| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/17/2006 | US6987058 Methods for underfilling and encapsulating semiconductor device assemblies with a single dielectric material |
| 01/17/2006 | US6987057 Method making bonding pad |
| 01/17/2006 | US6987054 Method of fabricating a semiconductor device having a groove formed in a resin layer |
| 01/17/2006 | US6987033 Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 01/17/2006 | US6987032 Ball grid array package and process for manufacturing same |
| 01/17/2006 | US6987031 Multiple chip semiconductor package and method of fabricating same |
| 01/17/2006 | US6987030 Method of manufacturing semiconductor device |
| 01/17/2006 | US6986965 Device enclosures and devices with integrated battery |
| 01/17/2006 | US6986917 Forming an insulating film by thermally curing the solder photoresist thermosetting resin, forming a small hole with a laser beam, electric plating a lead |
| 01/17/2006 | US6986914 Vapor deposition using metal halide; removal by-products; using scavenger |
| 01/17/2006 | US6986873 A powder mixture of the components is formed and is ignited under an inert atmosphere to prevent promotion of dissociation and to cause the components to react |
| 01/17/2006 | US6986384 Cooling apparatus for dissipating heat from a heat source |
| 01/17/2006 | US6986383 End surface structure of a heat pipe for contact with a heat source |
| 01/17/2006 | US6986382 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers |
| 01/17/2006 | US6986278 Capped microsensor |
| 01/17/2006 | US6986198 Technique provided to form an isolation border in the power plane without the panel falling apart; having a metal layer sandwiched between a pair of photoimageable dielectric layers; photoforming metal filled vias plated-through holes; stability |
| 01/17/2006 | CA2327863C Control circuit for semiconductor device with overheat protecting function |
| 01/12/2006 | WO2006004676A1 Temperature control mechanism on a memory device |
| 01/12/2006 | WO2006004672A1 Components with posts and pads |
| 01/12/2006 | WO2006003133A1 Electronic component with encapsulation |
| 01/12/2006 | WO2006003126A1 Electronic module arrangement and corresponding production method |
| 01/12/2006 | WO2006002615A2 Electrical multi-layered component having a reliable soldering contact |
| 01/12/2006 | WO2006002606A1 Semiconductor component comprising a housing and a semiconductor chip that is partially embedded in a plastic housing substance and method for producing the same |
| 01/12/2006 | WO2005112114A3 Universal interconnect die |
| 01/12/2006 | WO2005109473A3 Adhesion improvement for dielectric layers to conductive materials |
| 01/12/2006 | WO2005101496A3 Method for structured application of a laminatable film to a substrate for a semiconductor module |
| 01/12/2006 | WO2005086233A3 Component with encapsulation suitable for wlp and production method |
| 01/12/2006 | WO2005081316A3 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 01/12/2006 | WO2005074402A3 An integrated circuit |
| 01/12/2006 | WO2005071750A3 Conductive material compositions, apparatus, systems, and methods |
| 01/12/2006 | WO2005034179A3 Integrated circuit suitable for use in radio receivers |
| 01/12/2006 | US20060009933 Configurable voltage regulator |
| 01/12/2006 | US20060009050 Interposer with electrical contact button and method |
| 01/12/2006 | US20060009045 Method of manufacturing semiconductor device |
| 01/12/2006 | US20060009035 Method for forming polysilicon local interconnects |
| 01/12/2006 | US20060009031 Low-K dielectric film with good mechanical strength that varies in local porosity depending on location on substrate - therein |
| 01/12/2006 | US20060009023 Methods of forming electronic structures including conductive shunt layers and related structures |
| 01/12/2006 | US20060009022 Method for forming robust solder interconnect structures by reducing effects of seed layer underetching |
| 01/12/2006 | US20060008989 Method for forming an array with polysilicon local interconnects |
| 01/12/2006 | US20060008988 Method of forming a memory cell |
| 01/12/2006 | US20060008987 Method for forming a floating gate memory with polysilicon local interconnects |
| 01/12/2006 | US20060008974 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/12/2006 | US20060008963 Method for forming polysilicon local interconnects |
| 01/12/2006 | US20060008951 Process monitor and system for producing semiconductor |
| 01/12/2006 | US20060008949 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 01/12/2006 | US20060008947 Semiconductor device |
| 01/12/2006 | US20060008946 Castellation wafer level packaging of integrated circuit chips |
| 01/12/2006 | US20060008945 Integrated circuit stacking system and method |
| 01/12/2006 | US20060008944 Substrate having built-in semiconductor apparatus and manufacturing method thereof |
| 01/12/2006 | US20060008579 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 01/12/2006 | US20060007659 Heat sink clip assembly |
| 01/12/2006 | US20060007638 Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor |
| 01/12/2006 | US20060007636 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods |
| 01/12/2006 | US20060006863 Manufacturing method for magnetic sensor and lead frame therefor |
| 01/12/2006 | US20060006553 Electronic device package |
| 01/12/2006 | US20060006552 Bond pad structure for copper metallization having increased reliability and method for fabricating same |
| 01/12/2006 | US20060006551 Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration |
| 01/12/2006 | US20060006550 Substrate based unmolded package |
| 01/12/2006 | US20060006549 Stacked structure of integrated circuits |
| 01/12/2006 | US20060006548 H2 plasma treatment |
| 01/12/2006 | US20060006547 Semiconductor device and a method of manufacturing the semiconductor device |
| 01/12/2006 | US20060006546 Method for improved process latitude by elongated via integration |
| 01/12/2006 | US20060006545 [semiconductor structure and fabrication therefor] |
| 01/12/2006 | US20060006544 Method of forming a micro solder ball for use in C4 bonding process |
| 01/12/2006 | US20060006543 Semiconductor device |
| 01/12/2006 | US20060006542 Semiconductor device and method for manufacturing the same |
| 01/12/2006 | US20060006541 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device |
| 01/12/2006 | US20060006540 Organic light emitting display having improved via hole |
| 01/12/2006 | US20060006539 Semiconductor device and semiconductor module employing thereof |
| 01/12/2006 | US20060006538 Extreme low-K interconnect structure and method |
| 01/12/2006 | US20060006537 Conductive line structure |
| 01/12/2006 | US20060006536 BGA package and manufacturing method |
| 01/12/2006 | US20060006535 Selective plating of package terminals |
| 01/12/2006 | US20060006534 Microelectronic devices and methods for packaging microelectronic devices |
| 01/12/2006 | US20060006533 Motherboard structure for preventing short circuit |
| 01/12/2006 | US20060006532 Flip-chip without bumps and polymer for board assembly |
| 01/12/2006 | US20060006531 Bonding pad and chip structure |
| 01/12/2006 | US20060006530 Semiconductor device and manufacturing method therefor |
| 01/12/2006 | US20060006529 Semiconductor package and method for manufacturing the same |
| 01/12/2006 | US20060006528 Semiconductor chip having pollished and ground bottom surface portions |
| 01/12/2006 | US20060006527 Audio sound quality enhancement apparatus and method |
| 01/12/2006 | US20060006526 Thermal interposer for cooled electrical packages |
| 01/12/2006 | US20060006525 System and method for dissipating heat from a semiconductor module |
| 01/12/2006 | US20060006524 Light emitting diode having an adhesive layer formed with heat paths |
| 01/12/2006 | US20060006523 Molded package for micromechanical devices and method of fabrication |
| 01/12/2006 | US20060006522 Forming dual metal complementary metal oxide semiconductor integrated circuits |
| 01/12/2006 | US20060006521 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages |
| 01/12/2006 | US20060006520 Semiconductor component and system having back side and circuit side contacts |
| 01/12/2006 | US20060006519 Castellation wafer level packaging of integrated circuit chips |
| 01/12/2006 | US20060006518 Semiconductor component having stacked, encapsulated dice and method of fabrication |
| 01/12/2006 | US20060006517 Multi-chip package having heat dissipating path |
| 01/12/2006 | US20060006516 Stacked semiconductor device and semiconductor memory module |
| 01/12/2006 | US20060006515 Conical housing |
| 01/12/2006 | US20060006514 Interconnecting integrated circuits using MEMS |
| 01/12/2006 | US20060006513 Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers |
| 01/12/2006 | US20060006512 Hydrogen diffusion hybrid port and method of making |
| 01/12/2006 | US20060006511 Ultrathin module for semiconductor device and method of fabricating the same |
| 01/12/2006 | US20060006510 Plastic encapsulated semiconductor device with reliable down bonds |
| 01/12/2006 | US20060006509 Semiconductor device |
| 01/12/2006 | US20060006508 Semiconductor device in which semiconductor chip is mounted on lead frame |