| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/2006 | US6982220 Semiconductor device power distribution system and method |
| 01/03/2006 | US6982219 Semiconductor device with fuse box and method for fabricating the same |
| 01/03/2006 | US6982203 Method of fabricating integrated circuitry |
| 01/03/2006 | US6982200 Semiconductor device manufacturing method |
| 01/03/2006 | US6982199 Bitline of semiconductor device having stud type capping layer and method for fabricating the same |
| 01/03/2006 | US6982198 Semiconductor device and its manufacturing method |
| 01/03/2006 | US6982197 Method and apparatus for building up large scale on chip de-coupling capacitor on standard CMOS/SOI technology |
| 01/03/2006 | US6982192 High performance thermal interface curing process for organic flip chip packages |
| 01/03/2006 | US6982189 Molded wafer scale cap array |
| 01/03/2006 | US6982176 Method for monitoring production of pixel detectors and detectors produced thereby |
| 01/03/2006 | US6982141 Semiconductor device and manufacturing method thereof |
| 01/03/2006 | US6981849 Electro-osmotic pumps and micro-channels |
| 01/03/2006 | US6981629 Apparatus of clamping semiconductor devices using sliding finger supports |
| 01/03/2006 | US6981585 Surface package type semiconductor package and method of producing semiconductor memory |
| 01/03/2006 | US6981543 Modular capillary pumped loop cooling system |
| 01/03/2006 | US6981542 Multi-heatsink integrated cooler |
| 01/03/2006 | US6981380 Thermoelectric cooling for microelectronic packages and dice |
| 01/03/2006 | US6981322 Cooling apparatus having low profile extrusion and method of manufacture therefor |
| 01/03/2006 | US6981317 Method and device for mounting electronic component on circuit board |
| 01/03/2006 | CA2197627C Antifuse based on silicided single polysilicon bipolar transistor |
| 12/29/2005 | WO2005125298A2 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer |
| 12/29/2005 | WO2005125297A2 Cooling electronic devices in computer systems |
| 12/29/2005 | WO2005125296A1 Cooling device for electric circuit |
| 12/29/2005 | WO2005124862A1 Semiconductor device |
| 12/29/2005 | WO2005124861A1 Memory metal springs for heatsink attachments |
| 12/29/2005 | WO2005124860A2 Memory module cooling |
| 12/29/2005 | WO2005124859A2 Methods and apparatuses for depositing uniform layers |
| 12/29/2005 | WO2005124858A2 Package and method for packaging an integrated circuit die |
| 12/29/2005 | WO2005124857A1 Semiconductor device |
| 12/29/2005 | WO2005124856A2 Method and system for improved wire bonding |
| 12/29/2005 | WO2005124850A1 Semiconductor device and production method for semiconductor device |
| 12/29/2005 | WO2005124257A1 Heat transfer assembly |
| 12/29/2005 | WO2005123988A1 Method of barrier layer surface treatment to enable direct copper plating on barrier metal |
| 12/29/2005 | WO2005123628A1 Anodic bonding process for ceramics |
| 12/29/2005 | WO2005122706A2 Method of aligning semiconductor device and semiconductor structure thereof |
| 12/29/2005 | WO2005117114A3 Programming semiconductor dies for pin map compatibility |
| 12/29/2005 | WO2005106954A3 Power semiconductor circuit and method for producing a power semiconductor circuit |
| 12/29/2005 | WO2005096350A3 Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications |
| 12/29/2005 | WO2005059957A3 Metal interconnect system and method for direct die attachment |
| 12/29/2005 | WO2005045896A3 Lateral high-voltage junction device |
| 12/29/2005 | WO2005041291A3 Mask and method for using the mask in lithographic processing |
| 12/29/2005 | WO2005003250A3 Silicon composition which can be crosslinked into an adhesive gel |
| 12/29/2005 | WO2004109769A3 Microelectromechanical systems and methods for encapsulating |
| 12/29/2005 | WO2003038861A3 A method of stacking layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers |
| 12/29/2005 | US20050288392 Modular board device and high frequency module and method for producing them |
| 12/29/2005 | US20050288173 Rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which after being fired, shows the presence of a main phase having a perovskite structure and an acicular phase containing a rare-earth element; may also contain a bismuth glass |
| 12/29/2005 | US20050288172 Obtained by firing a mixture of a bismuth glass component and a rare earth titanate dielectric component that may also contain Li, Ca and'or Sr, which can be sintered even at a low temperature of 1,000 degrees C. or below |
| 12/29/2005 | US20050288167 Glass: 46 to 60 mass % SiO2, 0.5 to 5 % B2O3, 6 to 17.5 % Al2O3, and 25 to 45 % alkaline earth metal oxide at least 60 % of which is SrO; alumina, titania and cordierite; controlled coefficient of linear thermal expansion; high dielectric constant; reduced warpage of fired product |
| 12/29/2005 | US20050287952 Heat sink formed of multiple metal layers on backside of integrated circuit die |
| 12/29/2005 | US20050287826 Method of sealing low-k dielectrics and devices made thereby |
| 12/29/2005 | US20050287817 Low dielectric constant zinc oxide |
| 12/29/2005 | US20050287803 Semiconductor device having a metal wiring structure and method of manufacturing the same |
| 12/29/2005 | US20050287800 Multilayer interconnection structure and method for forming the same |
| 12/29/2005 | US20050287797 Method of making a semiconductor device manufacturing mask substrate |
| 12/29/2005 | US20050287794 Contact structure |
| 12/29/2005 | US20050287793 Diffusion barrier process for routing polysilicon contacts to a metallization layer |
| 12/29/2005 | US20050287788 Manufacturing method of nanowire array |
| 12/29/2005 | US20050287785 Method of stacking wafers with anisotropic conductive adhesive |
| 12/29/2005 | US20050287784 Interconnect junction providing reduced current crowding and method of manufacturing same |
| 12/29/2005 | US20050287783 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 12/29/2005 | US20050287766 Wafer-level diamond spreader |
| 12/29/2005 | US20050287754 Radiation hardened bipolar junction transistor |
| 12/29/2005 | US20050287716 Electronic device package |
| 12/29/2005 | US20050287715 Method for encapsulating lead frame packages |
| 12/29/2005 | US20050287714 Enhancing epoxy strength using kaolin filler |
| 12/29/2005 | US20050287713 Method for fabricating semiconductor packages |
| 12/29/2005 | US20050287712 Leadframe alteration to direct compound flow into package |
| 12/29/2005 | US20050287711 Leadframe of a leadless flip-chip package and method for manufacturing the same |
| 12/29/2005 | US20050287710 Leadless semiconductor package and method for manufacturing the same |
| 12/29/2005 | US20050287709 Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe |
| 12/29/2005 | US20050287707 Method for fabricating semiconductor packages |
| 12/29/2005 | US20050287706 Electronic device package |
| 12/29/2005 | US20050287705 Flip chip on leadframe package and method for manufacturing the same |
| 12/29/2005 | US20050287704 Carrier for substrate film |
| 12/29/2005 | US20050287703 Multi-chip semiconductor connector assembly method |
| 12/29/2005 | US20050287702 Methods for designing carrier substrates with raised terminals |
| 12/29/2005 | US20050287701 Leadframe for a multi-chip package and method for manufacturing the same |
| 12/29/2005 | US20050287700 Leadframe with a chip pad for two-sided stacking and method for manufacturing the same |
| 12/29/2005 | US20050287699 Electrical package employing segmented connector and solder joint |
| 12/29/2005 | US20050287387 Heat sink for semiconductor; copper molybdenum composite; low cost, high thermoconductivity, thermal expansion coefficient can be matched with silicon and gallium arsenide (GaAs) |
| 12/29/2005 | US20050287355 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin |
| 12/29/2005 | US20050287352 Thermal transient suppression material and method of production |
| 12/29/2005 | US20050287000 Sealing apparatus for an electrical fan |
| 12/29/2005 | US20050286579 Optical subassembly with a heat-radiating fin and an optical transceiver installing the same |
| 12/29/2005 | US20050286234 Thermally conductive composite interface and methods of fabrication thereof for an electronic assembly |
| 12/29/2005 | US20050286233 Radiator structure |
| 12/29/2005 | US20050286232 Heat sink |
| 12/29/2005 | US20050286231 Heat sink with step fin |
| 12/29/2005 | US20050286230 Apparatuses and methods for cooling electronic devices in computer systems |
| 12/29/2005 | US20050286229 Modular heat-dissipation assembly structure for a PCB |
| 12/29/2005 | US20050286227 Cooling integrated circuits using a cold plate with two phase thin film evaporation |
| 12/29/2005 | US20050286226 Heat-generating component cooling structure |
| 12/29/2005 | US20050286198 Universal energy conditioning interposer with circuit architecture |
| 12/29/2005 | US20050286187 Esd preventing-able level shifters |
| 12/29/2005 | US20050286186 Separated power esd protection circuit and integrated circuit thereof |
| 12/29/2005 | US20050286052 Elongated features for improved alignment process integration |
| 12/29/2005 | US20050285794 Apparatus of antenna with heat slug and its fabricating process |
| 12/29/2005 | US20050285668 Semiconductor integrated circuit and designing method for same |
| 12/29/2005 | US20050285662 Integrated circuit apparatus controlling source voltage of MOSFET based on temperature |
| 12/29/2005 | US20050285660 Frequency-independent voltage divider |