| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/05/2006 | US20060001174 Semiconductor device and method for manufacturing the same |
| 01/05/2006 | US20060001173 Through electrode and method for forming the same |
| 01/05/2006 | US20060001172 Hermetic seal cover and manufacturing method thereof |
| 01/05/2006 | US20060001171 Electrode contact structure and method for fabricating the same |
| 01/05/2006 | US20060001169 Semiconductor device |
| 01/05/2006 | US20060001168 Technique for forming a dielectric interlayer above a structure including closely spaced lines |
| 01/05/2006 | US20060001167 Semiconductor device |
| 01/05/2006 | US20060001166 Circuit device and manufacturing method thereof |
| 01/05/2006 | US20060001165 Semiconductor device |
| 01/05/2006 | US20060001164 Phase-change random access memory device and method for manufacturing the same |
| 01/05/2006 | US20060001163 Groundless flex circuit cable interconnect |
| 01/05/2006 | US20060001162 Nitride and polysilicon interface with titanium layer |
| 01/05/2006 | US20060001161 Electrical contact for high dielectric constant capacitors and method for fabricating the same |
| 01/05/2006 | US20060001160 Surface treatment of metal interconnect lines |
| 01/05/2006 | US20060001159 Electronic assembly having multi-material interconnects |
| 01/05/2006 | US20060001158 Package stress management |
| 01/05/2006 | US20060001157 Methods and apparatus for integrated circuit ball bonding using stacked ball bumps |
| 01/05/2006 | US20060001156 Semiconductor device |
| 01/05/2006 | US20060001155 Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages |
| 01/05/2006 | US20060001154 Chip-to-chip trench circuit structure |
| 01/05/2006 | US20060001153 Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism |
| 01/05/2006 | US20060001152 Direct connection multi-chip semiconductor element structure |
| 01/05/2006 | US20060001151 Atomic layer deposited dielectric layers |
| 01/05/2006 | US20060001150 Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices |
| 01/05/2006 | US20060001149 Packaged substrate having variable width conductors and a variably spaced reference plane |
| 01/05/2006 | US20060001148 Finger structure |
| 01/05/2006 | US20060001146 Low inductance semiconductor device having half-bridge configuration |
| 01/05/2006 | US20060001145 Wafer level mounting frame with passive components integration for ball grid array packaging |
| 01/05/2006 | US20060001144 Scribe street structure for backend interconnect semiconductor wafer integration |
| 01/05/2006 | US20060001143 Castellation wafer level packaging of integrated circuit chips |
| 01/05/2006 | US20060001142 Castellation wafer level packaging of integrated circuit chips |
| 01/05/2006 | US20060001141 Multi-component integrated circuit contacts |
| 01/05/2006 | US20060001140 Semiconductor chip package with thermoelectric cooler |
| 01/05/2006 | US20060001139 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates |
| 01/05/2006 | US20060001138 IC-tag-bearing wiring board and method of fabricating the same |
| 01/05/2006 | US20060001137 Integrated circuit package including embedded thin-film battery |
| 01/05/2006 | US20060001136 Quad flat non-leaded package |
| 01/05/2006 | US20060001135 Electronic package and semiconductor device using the same |
| 01/05/2006 | US20060001134 Package structure |
| 01/05/2006 | US20060001133 Optical sub-assembly for a transceiver |
| 01/05/2006 | US20060001132 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 01/05/2006 | US20060001131 Memory device power distribution in memory assemblies |
| 01/05/2006 | US20060001130 Taped lead frames and methods of making and using the same in semiconductor packaging |
| 01/05/2006 | US20060001128 Glass substrate and capacitance-type pressure sensor using the same |
| 01/05/2006 | US20060001127 Plasma enhanced deposited, fully oxidized PSG film |
| 01/05/2006 | US20060001122 Semiconductor device and method for manufacturing the same |
| 01/05/2006 | US20060001114 Apparatus and method of wafer level package |
| 01/05/2006 | US20060001112 Semiconductor device and method for manufacturing the same |
| 01/05/2006 | US20060001101 Semiconductor device |
| 01/05/2006 | US20060001100 Method for simulating electrostatic discharge protective circuit |
| 01/05/2006 | US20060001099 Reverse-connect protection circuit with a low voltage drop |
| 01/05/2006 | US20060001098 Electrostatic discharge protection device |
| 01/05/2006 | US20060001097 Semiconductor device and manufacturing method of the same |
| 01/05/2006 | US20060001073 Use of voids between elements in semiconductor structures for isolation |
| 01/05/2006 | US20060001048 Power delivery using an integrated heat spreader |
| 01/05/2006 | US20060001023 Method of manufacturing active matrix substrate with height control member |
| 01/05/2006 | US20060001022 Methods for making nearly planar dielectric films in integrated circuits |
| 01/05/2006 | US20060000916 System and method for encapsulation and protection of components |
| 01/05/2006 | US20060000800 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units |
| 01/05/2006 | US20060000640 Multilayer printed wiring board and a process of producing same |
| 01/05/2006 | US20060000591 Metal matrix composite structure and method |
| 01/05/2006 | US20060000584 Advanced microelectronic heat dissipation package and method for its manufacture |
| 01/05/2006 | DE10243012B4 Vorrichtung zur Wärmedetektion und Verfahren Apparatus for heat detection and methods |
| 01/05/2006 | DE102005024900A1 Halbleiterbauelement Semiconductor device |
| 01/05/2006 | DE102005020972A1 Halbleiterpackung mit leitfähigen Bondhügeln und zugehöriges Herstellungsverfahren Semiconductor package with conductive bumps and manufacturing method thereof |
| 01/05/2006 | DE102004060443A1 Semiconductor device, e.g. metal oxide semiconductor field effect transistor, comprises silicon substrate, insulating film, conductive electrode, and device isolation film |
| 01/05/2006 | DE102004029008A1 Schutzanordnung für eine Halbleiterschaltungsanordnung mit einer Thyristorstruktur und Verfahren zu ihrem Betrieb Protection arrangement for a semiconductor circuit arrangement having a thyristor structure and method for its operation |
| 01/05/2006 | DE102004027788A1 Semiconductor base component for semiconductor component pile, has boundary regions of substrate surrounding chip, with elastic contact unit which is electrically connected with regions of distribution plate |
| 01/05/2006 | DE102004027787A1 Halbleiterbauteile mit Kunststoffgehäuse und Verfahren zur Herstellung derselben Semiconductor devices with plastic housing and methods of making the same |
| 01/05/2006 | DE102004025773A1 Electronic structural component, has two electronic circuits directly bonded with pins and arranged on single lead frame on which two areas are designed, where one area is thermally isolated from other area by heat circumstances |
| 01/05/2006 | DE10126567B4 Integrierte Schaltung Integrated circuit |
| 01/05/2006 | CA2571544A1 Method of manufacture of electronic or functional devices |
| 01/04/2006 | EP1612898A1 Spark gap apparatus and method for electrostatic discharge protection |
| 01/04/2006 | EP1612897A1 Spark gap apparatus and method for electrostatic discharge protection |
| 01/04/2006 | EP1612891A1 Anisotropic electrically conductive film and method of producing the same |
| 01/04/2006 | EP1612866A2 ALGaN/GaN Hemt Devices |
| 01/04/2006 | EP1612860A2 Interposer, method of fabricating the same, and semiconductor device using the same |
| 01/04/2006 | EP1612723A2 Smart label web and manufacturing procedure thereof |
| 01/04/2006 | EP1612194A1 Low-temperature co-fired ceramic material and multilayer wiring board using the same |
| 01/04/2006 | EP1611778A1 Method and arrangement for cooling a substrate, especially a semiconductor |
| 01/04/2006 | EP1611620A1 Led light assembly with active cooling |
| 01/04/2006 | EP1611611A2 Methods for fabricating three-dimensional all organic interconnect structures |
| 01/04/2006 | EP1611610A2 Thermal apparatus for engaging electronic device |
| 01/04/2006 | EP1611609A1 Encapsulated power semiconductor assembly |
| 01/04/2006 | EP1611598A2 Semiconductor alignment aid |
| 01/04/2006 | EP1438745B1 Multiple die interconnect system |
| 01/04/2006 | EP1068537B1 Clamshell cover accelerometer |
| 01/04/2006 | CN2750631Y 散热器 Heat sink |
| 01/04/2006 | CN2750477Y Structure of embedded capacitor via |
| 01/04/2006 | CN2750476Y Circuit realizing chip pin function switching and chip |
| 01/04/2006 | CN2750475Y 导热块 Thermal block |
| 01/04/2006 | CN2750474Y Fastening device for radiator |
| 01/04/2006 | CN2750473Y Fan fixing rack |
| 01/04/2006 | CN2750472Y Structure of radiating fin combination |
| 01/04/2006 | CN2750471Y A novel IC chip |
| 01/04/2006 | CN2750280Y Liquid cooling pipe containing inner spacer plate of liquid cooling type heat abstractor |
| 01/04/2006 | CN1717968A Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 01/04/2006 | CN1717962A Multilayer ceramic substrate and its manufacturing method |
| 01/04/2006 | CN1717802A Semiconductor device having a bond pad and method for its fabrication |
| 01/04/2006 | CN1717801A Surface mountable clip suitable for use in a mobile communication device |