| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/19/2006 | US20060012055 Semiconductor package including rivet for bonding of lead posts |
| 01/19/2006 | US20060012054 High wireability microvia substrate |
| 01/19/2006 | US20060012053 Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding |
| 01/19/2006 | US20060012052 Dual damascene wiring and method |
| 01/19/2006 | US20060012051 Production process and production apparatus of three-dimensionally structured material |
| 01/19/2006 | US20060012050 Semiconductor device, designing method thereof, and recording medium storing semicondcutor designing program |
| 01/19/2006 | US20060012049 Top layers of metal for high performance IC's |
| 01/19/2006 | US20060012048 Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
| 01/19/2006 | US20060012047 Method of manufacturing semiconductor device |
| 01/19/2006 | US20060012046 Semiconductor device having copper wiring and its manufacture method |
| 01/19/2006 | US20060012045 Design of beol patterns to reduce the stresses on structures below chip bondpads |
| 01/19/2006 | US20060012044 Plating method |
| 01/19/2006 | US20060012043 Plasma display device |
| 01/19/2006 | US20060012042 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same |
| 01/19/2006 | US20060012041 Connection between two circuitry components |
| 01/19/2006 | US20060012040 Semiconductor package |
| 01/19/2006 | US20060012039 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow |
| 01/19/2006 | US20060012038 Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device |
| 01/19/2006 | US20060012037 Methods for bonding and devices according to such methods |
| 01/19/2006 | US20060012036 Circuit device with at least partial packaging and method for forming |
| 01/19/2006 | US20060012035 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 01/19/2006 | US20060012034 Engine control circuit device |
| 01/19/2006 | US20060012033 Semiconductor device and a method of manufacturing the same |
| 01/19/2006 | US20060012032 Electronic device with semiconductor chip including a radiofrequency power module |
| 01/19/2006 | US20060012031 Heat dissipation device for integrated circuits |
| 01/19/2006 | US20060012030 Multi-conducting through hole structure |
| 01/19/2006 | US20060012029 Semiconductor device |
| 01/19/2006 | US20060012028 Device mounting board |
| 01/19/2006 | US20060012027 Thermally isolated via structure |
| 01/19/2006 | US20060012026 Semiconductor package and method for its manufacture |
| 01/19/2006 | US20060012025 Semiconductor device and manufacturing method therefor |
| 01/19/2006 | US20060012024 Semiconductor chip assembly with metal containment wall and solder terminal |
| 01/19/2006 | US20060012023 Method of manufacturing a data carrier |
| 01/19/2006 | US20060012022 Integrated circuit die with pedestal |
| 01/19/2006 | US20060012021 Film bulk acoustic resonator package and method of fabricating same |
| 01/19/2006 | US20060012020 Wafer-level assembly method for semiconductor devices |
| 01/19/2006 | US20060012019 Semiconductor package |
| 01/19/2006 | US20060012018 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
| 01/19/2006 | US20060012017 Semiconductor device and method of manufacturing the same |
| 01/19/2006 | US20060012016 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
| 01/19/2006 | US20060012015 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 01/19/2006 | US20060012012 Semiconductor device with crack prevention ring and method of manufacture thereof |
| 01/19/2006 | US20060012005 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies |
| 01/19/2006 | US20060012002 Device for mounting a semiconductor package on a support plate via a base |
| 01/19/2006 | US20060011960 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage |
| 01/19/2006 | US20060011947 Semiconductor structures and memory device constructions |
| 01/19/2006 | US20060011920 Thin film transistor array panel and manufacturing method thereof |
| 01/19/2006 | US20060011911 Detection of molecular probes fixed to an active zone of a sensor |
| 01/19/2006 | US20060011703 Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device |
| 01/19/2006 | US20060011336 Thermal management system and computer arrangement |
| 01/19/2006 | US20060011334 High density electronic cooling triangular shaped microchannel device |
| 01/19/2006 | US20060011330 Heat dissipating device |
| 01/19/2006 | DE202005017671U1 Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container |
| 01/19/2006 | DE202005017189U1 Cooling device for CPU of motherboard, has heat dissipating conduit running transversely between cooling substrate and ribbed cooling assembly with high difference, so that dissipating region lies more highly than absorption region |
| 01/19/2006 | DE202005017108U1 Cooling body assembly for use in e.g. CPU of personal computer, has radiation ribs firmly connected with each other and each including two assembly flanges arranged parallel on both sides of radiation rib, which lie opposite to each other |
| 01/19/2006 | DE19732439B4 Leistungshalbleiterbauelement auf Kühlkörper Power semiconductor component on heat sink |
| 01/19/2006 | DE112004000248T5 UV-Abblockschicht zum Reduzieren der UV-Induzierten Aufladung von SONOS-Doppelbit-Flash-Speicher-Einrichtungen in der Beol-Bearbeitung UV Abblockschicht for reducing UV-induced charging of SONOS dual bit flash memory devices in the Beol processing |
| 01/19/2006 | DE112004000184T5 Abhilfsmaßnahmen zum Verhindern eines Berstens in einem Flüssigkeitssystem Remedial action to prevent a rupture in a fluid system |
| 01/19/2006 | DE10238582B4 Verfahren zur Herstellung eines Verbundes aus einer getesteten integrierten Schaltung und einer elektrischen Einrichtung A process for preparing a composite of a tested integrated circuit and an electrical device |
| 01/19/2006 | DE102005029267A1 Leuchtdiode mit Kleberschicht sowie zugehöriges Herstellverfahren LED with adhesive layer and associated manufacturing processes |
| 01/19/2006 | DE102005027234A1 Verbindungsstrukturen für Halbleitervorrichtungen und Verfahren zum Bilden derselben Connecting structures for semiconductor devices and method of forming same |
| 01/19/2006 | DE102005025160A1 Latch-up suppressing method involves switching OFF supply voltage following latch-up, reducing charge located in circuit and temporarily canceling detection of low voltage |
| 01/19/2006 | DE102005021700A1 Protective casing for electrical or electronic components, especially light-emitting diodes, comprises a pressure-stable, translucent, sterilizable plastic |
| 01/19/2006 | DE102005003320B3 Finishing and marking system for surface of integrated circuit building blocks has transport member with speed and position sensors and laser station for engraving surface of building blocks |
| 01/19/2006 | DE102004055040A1 Verfahren zum Schneiden eines Laminats mit einem Laser und Laminat A method of cutting a laminate with a laser and laminate |
| 01/19/2006 | DE102004051361A1 Verfahren und System zum hermetischen Abdichten von Packungen für optische Bauelemente Method and system for hermetic sealing of packings for optical components |
| 01/19/2006 | DE102004031685A1 Housing for an optoelectronic component has central heat dissipating element with central thermal contact region surrounded by ring of chip mounting surfaces |
| 01/19/2006 | DE102004031623A1 Power semiconductor module with connections to control circuit, has casing with spring-loaded contact making external connection and having an internal bonding surface |
| 01/19/2006 | DE102004031455A1 Verfahren zur Erstellung eines ESD-Schutzes bei einem mikroelektronischen Baustein und entsprechend ausgebildeter mikroelektronischer Baustein A process for the preparation of an ESD-protection in a microelectronic device and correspondingly formed microelectronic module |
| 01/19/2006 | DE102004031318A1 Premold housing for receiving a component, useful particularly for preparing microelectronic or sensor modules, comprises housing body and metal lead frame |
| 01/19/2006 | DE102004031128A1 Elektrischer Schaltkreis mit einer Kohlenstoff-Leiterstruktur und Verfahren zum Herstellen einer Kohlenstoff-Leiterstruktur eines elektrischen Schaltkreises Electrical circuit having a carbon-conductor structure and method of manufacturing a carbon-conductor structure of an electric circuit |
| 01/19/2006 | DE102004031112A1 Electronic circuit for chips for adjusting the node points of a circuit to give a given potential different from a reference node has series switches to give an adjustable voltage drop |
| 01/19/2006 | DE102004030813A1 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 01/19/2006 | DE102004030443A1 Control apparatus especially a surface mounted power element has power component in a housing with both upper and lower heat dissipating surfaces |
| 01/19/2006 | DE102004030140B3 Flexible Kontaktierungsvorrichtung Flexible contacting |
| 01/19/2006 | DE102004030042A1 Halbleiterbauelement Semiconductor device |
| 01/19/2006 | DE102004029587A1 Substratbasiertes BGA-Gehäuse, insbesondere FBGA-Gehäuse Substrate-based BGA package, in particular FBGA package |
| 01/19/2006 | DE102004029585A1 Chip package used as a ball grid array package comprises a reinforcing layer fixed to a system carrier |
| 01/19/2006 | DE102004020497B3 Method of producing electrical contacts through a composite sheet of semiconductor chips and plastic having conductive particles applies high voltage across sheet |
| 01/19/2006 | DE10131940B4 Halbleiterchip und Verfahren zur Ausbildung von Kontakten auf einer Halbleiteranordnung Semiconductor chip and method for forming contacts on a semiconductor device |
| 01/19/2006 | DE10021595B4 Anordnung zur Auswahl der Konfiguration integrierter Halbleiterschaltungen Means for selecting the configuration of semiconductor integrated circuits |
| 01/18/2006 | EP1617519A2 High density connector |
| 01/18/2006 | EP1617494A2 Organic photovoltaic component with encapsulation |
| 01/18/2006 | EP1617475A1 Semiconductor device |
| 01/18/2006 | EP1617473A1 Electronic device comprising an ESD device |
| 01/18/2006 | EP1617472A1 An active protection device for protecting a circuit against mechanical and electromagnetic attack |
| 01/18/2006 | EP1617471A1 Semiconductor lasers device |
| 01/18/2006 | EP1617469A2 Semiconductor device having copper wiring and its manufacturing method |
| 01/18/2006 | EP1617300A2 Endless belt type transferring apparatus and image forming apparatus |
| 01/18/2006 | EP1616353A2 Layered microelectronic contact and method for fabricating same |
| 01/18/2006 | EP1616352A1 Helical microelectronic contact and method for fabricating same |
| 01/18/2006 | EP1616351A2 Heatsink assembly |
| 01/18/2006 | EP1616350A2 Semiconductor multipackage module including processor and memory package assemblies |
| 01/18/2006 | EP1616349A2 Method and apparatus for optically aligning integrated circuit devices |
| 01/18/2006 | EP1616348A1 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material |
| 01/18/2006 | EP1616337A2 Thermal interconnect and interface systems, methods of production and uses thereof |
| 01/18/2006 | EP1616244A2 Dynamic fluid spray jet delivery system |
| 01/18/2006 | EP1615970A1 Acrylic-based thermally conductive composition and thermally conductive sheet |
| 01/18/2006 | EP1307918B1 Wiring through terminal via fuse window |
| 01/18/2006 | EP1269807B1 Method for fabricating electrical connecting element, and electrical connecting element |