductor device and method for fabricating the same
12/29/2005US20050285172 Methods of forming vias in multilayer substrates
12/29/2005US20050285155 Semiconductor device-based sensors and methods associated with the same
12/29/2005US20050285152 Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
12/29/2005US20050285148 Memory with polysilicon local interconnects
12/29/2005US20050285147 Circuit apparatus and method of manufacturing the same
12/29/2005US20050285138 Persistent p-type group II-VI semiconductors
12/29/2005US20050285131 Lids for wafer-scale optoelectronic packages
12/29/2005US20050285124 Micro or below scale multi-layered heteostructure
12/29/2005US20050285119 Dynamic p-n junction growth
12/29/2005US20050285117 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
12/29/2005US20050285116 Electronic assembly with carbon nanotube contact formations or interconnections
12/29/2005US20050285105 Pressure inspector and method for inspecting liquid crystal display panels
12/29/2005US20050285104 Apparatus and method of removing particles
12/29/2005US20050285035 Scanning electron microscope and CD measurement calibration standard specimen
12/29/2005US20050284920 Solder bumps formation using solder paste with shape retaining attribute
12/29/2005US20050284658 Components with posts and pads
12/29/2005US20050284616 Advanced microelectronic heat dissipation package and method for its manufacture
12/29/2005US20050284614 Apparatus for reducing evaporator resistance in a heat pipe
12/29/2005US20050284613 [heat pipe cooling system]
12/29/2005US20050284611 Cooling device for electric circuit
12/29/2005US20050284609 Heatsink for power devices
12/29/2005US20050284604 Reducing cooling tube bursts in electronic devices
12/29/2005US20050284515 Method for construction of rigid photovoltaic modules
12/29/2005US20050284366 Systems and methods for building tamper resistant coatings
12/29/2005US20050283975 Circuit board
12/29/2005US20050283955 Detent means for a heat sink
12/29/2005DE19821715B4 Gepacktes integriertes Schaltkreisbauelement und Verfahren zu seiner Herstellung Packed integrated circuit device and process for its preparation
12/29/2005DE19752637B4 Verfahren zur Herstellung einer Leitungsanordnung einer Halbleitereinrichtung A process for producing a line arrangement of a semiconductor device
12/29/2005DE19723203B4 Verfahren zum Herstellen eines Halbleiterbauteils in Chipgröße A method of manufacturing a semiconductor device in chip size
12/29/2005DE19636735B4 Mehrschichtiges Schaltungssubstrat und Verfahren zu seiner Herstellung A multi-layer circuit substrate and method for its preparation
12/29/2005DE10393309T5 Nitrid- und Polysiliziumgrenzschicht mit Titanschicht Nitride and polysilicon boundary layer with titanium layer
12/29/2005DE10392479T5 Spiralförmige Induktionsspule und Übertrager Spiral inductor and transformer
12/29/2005DE102004063926A1 Konfigurierbare Treiberzelle eines logischen Zellenfeldes Configurable driver cell of a logic cell array
12/29/2005DE102004051393A1 Lufthutzenkühler Lufthutzenkühler
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