| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/24/2006 | US6989606 BGA substrate via structure |
| 01/24/2006 | US6989605 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 01/24/2006 | US6989604 Conformal barrier liner in an integrated circuit interconnect |
| 01/24/2006 | US6989603 nF-Opening Aiv Structures |
| 01/24/2006 | US6989602 Dual damascene process with no passing metal features |
| 01/24/2006 | US6989601 treatment of surface with flow of ammonia gas with nitrogen to remove copper oxides; PEVCD of silicon carbide from trimethylsilane; improved capping layer adhesion, wafer-to-wafer uniformity and increased control speed for intergrated circuits |
| 01/24/2006 | US6989600 Integrated circuit device having reduced substrate size and a method for manufacturing the same |
| 01/24/2006 | US6989599 Copper interconnect between ruthenium layers; prevents voids due to electromigration of copper |
| 01/24/2006 | US6989597 Semiconductor integrated circuit and method of manufacturing the same |
| 01/24/2006 | US6989596 Semiconductor laser manufacturing method and semiconductor laser |
| 01/24/2006 | US6989595 contact lithography; low-k dielectrics; reverse images |
| 01/24/2006 | US6989594 Device for cooling hot spot in micro system |
| 01/24/2006 | US6989593 Die-up ball grid array package with patterned stiffener opening |
| 01/24/2006 | US6989592 Integrated power module with reduced thermal impedance |
| 01/24/2006 | US6989591 Method for making an integrated circuit of the surface-mount type and resulting circuit |
| 01/24/2006 | US6989590 Power semiconductor device with a control circuit board that includes filled through holes |
| 01/24/2006 | US6989589 Programmable sensor array |
| 01/24/2006 | US6989588 Semiconductor device including molded wireless exposed drain packaging |
| 01/24/2006 | US6989587 Semiconductor device and manufacturing the same |
| 01/24/2006 | US6989586 Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems |
| 01/24/2006 | US6989585 Surface-mounting semiconductor device and method of making the same |
| 01/24/2006 | US6989584 Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead |
| 01/24/2006 | US6989583 Semiconductor device |
| 01/24/2006 | US6989582 Method for making a multi-die chip |
| 01/24/2006 | US6989577 Semiconductor device having multiple insulation layers |
| 01/24/2006 | US6989572 Symmetrical high frequency SCR structure |
| 01/24/2006 | US6989559 Discrete circuit component having fabrication stage clogged through-holes and process of making the same |
| 01/24/2006 | US6989551 Test structure for determining a minimum tunnel opening size in a non-volatile memory |
| 01/24/2006 | US6989512 Heat generator |
| 01/24/2006 | US6989508 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 01/24/2006 | US6989493 Electrical feedthrough assembly for a sealed housing |
| 01/24/2006 | US6989334 Manufacturing method of a semiconductor device |
| 01/24/2006 | US6989330 Semiconductor device and method of manufacture thereof |
| 01/24/2006 | US6989325 Self-assembled nanometer conductive bumps and method for fabricating |
| 01/24/2006 | US6989301 Method for manufacturing semiconductor device |
| 01/24/2006 | US6989298 Method of forming thin-film transistor devices with electro-static discharge protection |
| 01/24/2006 | US6989297 Variable thickness pads on a substrate surface |
| 01/24/2006 | US6989296 Fabrication method of semiconductor package with photosensitive chip |
| 01/24/2006 | US6989294 Leadless plastic chip carrier with etch back pad singulation |
| 01/24/2006 | US6989293 Thermally enhanced packaging structure and fabrication method thereof |
| 01/24/2006 | US6989292 Chips with wafer scale caps formed by molding |
| 01/24/2006 | US6989291 Method for manufacturing circuit devices |
| 01/24/2006 | US6989285 Method of fabrication of stacked semiconductor devices |
| 01/24/2006 | US6988882 Transfer molding of integrated circuit packages |
| 01/24/2006 | US6988871 Heat sink attachment clip |
| 01/24/2006 | US6988668 IC card and method of manufacturing the same |
| 01/24/2006 | US6988537 Cooling unit having a plurality of heat-radiating fins, and electronic apparatus with the cooling unit |
| 01/24/2006 | US6988536 Tubular heat dissipation device |
| 01/24/2006 | US6988535 Channeled flat plate fin heat exchange system, device and method |
| 01/24/2006 | US6988534 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| 01/24/2006 | US6988533 Method and apparatus for mounting a heat transfer apparatus upon an electronic component |
| 01/24/2006 | US6988531 Micro-chimney and thermosiphon die-level cooling |
| 01/24/2006 | US6988315 Cooling apparatus having low profile extrusion and method of manufacture therefor |
| 01/24/2006 | US6988312 Method for producing multilayer circuit board for semiconductor device |
| 01/24/2006 | US6988307 Method of making an integrated inductor |
| 01/19/2006 | WO2006007297A1 Elongated features for improved alignment process integration |
| 01/19/2006 | WO2006007281A1 Solder bumps formation using paste retaining its shape after uv irradiation |
| 01/19/2006 | WO2006007163A1 Heat dissipating device with enhanced boiling/condensation structure |
| 01/19/2006 | WO2006007162A2 Thermoelectric module |
| 01/19/2006 | WO2006007144A2 Scribe street structure in semiconductor wafer |
| 01/19/2006 | WO2006007141A2 Lead solder indicator and method |
| 01/19/2006 | WO2006006987A1 Novel conductor geometry for electronic circuits fabricated on flexible substrates |
| 01/19/2006 | WO2006006849A2 Carrier for electronic components and method for separating segments from such a carrier |
| 01/19/2006 | WO2006006593A1 Epoxy resin molding material for sealing and electronic component device |
| 01/19/2006 | WO2006005325A1 Heat exchange system |
| 01/19/2006 | WO2006005317A2 Method for the production of an electric component and component |
| 01/19/2006 | WO2006005095A1 Material for conductor tracks made of copper alloy |
| 01/19/2006 | WO2005112125A3 Misalignment-tolerant multiplexing/demultiplexing architectures |
| 01/19/2006 | WO2005109499A3 Semiconductor component provided with a rewiring substrate and method for the production thereof |
| 01/19/2006 | WO2005109485A3 Metallic air-bridges |
| 01/19/2006 | WO2005104211A3 Land grid array packaged device and method of forming same |
| 01/19/2006 | WO2005101460A3 Bonding an interconnect to a circuit device and related devices |
| 01/19/2006 | WO2005096242A3 Apparatus and method of power control |
| 01/19/2006 | WO2005088708A3 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures |
| 01/19/2006 | WO2005084313A3 Non-uniformly heated power device with fluidic cooling |
| 01/19/2006 | WO2005062355A8 Capacitor |
| 01/19/2006 | WO2005050407A3 Systems and methods for credit card charge validation over a network |
| 01/19/2006 | US20060014873 Encapsulating epoxy resin composition, and electronic parts device using the same |
| 01/19/2006 | US20060014860 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 01/19/2006 | US20060014380 Production method for wiring structure of semiconductor device |
| 01/19/2006 | US20060014379 Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry |
| 01/19/2006 | US20060014376 Stacked via-stud with improved reliability in copper metallurgy |
| 01/19/2006 | US20060014374 Layer assembly and method for producing a layer assembly |
| 01/19/2006 | US20060014356 Metal-insulator-metal capacitor and method of fabricating same |
| 01/19/2006 | US20060014326 Method for fabricating a semiconductor component with contacts situated at the underside |
| 01/19/2006 | US20060014319 Castellation wafer level packaging of integrated circuit chips |
| 01/19/2006 | US20060014318 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same |
| 01/19/2006 | US20060014317 Integrated circuit package having reduced interconnects |
| 01/19/2006 | US20060014308 Procedure for arranging chips of a first substrate on a second substrate |
| 01/19/2006 | US20060012966 Electronic assemblies and systems comprising interposer with embedded capacitors |
| 01/19/2006 | US20060012961 Heat-dissipating fin assembly for heat sink |
| 01/19/2006 | US20060012960 Heat sink and retaining clip assembly |
| 01/19/2006 | US20060012958 Electronic apparatus |
| 01/19/2006 | US20060012957 Duct for cooling multiple components in a processor-based device |
| 01/19/2006 | US20060012728 Display device and method for repairing line disconnection thereof |
| 01/19/2006 | US20060012460 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin |
| 01/19/2006 | US20060012458 Fuse structure |
| 01/19/2006 | US20060012384 Semiconductor substrate and test pattern for the same |
| 01/19/2006 | US20060012383 Semiconductor substrate and test pattern for the same |
| 01/19/2006 | US20060012056 Semiconductor chip resin encapsulation method |