Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2006
01/04/2006CN1717800A Power semiconductor module
01/04/2006CN1717795A Microelectronic packaging and components
01/04/2006CN1717617A Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
01/04/2006CN1717571A Heat transport apparatus and heat transport apparatus manufacturing method
01/04/2006CN1717169A EMI gasket
01/04/2006CN1716719A 半导体激光器件 The semiconductor laser device
01/04/2006CN1716718A Optical element and its manufacturing method
01/04/2006CN1716644A Flip chip welding bottom plate
01/04/2006CN1716638A 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method thereof
01/04/2006CN1716620A Semiconductor chip and method for manufacturing the same and semiconductor device
01/04/2006CN1716612A Nonvolatile semiconductor memory device having strap region and fabricating method thereof
01/04/2006CN1716604A MOS type semiconductor device having electrostatic discharge protection arrangement
01/04/2006CN1716603A Electronic device, thin film transistor structure and flat panel display having the same
01/04/2006CN1716602A Stacked semiconductor memory device
01/04/2006CN1716597A Semiconductor device
01/04/2006CN1716596A Method for producing static discharging protection in micro module and relative microelectronic module
01/04/2006CN1716595A Semiconductor device and manufacturing method of the same
01/04/2006CN1716594A Separate power source type static discharge protective circuit and integrated circuit using such circuit
01/04/2006CN1716593A Static discharge protective circuit
01/04/2006CN1716592A Connection of electric internal connection line junction and semiconductor device
01/04/2006CN1716591A Semiconductor device and manufacturing method thereof
01/04/2006CN1716590A Semiconductor device and method of manufacturing the same
01/04/2006CN1716589A 半导体器件 Semiconductor devices
01/04/2006CN1716588A Semiconductor device and method of fabricating the same
01/04/2006CN1716587A Interposer, method of fabricating the same, and semiconductor device using the same
01/04/2006CN1716586A Semiconductor device, circuit substrate, electro-optic device and electronic appliance
01/04/2006CN1716585A Processor heat sink retention module and assembly
01/04/2006CN1716584A Diamond composite material radiating fin with heat transfer gradient and its producing method
01/04/2006CN1716583A Combining method and its device for radiating fin and heat pipe
01/04/2006CN1716582A Heat sink fastener
01/04/2006CN1716581A Device mounting board
01/04/2006CN1716580A 电路装置及其制造方法 Circuit device and manufacturing method thereof
01/04/2006CN1716579A Semiconductor package and method for manufacturing the same
01/04/2006CN1716578A Semiconductor device and its producing method
01/04/2006CN1716558A Through electrode and method for forming the same
01/04/2006CN1716533A Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device
01/04/2006CN1716290A Method for making an electronic module or label and medium containing such module or label
01/04/2006CN1716155A Computer CPU heat sink
01/04/2006CN1235458C Fastener of heat radiator
01/04/2006CN1235453C Integrated circuit carrier with recesses
01/04/2006CN1235452C Method of manufacturing an integrated circuit carrier
01/04/2006CN1235337C Electronic device and its producing method
01/04/2006CN1235289C Fuse circuit used for semiconductor integrated circuit
01/04/2006CN1235288C Wire jointing reinforced semiconductor assembly
01/04/2006CN1235287C Joint cushion structure for later stage of copper/low dielectric constant material making process
01/04/2006CN1235286C Electronic device and method for manufacturing this device
01/04/2006CN1235285C Water cooling device for electronics device
01/04/2006CN1235284C Insulation substrate for semi-conductor and power modular
01/04/2006CN1235279C Semiconductor device for making built-in drive small
01/04/2006CN1235277C Method for manufacturing integrated circuit having re-connecting component and corresponding integrated circuit
01/04/2006CN1235276C Method for manufacturing circuit device
01/04/2006CN1235275C Semiconductor module and method for mfg. semiconductor module
01/04/2006CN1235114C Cooling device with electronic apparatus
01/04/2006CN1235113C Heat-dissipating module with heat accumulator
01/04/2006CN1235111C Computer system and speed-controlling method of cooling fan
01/04/2006CN1234919C Electroplating apparatus
01/04/2006CN1234794C Adhesive material
01/04/2006CN1234743C Cross-linked low dielectric high polymer material and film, base plate and electronic part using the same
01/04/2006CN1234644C Method for preparing composite material of aluminum silicon carbide and structural piece
01/03/2006US6982877 Heat sink having compliant interface to span multiple components
01/03/2006US6982876 Printed circuit board assembly
01/03/2006US6982875 Attaching device for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board, a mount board having the board, the semiconductor device, and the heat sink, and an attaching method of the semiconductor device and the heat sink provided on the semiconductor device on the board
01/03/2006US6982874 Thermal solution for electronic devices
01/03/2006US6982869 Folded interposer
01/03/2006US6982496 Semiconductor device having bump electrode and support area
01/03/2006US6982495 Mark configuration, wafer with at least one mark configuration, and a method of producing at least one mark configuration
01/03/2006US6982494 Semiconductor device with signal line having decreased characteristic impedance
01/03/2006US6982493 Wedgebond pads having a nonplanar surface structure
01/03/2006US6982492 No-flow underfill composition and method
01/03/2006US6982491 Sensor semiconductor package and method of manufacturing the same
01/03/2006US6982490 Interface device including a video BIOS component
01/03/2006US6982489 Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween
01/03/2006US6982488 Semiconductor package and method for fabricating the same
01/03/2006US6982487 Wafer level package and multi-package stack
01/03/2006US6982486 Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same
01/03/2006US6982485 Stacking structure for semiconductor chips and a semiconductor package using it
01/03/2006US6982484 Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet
01/03/2006US6982483 High impedance radio frequency power plastic package
01/03/2006US6982482 Packaging of solid state devices
01/03/2006US6982481 System for dissipating heat and shielding electromagnetic radiation produced by an electronic device
01/03/2006US6982480 Monolithic Microwave Integrated Circuits; for automobile steering systems
01/03/2006US6982479 Semiconductor package with leadframe inductors
01/03/2006US6982478 Semiconductor device and method of fabricating the same
01/03/2006US6982477 Integrated circuit
01/03/2006US6982476 Integrated circuit feature layout for improved chemical mechanical polishing
01/03/2006US6982475 Hermetic wafer scale integrated circuit structure
01/03/2006US6982472 Semiconductor device and capacitor
01/03/2006US6982471 Semiconductor memory device
01/03/2006US6982470 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment
01/03/2006US6982465 Semiconductor device with CMOS-field-effect transistors having improved drain current characteristics
01/03/2006US6982463 Integrated circuit with reduced coupling via the substrate
01/03/2006US6982454 Metal-metal capacitor array
01/03/2006US6982445 MRAM architecture with a bit line located underneath the magnetic tunneling junction device
01/03/2006US6982386 Interconnecting substrates for electrical coupling of microelectronic components
01/03/2006US6982380 Encapsulated component which is small in terms of height and method for producing the same
01/03/2006US6982229 Ion recoil implantation and enhanced carrier mobility in CMOS device
01/03/2006US6982227 Single and multilevel rework
01/03/2006US6982226 Method of fabricating a contact with a post contact plug anneal
01/03/2006US6982225 Interposer and method of making same
01/03/2006US6982222 Method of generating interconnection pattern