| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2006 | CN1236551C IC oscillator |
| 01/11/2006 | CN1236544C Power inverter |
| 01/11/2006 | CN1236534C Improvement of optical device or its relative part |
| 01/11/2006 | CN1236500C Switch circuit |
| 01/11/2006 | CN1236490C Electronic component mounting method and tool |
| 01/11/2006 | CN1236489C Semiconductor device, method for manufacturing same, circuit board and electronic apparatus |
| 01/11/2006 | CN1236484C Metal contact structure of semiconductor device and method of fabricating the same |
| 01/11/2006 | CN1236479C Method for forming porous dielectric material layer on semiconductor device |
| 01/10/2006 | US6985364 Voltage converter module |
| 01/10/2006 | US6985362 Printed circuit board and electronic package using same |
| 01/10/2006 | US6985359 Variable-wedge thermal-interface device |
| 01/10/2006 | US6985349 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 01/10/2006 | US6985056 High-frequency circuit and high-frequency package |
| 01/10/2006 | US6984896 IC chip package |
| 01/10/2006 | US6984895 Bonding pad structure of a semiconductor device |
| 01/10/2006 | US6984894 Semiconductor package having a partial slot cover for encapsulation process |
| 01/10/2006 | US6984893 Low temperature nitride used as Cu barrier layer |
| 01/10/2006 | US6984892 Semiconductor structure implementing low-K dielectric materials and supporting stubs |
| 01/10/2006 | US6984891 electrical and electronic apparatus comprising dielectric layers having apertures and diffusion barriers on diffusion barrier semiconductor wafers; connecting microstructure transistors and resistors |
| 01/10/2006 | US6984890 Chip-scale package |
| 01/10/2006 | US6984889 Semiconductor device |
| 01/10/2006 | US6984888 Carbonaceous composite heat spreader and associated methods |
| 01/10/2006 | US6984887 Heatsink arrangement for semiconductor device |
| 01/10/2006 | US6984886 System-on-a-chip with multi-layered metallized through-hole interconnection |
| 01/10/2006 | US6984885 Semiconductor device having densely stacked semiconductor chips |
| 01/10/2006 | US6984884 Electric power semiconductor device |
| 01/10/2006 | US6984883 Semiconductor power module |
| 01/10/2006 | US6984882 Semiconductor device with reduced wiring paths between an array of semiconductor chip parts |
| 01/10/2006 | US6984881 Portable, high density electronics including printed circuits having stacks of chips connected using solders; miniaturization |
| 01/10/2006 | US6984880 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
| 01/10/2006 | US6984879 Clamp for pattern recognition |
| 01/10/2006 | US6984878 lead-free semiconductor package comprises semiconductor chips, metal connectors supports for the chip and packaging for encapsulating the chips; miniaturization; efficiency |
| 01/10/2006 | US6984877 Bumped chip carrier package using lead frame and method for manufacturing the same |
| 01/10/2006 | US6984876 Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof |
| 01/10/2006 | US6984875 Semiconductor device with improved reliability and manufacturing method of the same |
| 01/10/2006 | US6984874 Semiconductor device with metal fill by treatment of mobility layers including forming a refractory metal nitride using TMEDT |
| 01/10/2006 | US6984867 Magnetic memory device |
| 01/10/2006 | US6984857 Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same |
| 01/10/2006 | US6984852 Package structure for light emitting diode and method thereof |
| 01/10/2006 | US6984849 Optical cap for semiconductor device |
| 01/10/2006 | US6984792 Dielectric interposer for chip to substrate soldering |
| 01/10/2006 | US6984785 Thermally enhanced cavity-down integrated circuit package |
| 01/10/2006 | US6984685 Multilayer, resilience lamination; polymer matrix containing indium, gallium, or alloy thereof, particles and heat conductive particles |
| 01/10/2006 | US6984594 Deposition method of insulating layers having low dielectric constant of semiconductor devices |
| 01/10/2006 | US6984593 Beta control using a rapid thermal oxidation |
| 01/10/2006 | US6984592 Systems and methods for forming metal-doped alumina |
| 01/10/2006 | US6984591 Precursor source mixtures |
| 01/10/2006 | US6984583 Stereolithographic method for forming insulative coatings for via holes in semiconductor devices |
| 01/10/2006 | US6984581 Structural reinforcement of highly porous low k dielectric films by ILD posts |
| 01/10/2006 | US6984580 Dual damascene pattern liner |
| 01/10/2006 | US6984576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip |
| 01/10/2006 | US6984568 Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same |
| 01/10/2006 | US6984561 Method for making high density nonvolatile memory |
| 01/10/2006 | US6984545 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask |
| 01/10/2006 | US6984542 Method of forming wiring |
| 01/10/2006 | US6984421 Enclosing them with a frame structure consisting of a light-sensitive reaction resin and covering the latter with another structured layer of reaction resin after applying an auxiliary film |
| 01/10/2006 | US6984417 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 01/10/2006 | US6984286 Adjusting fillet geometry to couple a heat spreader to a chip carrier |
| 01/10/2006 | US6983792 High density electronic cooling triangular shaped microchannel device |
| 01/10/2006 | US6983789 System and method for providing cooling systems with heat exchangers |
| 01/10/2006 | US6983551 Interconnecting substrates for electrical coupling of microelectronic components |
| 01/10/2006 | US6983537 Method of making a plastic package with an air cavity |
| 01/10/2006 | US6983536 Method and apparatus for manufacturing known good semiconductor die |
| 01/10/2006 | CA2352095C Thermally conductive composite material |
| 01/10/2006 | CA2232973C Flip chip underfill system and method |
| 01/05/2006 | WO2006002401A1 System and method for measuring time dependent dielectric breakdown |
| 01/05/2006 | WO2006002400A1 System and method for measuring negative bias thermal instability |
| 01/05/2006 | WO2006002213A1 Multiple device package |
| 01/05/2006 | WO2006002158A2 Semiconductor package having integrated metal parts for thermal enhancement |
| 01/05/2006 | WO2006001943A2 Multi-layered thermally conductive sheet |
| 01/05/2006 | WO2006000821A1 Method of manufacture of electronic or functional devices |
| 01/05/2006 | WO2006000291A1 Process for producing a ceramic printed-circuit board |
| 01/05/2006 | WO2006000180A2 Bonding film, semiconductor component comprising a bonding film, and method for the production thereof |
| 01/05/2006 | WO2006000175A1 Electric circuit comprising a carbon conductor structure, and method for the production of a carbon conductor structure of an electric circuit |
| 01/05/2006 | WO2005108897A3 Heat transfer device and method of making same |
| 01/05/2006 | WO2005101499A3 Methods of forming solder bumps on exposed metal pads and related structures |
| 01/05/2006 | WO2005091760A3 Semiconductor package with crossing conductor assembly and method of manufacture |
| 01/05/2006 | WO2005086235A3 Base semi-conductor component for a semi-conductor component stack and method for the production thereof |
| 01/05/2006 | WO2005057652A3 Connector for making electrical contact at semiconductor scales and method for forming same |
| 01/05/2006 | WO2005048311A3 Bump-on-lead flip chip interconnection |
| 01/05/2006 | WO2005036927A3 Lowered pressure point for heat sink retention hardware |
| 01/05/2006 | WO2004097934A3 An encased thermal management device and method of making such a device |
| 01/05/2006 | WO2004076857A3 Method and apparatus for low-cost electrokinetic pump manufacturing |
| 01/05/2006 | WO2003090497A3 Microprocessor controlled heater/cooler system |
| 01/05/2006 | US20060003569 Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
| 01/05/2006 | US20060003497 Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods |
| 01/05/2006 | US20060003496 Modified chip attach process and apparatus |
| 01/05/2006 | US20060003492 Substrate based unmolded package |
| 01/05/2006 | US20060003234 multiple exposure patterning to provide mark; photoresists; integrated circuits |
| 01/05/2006 | US20060002218 Method and apparatus to implement a temperature control mechanism on a memory device |
| 01/05/2006 | US20060002205 Semiconductor device having relief circuit for relieving defective portion |
| 01/05/2006 | US20060002091 Micro heat spreader |
| 01/05/2006 | US20060002090 Heat sink modules for light and thin electronic equipment |
| 01/05/2006 | US20060001181 Terminal structure of multi-layer substrate and method for forming the same |
| 01/05/2006 | US20060001180 In-line wire bonding on a package, and method of assembling same |
| 01/05/2006 | US20060001179 Interposer, method of fabricating the same, and semiconductor device using the same |
| 01/05/2006 | US20060001178 Interconnect shunt used for current distribution and reliability redundancy |
| 01/05/2006 | US20060001177 Semiconductor chip stack |
| 01/05/2006 | US20060001176 Stacked semiconductor device |
| 01/05/2006 | US20060001175 Masking structure having multiple layers including an amorphous carbon layer |