Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/16/2014EP2720261A2 Power converter and method for detecting freezing of refrigerant
04/16/2014EP2720260A1 Microchip charge patterning
04/16/2014EP2720236A1 High-voltage integrated metal capacitor and fabrication method
04/16/2014EP2719985A1 A flow distribution module with a patterned cover plate
04/16/2014EP2718969A1 Above motherboard interposer with peripheral circuits
04/16/2014EP2718968A1 Low-stress tsv design using conductive particles
04/16/2014CN203553175U Thin film transistor, array substrate and display
04/16/2014CN203553169U Thin film transistor array substrate and display apparatus including the same
04/16/2014CN203553167U Airtight encapsulation structure of Hall hybrid integrated circuit
04/16/2014CN203553157U Stack-up assembled power modules
04/16/2014CN203553156U Anti-disturbance ball grid array integrated circuit
04/16/2014CN203553155U Integrated circuit package with antistatic protection
04/16/2014CN203553154U Measurement mark
04/16/2014CN203553153U Anti-fuse structure
04/16/2014CN203553152U Semiconductor device
04/16/2014CN203553151U Packaging substrate
04/16/2014CN203553150U Integrated circuit with multichip assembly
04/16/2014CN203553149U Integrated circuit with lead plastic package chip carrier
04/16/2014CN203553148U Leading-wire frame
04/16/2014CN203553147U Leading-wire frame
04/16/2014CN203553146U Leading-wire frame
04/16/2014CN203553145U Leading-wire frame
04/16/2014CN203553144U Leading-wire frame
04/16/2014CN203553143U Leading-wire frame
04/16/2014CN203553142U Matrix array minidip lead frame
04/16/2014CN203553141U Interactive lead frame unit and interactive lead frame
04/16/2014CN203553140U Wafer-level chip TSV packaging structure
04/16/2014CN203553139U Double-projection diode stripe
04/16/2014CN203553138U Superposed power module
04/16/2014CN203553137U Automatic water-supplementing system for water-cooling system of power electronic device
04/16/2014CN203553136U Flip-chip integrated circuit package with inner lead
04/16/2014CN203553135U Transistor electrode cooling fin
04/16/2014CN203553134U Cooling fin and switching power supply thereof
04/16/2014CN203553133U Heat radiating structure of radiator and device
04/16/2014CN203553132U Thin carrier tape-type integrated circuit package
04/16/2014CN203553131U Flat integrated circuit packaging structure with lead in appearance
04/16/2014CN203553130U Packaging structure of plastic flat integrated circuit with leads at four sides
04/16/2014CN203553129U Integrated circuit package with anti-shock function
04/16/2014CN203553128U Copper-nickel alloy package pin grid array-type integrated circuit
04/16/2014CN203553127U A light and thin low-inductance power module
04/16/2014CN203552160U Cooling fin
04/16/2014CN103733361A Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device
04/16/2014CN103733334A Connecting element for a multi-chip module, and multi-chip module
04/16/2014CN103733333A Semiconductor device and method for producing semiconductor device
04/16/2014CN103733332A Mixing manifold and method
04/16/2014CN103733331A Heat dissipating component for semiconductor element
04/16/2014CN103733330A Semiconductor power module, method for manufacturing semiconductor power module, and circuit board
04/16/2014CN103733329A Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
04/16/2014CN103732689A Photo-curable organic-inorganic hybrid resin composition
04/16/2014CN103732642A Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition
04/16/2014CN103732558A Alumina ceramic, and ceramic wiring substrate and ceramic package using same
04/16/2014CN103732557A Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device
04/16/2014CN103732346A Friction stir welding structure and power semiconductor device
04/16/2014CN103731979A Hybrid lamination substrate, manufacturing method thereof and package substrate
04/16/2014CN103730474A Array substrate and manufacturing method thereof and display device
04/16/2014CN103730468A Semiconductor structure, forming method of semiconductor structure, SRAM memory unit and SRAM memorizer
04/16/2014CN103730457A Semiconductor storage device and method for producing the same
04/16/2014CN103730456A High-pressure-resistant photoelectric coupler
04/16/2014CN103730453A Semiconductor device having sensing functionality
04/16/2014CN103730451A Multi-chip packaging body and packaging method
04/16/2014CN103730450A Organic electric excitation light-emitting diode storage capacitor structure and manufacturing method thereof
04/16/2014CN103730449A Advanced faraday shield for a semiconductor device
04/16/2014CN103730448A Package substrate and method of fabricating the same
04/16/2014CN103730447A Package-on-package structure without through assembly vias
04/16/2014CN103730446A Interconnection structure and manufacture method for rigid and flexible combined printed circuit board three-dimensional packaging structure
04/16/2014CN103730445A Circuit board with twinned cu circuit layer and method for manufacturing the same
04/16/2014CN103730444A Packaging assembly and manufacture method thereof
04/16/2014CN103730443A Area array quad flat no lead package (AAQFN) IC chip package in package (PiP) piece with solder balls and production method
04/16/2014CN103730442A Area array quad flat no lead package (AAQFN) package body package in package (PiP) piece with solder balls and production method
04/16/2014CN103730441A Lead frame and method for packaging semiconductor device with lead frame
04/16/2014CN103730440A Packaging structure
04/16/2014CN103730439A IC power supply chip
04/16/2014CN103730438A Chip package and method for manufacturing chip package
04/16/2014CN103730437A Semiconductor structure
04/16/2014CN103730436A Layer-adding structure of circuit carrier plate
04/16/2014CN103730435A Semiconductor structure and manufacturing method thereof
04/16/2014CN103730434A Pop structures and methods of forming the same
04/16/2014CN103730433A Electric conducting plug and forming method of electric conducting plug
04/16/2014CN103730432A Radiator fixing frame fixing device
04/16/2014CN103730431A High-power array light-emitting diode (LED) chip surface radiating structure and manufacturing method
04/16/2014CN103730430A Multilayer composite membrane passivation structure of table top high-power semiconductor device and manufacturing technology of multilayer composite membrane passivation structure of table top high-power semiconductor device
04/16/2014CN103730429A Packaging structure
04/16/2014CN103730428A Packaging structure
04/16/2014CN103730427A Encapsulating package for an integrated circuit
04/16/2014CN103730426A Air cavity type packaging structure and method
04/16/2014CN103730425A Component built-in substrate
04/16/2014CN103730410A Semiconductor device having a self-forming barrier layer at via bottom
04/16/2014CN103730407A Copper connection wire structure and forming method thereof
04/16/2014CN103730384A TFT electrical property measuring method and device
04/16/2014CN103730379A Chip packaging method and structure
04/16/2014CN103730190A Composite copper electroconductive film, preparation method thereof and metal wiring circuit
04/16/2014CN103728804A Motherboard, array substrate, manufacturing method of array substrate, and display device
04/16/2014CN103728795A Array substrate common electrode structure, manufacturing method thereof and array substrate
04/16/2014CN103727054A Bearing, heat dissipation device and electronic equipment
04/16/2014CN103725261A Ternary liquid metal heat interface material with dual melting points
04/16/2014CN103221442B Active ester resin, method for producing same, thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-p film
04/16/2014CN102801338B Three-phase super-power rectification bridge group
04/16/2014CN102796486B Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
04/16/2014CN102643551B Organic silicon semiconductor packaging adhesive composition
04/16/2014CN102593101B Monitoring structure for resistance values of lead-out holes of P type buried layer
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