Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2006
01/18/2006EP1034564B1 Process for fabricating semiconductor device including antireflective etch stop layer
01/18/2006EP1029346A4 Vertical interconnect process for silicon segments with thermally conductive epoxy preform
01/18/2006EP0646048B1 Electrically conductive compositions and methods for the preparation and use thereof
01/18/2006CN2752993Y Electric connector combined device
01/18/2006CN2752960Y Power unit applying with large power semiconductor device
01/18/2006CN2752959Y Composite material radiator
01/18/2006CN2752958Y Radiator device with guide structure
01/18/2006CN2752957Y Double-nucleus processor radiator
01/18/2006CN1723587A Integrated circuit package including miniature antenna
01/18/2006CN1723567A Package having exposed integrated circuit device
01/18/2006CN1723565A Wiring substrate and radiation detector using same
01/18/2006CN1723558A High density package interconnect wire bond strip line and method therefor
01/18/2006CN1723557A High density package interconnect power and ground strap and method therefor
01/18/2006CN1723556A Semiconductor package having semiconductor constructing body and method of manufacturing the same
01/18/2006CN1723552A Reduced splattering of unpassivated laser fuses
01/18/2006CN1723551A Semiconductor device and process for producing the same
01/18/2006CN1723544A Fast localization of electrical failures on an integrated circuit system and method
01/18/2006CN1723513A A planar inductive component and an integrated circuit comprising a planar inductive component
01/18/2006CN1723419A Resistor structures to electrically measure unidirectional misalignment of stitched masks
01/18/2006CN1723099A Method and apparatus for high volume assembly of radio frequency identification tags
01/18/2006CN1722948A Semiconductor apparatus and method of manufacturing semiconductor apparatus
01/18/2006CN1722945A Heat sink and heat spreader assembly
01/18/2006CN1722545A Socket for semiconductor device
01/18/2006CN1722481A Package for semiconductor light emitting element and semiconductor light emitting device
01/18/2006CN1722477A Water-cooled LED heat sink
01/18/2006CN1722470A Diode with improved energy impulse rating
01/18/2006CN1722435A Semiconductor device and manufacturing method thereof
01/18/2006CN1722434A Output circuit
01/18/2006CN1722433A Semiconductor device and method for manufacturing the same
01/18/2006CN1722431A Engine control circuit device
01/18/2006CN1722430A Circuit module and method for manufacturing the same
01/18/2006CN1722429A 半导体器件 Semiconductor devices
01/18/2006CN1722428A Semiconductor device having copper wiring and its manufacture method
01/18/2006CN1722427A Interconnection structures for semicondcutor devices and methods of forming the same
01/18/2006CN1722426A Semiconductor unit
01/18/2006CN1722425A Semiconductor structure
01/18/2006CN1722424A Dual damascene wiring and method
01/18/2006CN1722423A Conducting wire frame for improving package reliability and its packaging structure
01/18/2006CN1722422A Semiconductor package
01/18/2006CN1722421A Semiconductor package including redistribution pattern and method of manufacturing the same
01/18/2006CN1722420A 半导体装置 Semiconductor device
01/18/2006CN1722419A Semiconductor device and manufacturing method of the same
01/18/2006CN1722418A Semiconductor device
01/18/2006CN1722417A Bonding pad and chip structure
01/18/2006CN1722416A Coiling radiating fin radiator device
01/18/2006CN1722415A Semiconductor chip having polished and ground bottom surface portions
01/18/2006CN1722414A Semiconductor device and method of manufacturing the same
01/18/2006CN1722413A Optical electronic apparatus and method for producing the same
01/18/2006CN1722412A Package circuit board and package including a package circuit board and method thereof
01/18/2006CN1722404A Novel device structure having enhanced surface adhesion and failure mode analysis
01/18/2006CN1722398A Method for arraying chip of first lining to second lining
01/18/2006CN1722397A Method for reducing or eliminating semiconductor device wire sweep and a device produced by the method
01/18/2006CN1722387A Semiconductor devices and methods of manufacturing the same
01/18/2006CN1722057A Heat dissipation device
01/18/2006CN1722022A Endless belt type transferring apparatus and image forming apparatus
01/18/2006CN1237861C Electronic device of sealed electronic element and manufacturing method and printed circuit board suitable for same electronic device
01/18/2006CN1237854C Method of making microwave, multifunction modules using fluoropolymer substrates
01/18/2006CN1237629C Optoelectronic component and method for the production thereof, module and device comprising a module of this type
01/18/2006CN1237615C Diode structure and its electrostatic discharge protection circuit
01/18/2006CN1237614C Metal electrical interconnection structure
01/18/2006CN1237613C Semiconductor device and producing method thereof
01/18/2006CN1237612C Contactless interconnection system
01/18/2006CN1237611C Method for producing plate shape body, lead wire frame and semiconductor device
01/18/2006CN1237610C Method for producing plate shape body and semiconductor device
01/18/2006CN1237605C 半导体装置 Semiconductor device
01/18/2006CN1237596C High temperature reliability measuring device and method for integrated semiconductor module
01/18/2006CN1237591C Method for mfg. semiconductor device and structure thereof
01/18/2006CN1237512C Magnet head, magnetic disk device
01/18/2006CN1236909C Composite film and lead wire frame covered with the same composite film
01/17/2006US6988048 Portable computer and system controlling method thereof
01/17/2006US6987983 Radio frequency monolithic integrated circuit and method for manufacturing the same
01/17/2006US6987786 Controlling laser polarization
01/17/2006US6987672 Blindmate heat sink assembly
01/17/2006US6987671 improved interfacial strength, and improved interfacial contact which leads to improved heat conduction away from hot areas of a chip
01/17/2006US6987670 Dual power module power system architecture
01/17/2006US6987669 Air guide for equipment enclosure
01/17/2006US6987415 Semiconductor integrated circuit
01/17/2006US6987412 Sense amplifying latch with low swing feedback
01/17/2006US6987326 Methods and apparatus for improving high frequency input/output performance
01/17/2006US6987325 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
01/17/2006US6987323 electroconductivity; connector comprises slit for dispersing applied stress
01/17/2006US6987322 Contact etching utilizing multi-layer hard mask
01/17/2006US6987321 for forming dual damascene interconnect structure; semiconductors; depositing copper sulfide interface layer as sidewalls to the opening deters migration or diffusion of copper ions into the dielectric material
01/17/2006US6987320 Pressure-welded semiconductor device
01/17/2006US6987319 Wafer-level chip-scale package
01/17/2006US6987318 Diamond composite heat spreader having thermal conductivity gradients and associated methods
01/17/2006US6987317 Power delivery using an integrated heat spreader
01/17/2006US6987316 Multilayer ceramic substrate with single via anchored pad and method of forming
01/17/2006US6987315 Ceramic multilayer substrate
01/17/2006US6987314 Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
01/17/2006US6987313 Semiconductor device
01/17/2006US6987312 Semiconductor device with sensor and/or actuator surface and method for producing it
01/17/2006US6987311 Thin film transistors of a thin film transistor liquid crystal display and method for fabricating the same
01/17/2006US6987307 Stand-alone organic-based passive devices
01/17/2006US6987301 Electrostatic discharge protection
01/17/2006US6987300 High voltage ESD-protection structure
01/17/2006US6987296 Semiconductor device having contact hole with improved aspect ratio
01/17/2006US6987068 Methods to planarize semiconductor device and passivation layer
01/17/2006US6987066 Dry etching method and semiconductor device manufacturing method
01/17/2006US6987060 Semiconductor device having improved contact hole structure and method for fabricating the same