| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/12/2006 | US20060006507 Silicon building block architecture with flex tape |
| 01/12/2006 | US20060006506 Semiconductor device and method of manufacturing same |
| 01/12/2006 | US20060006505 Lead frame for improving molding reliability and semiconductor package with the lead frame |
| 01/12/2006 | US20060006504 Multilayer leadframe module with embedded passive component and method of fabricating the same |
| 01/12/2006 | US20060006503 Insulative coatings for apertures of semiconductor device components and semiconductor device components including insulative coatings |
| 01/12/2006 | US20060006502 Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device |
| 01/12/2006 | US20060006494 Electrically programmable polysilicon fuse with multiple level resistance and programming |
| 01/12/2006 | US20060006487 Chip package substrate having soft circuit board and method for fabricating the same |
| 01/12/2006 | US20060006486 Image sensor package and method of manufacturing the same |
| 01/12/2006 | US20060006481 Method and structure for reducing resistance of a semiconductor device feature |
| 01/12/2006 | US20060006480 Semiconductor integrated circuit device |
| 01/12/2006 | US20060006472 Phase change memory with extra-small resistors |
| 01/12/2006 | US20060006471 Resistor with improved switchable resistance and non-volatile memory device |
| 01/12/2006 | US20060006455 Memory cell with polysilicon local interconnects |
| 01/12/2006 | US20060006433 Electrical passivation of silicon-containing surfaces using organic layers |
| 01/12/2006 | US20060006423 Semiconductor wafer and manufacturing method thereof |
| 01/12/2006 | US20060006422 Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same |
| 01/12/2006 | US20060006384 Special contact points for accessing internal circuitry of an intergrated circuit |
| 01/12/2006 | US20060006383 Single and double-gate pseudo-FET devices for semiconductor materials evaluation |
| 01/12/2006 | US20060006070 Copper conductor |
| 01/12/2006 | US20060005953 Liquid cooling device |
| 01/12/2006 | US20060005952 Heat dissipating appatatus having micro-structure layer and method of fabricating the same |
| 01/12/2006 | US20060005948 Method and apparatus for dissipating heat from an electronic device |
| 01/12/2006 | US20060005625 Acceleration sensor and method of manufacturing acceleration sensor |
| 01/12/2006 | US20060005549 Cooling structure for electronic equipment |
| 01/12/2006 | US20060005383 Method of forming printed circuit card |
| 01/12/2006 | DE202005016964U1 Heat dissipation device, has container with upper and lower chambers, where coolant flows from upper chamber to upper chamber of another container and then from upper chamber of latter container to lower chamber of former container |
| 01/12/2006 | DE19939852B4 Stacked Via mit besonders ausgebildetem Landing Pad für integrierte Halbleiterstrukturen Via Stacked with specially trained Landing Pad for integrated semiconductor structures |
| 01/12/2006 | DE19930308B4 Multichipmodul mit Silicium-Trägersubstrat Multi-chip module with silicon base substrate |
| 01/12/2006 | DE19730118B4 Verfahren und Vorrichtung zur Herstellung einer Chip-Substrat-Verbindung Method and apparatus for producing a chip-substrate connection |
| 01/12/2006 | DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use |
| 01/12/2006 | DE112004000219T5 Gemischtphase-Kompressions-Tantaldünnfilme und Verfahren zum Herstellen derselben Mixed phase compression tantalum thin films and methods of making the same |
| 01/12/2006 | DE10393738T5 Abdichtung poröser Strukturen Sealing of porous structures |
| 01/12/2006 | DE102005030080A1 Hochdichte Packung mit Wrap-Around-Verbindung High density package with wrap-around connection |
| 01/12/2006 | DE102005029174A1 Halbleitervorrichtung mit einem Erfassungsabschnitt und Verfahren zum Herstellen des Gleichen A semiconductor device having a detecting portion and method of manufacturing the same |
| 01/12/2006 | DE102005026637A1 Semiconductor dynamic random access memory device comprises power lines formed on respective metal layers arranged at row and column decoders, having different widths |
| 01/12/2006 | DE102004055817B3 Manufacture procedure for heavy-duty semiconductor modules involves mass of solder to produce solder connection and particles of copper are sprayed into place on solder |
| 01/12/2006 | DE102004030383A1 Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung Bond film and semiconductor device having bonding film and to processes for their preparation |
| 01/12/2006 | DE102004029966A1 Verpolungsschutzschaltung mit niedrigem Spannungsabfall Reverse connection protecting circuit low voltage drop |
| 01/12/2006 | DE102004029586A1 Substratbasiertes Gehäusesbauelement mit einem Halbleiter-Chip Substrate-based housing component having a semiconductor chip |
| 01/12/2006 | DE102004029584A1 Anordnung zur Erhöhung der Zuverlässigkeit von substratbasierten BGA-Packages Arrangement for increasing the reliability of substrate-based BGA Packages |
| 01/12/2006 | DE102004029200A1 Verfahren zur Herstellung eines Gehäuses für eine elektronische Schaltung sowie ein Substrat für ein Gehäuse Method for producing a housing for an electronic circuit and a substrate for a housing |
| 01/12/2006 | DE102004028572A1 Re-wiring device for electronic component, has conducting paths arranged in two sections, which run in respective planes arranged over one another, where planes are insulated form each other and lengths of sections are same |
| 01/12/2006 | DE10135308B4 Elektronisches Bauelement und entsprechendes Herstellungsverfahren The electronic component and corresponding production method |
| 01/12/2006 | DE10108081B4 Anordnung eines Halbleiterchips auf einem Substrat Arrangement of a semiconductor chip on a substrate |
| 01/12/2006 | DE10030442B4 Verbindungselement in einem integrierten Schaltkreis Connection element in an integrated circuit |
| 01/12/2006 | DE10021735B4 Verfahren zur Herstellung eines Halbleiterbauelements mit metallischer Leiterbahn A process for producing a semiconductor device with a metallic conductor track |
| 01/12/2006 | DE10013189B4 Substrat für ein Leistungsmodul Substrate for a power module |
| 01/11/2006 | EP1615485A1 Multilayer printed wiring board |
| 01/11/2006 | EP1615297A1 Anisotropic conductive connector and circuit-device electrical-inspection device |
| 01/11/2006 | EP1615267A1 Metal-base circuit board and its manufacturing method |
| 01/11/2006 | EP1615264A2 Method of manufacturing an electronic parts packaging structure |
| 01/11/2006 | EP1615166A1 Carrier tape for chip modules and method of manufacturing a chip card |
| 01/11/2006 | EP1615138A2 Multiprocessor chip having bidirectional ring interconnect |
| 01/11/2006 | EP1614166A2 Fluidic nanotubes and devices |
| 01/11/2006 | EP1614162A2 Radiation-hardened transistor fabricated by modified cmos process |
| 01/11/2006 | EP1614158A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components |
| 01/11/2006 | EP1614157A1 Electronic packaging structure with integrated distributed decoupling capacitors |
| 01/11/2006 | EP1614155A2 Test structure for electrically verifying the depths of trench-etchings in an soi wafer, and associated working methods |
| 01/11/2006 | EP1614154A2 Overlay metrology mark |
| 01/11/2006 | EP1614153A2 Overlay metrology mark |
| 01/11/2006 | EP1614125A2 Method for producing soldering globules on an electrical component |
| 01/11/2006 | EP1614009A2 Masking arrangement and method for producing integrated circuit arrangements |
| 01/11/2006 | EP1470743B1 Power module |
| 01/11/2006 | EP1454382A4 Interposer assembly for soldered electrical connections |
| 01/11/2006 | EP1352552B1 Interference mitigation through conductive thermoplastic composite materials |
| 01/11/2006 | EP0839321B1 Contact tip structures for microelectronic interconnection elements and methods of making same |
| 01/11/2006 | CN2751509Y Substrate for flip-chip (FC) packaging technology |
| 01/11/2006 | CN2751442Y 静电放电保护电路 Electrostatic discharge protection circuit |
| 01/11/2006 | CN2751441Y Mechanism for coupling radiating fin to chip unit |
| 01/11/2006 | CN2751440Y Auxiliary radiating apparatus for memory module |
| 01/11/2006 | CN1720621A Programmable semiconductor device |
| 01/11/2006 | CN1720617A Metal core substrate packaging |
| 01/11/2006 | CN1720610A Thin CaAs die with copper back-metal structure |
| 01/11/2006 | CN1720355A Metal plating structure and method for production thereof |
| 01/11/2006 | CN1720351A Metallic material for electric or electronic parts |
| 01/11/2006 | CN1720108A Thermally conductive EMI shield |
| 01/11/2006 | CN1719705A Driver package with break-before-make sensing circuit and sensing method |
| 01/11/2006 | CN1719676A Lead frame for semiconductor element and semiconductor device using same |
| 01/11/2006 | CN1719675A 光学模块 Optical module |
| 01/11/2006 | CN1719660A Device of antenna and heat radiation metal plate and mfg. method |
| 01/11/2006 | CN1719628A Air tight high-heat conducting chip packaging assembly |
| 01/11/2006 | CN1719609A Metallized silicon chip with antistantic diode |
| 01/11/2006 | CN1719608A High voltage element for electro static discharge protecting circuit and high voltage element |
| 01/11/2006 | CN1719607A Electrostatic discharge protector |
| 01/11/2006 | CN1719606A Conducting material and mfg. method thereof |
| 01/11/2006 | CN1719605A Fuse structure for semiconductor element |
| 01/11/2006 | CN1719604A Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
| 01/11/2006 | CN1719603A Semiconductor device and method of manufacturing same |
| 01/11/2006 | CN1719602A Driving device and display |
| 01/11/2006 | CN1719601A Crystal packaging structure |
| 01/11/2006 | CN1719600A Method for producing heat pipes |
| 01/11/2006 | CN1719590A Ultrathin module for semiconductor device and method of fabricating the same |
| 01/11/2006 | CN1719587A Movable particle adsorbing method for hybrid integrated circuit |
| 01/11/2006 | CN1718867A Electronic element and electroplating method thereof |
| 01/11/2006 | CN1718664A Preparation method of sealing packing material for in vivo embedding microelectronic device |
| 01/11/2006 | CN1236660C Device mfg. method and apparatus |
| 01/11/2006 | CN1236659C Printed circuit board with built-in passive device, its mfg. method and used substrate |
| 01/11/2006 | CN1236658C Monolithic ceramic electronic element and its producing method and electronic device |
| 01/11/2006 | CN1236641C High frequency module |