| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/26/2006 | US20060017145 Semiconductor package with heat sink |
| 01/26/2006 | US20060017144 Semiconductor device |
| 01/26/2006 | US20060017143 Semiconductor device and its manufacturing method |
| 01/26/2006 | US20060017142 Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof |
| 01/26/2006 | US20060017141 Power semiconductor package |
| 01/26/2006 | US20060017140 Flashless lead frame with horizontal singulation |
| 01/26/2006 | US20060017134 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit |
| 01/26/2006 | US20060017111 Semiconductor device and method of fabricating the same |
| 01/26/2006 | US20060017109 High voltage ESD-protection structure |
| 01/26/2006 | US20060017087 Semiconductor device and method of manufacturing the same utilizing permittivity of an insulating layer to provide a desired cross conductive layer capacitance property |
| 01/26/2006 | US20060017069 Superior piezoelectric/electrostrictive characteristics without containing lead (Pb) and which can obtain an especially large displacement |
| 01/26/2006 | US20060017051 Apparatus having photoelectric converting element, and device manufacturing method |
| 01/26/2006 | US20060016895 Non-contact communication system information carrier |
| 01/26/2006 | DE20321147U1 Semiconductor device, has one semiconductor chip including set of bumps with different heights is face-bonded on either of mount substrate and another chip, which is die-bonded on mount substrate |
| 01/26/2006 | DE19916177B4 Verfahren zum Kontaktieren des Halbleiterchips und Halbleiterchip mit drahtförmigen Anschlußstücken Method of contacting of the semiconductor chip and the semiconductor chip with wire-shaped connecting pieces |
| 01/26/2006 | DE19523580B4 Geformte optische Verbindung Shaped optical connection |
| 01/26/2006 | DE10393611T5 Verfahren und Vorrichtung für eine effiziente vertikale Fluidzufuhr zum Kühlen einer Wärme erzeugenden Vorrichtung Method and apparatus for efficient vertical fluid supply for cooling a heat-generating device |
| 01/26/2006 | DE102004047752B3 Halbleiterbauteil mit Temperatursensor Semiconductor device with temperature sensor |
| 01/26/2006 | DE102004033227A1 Metall-Keramik-Substrat A metal-ceramic substrate |
| 01/26/2006 | DE102004032984A1 Bauraumoptimierte Sensoranbindung Space-optimized sensor connection |
| 01/26/2006 | DE102004032928A1 RF-Modul mit verbesserter Integration RF module with improved integration |
| 01/26/2006 | DE102004032761A1 Strip conductor production method for complex-structured strip conductor surfaces with contact surfaces on electronic components deposits a germinal coating on a surface with bond pads |
| 01/26/2006 | DE102004032605A1 Halbleiterbauteil mit einem Halbleiterchip und elektrischen Verbindungselementen zu einer Leiterstruktur A semiconductor device comprising a semiconductor chip and electrical connecting elements to a printed circuit structure |
| 01/26/2006 | DE102004032374A1 Diode mounting to act as a current redresser's heat sink for rotary current generators has an opening for holding a diode as well as reference and diode-base surfaces |
| 01/26/2006 | DE102004032371A1 Elektronische Schaltungseinheit An electronic circuit unit |
| 01/26/2006 | DE102004032368A1 Cooling structure for a circuit layout has a connecting element on a heat sink for transferring the circuit's heat energy onto the heat sink via the connecting element |
| 01/26/2006 | DE102004031997A1 Gehäuse für ein Halbleiter-Bauelement und Halbleiter-Bauelement-Test-System zum Testen der Kontaktierung bei übereinander angeordneten Halbleiter-Bauelementen A housing for a semiconductor device and semiconductor device testing system for testing the contact in superposed semiconductor devices |
| 01/26/2006 | DE102004031889A1 Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device having a housing and a partially embedded in a plastic housing compound semiconductor chip and method for producing |
| 01/26/2006 | DE102004031687A1 Leistungsverstärkeranordnung und Verfahren zum Verarbeiten eines Hochfrequenzsignals Power amplifier arrangement and method for processing a high-frequency signal |
| 01/26/2006 | DE102004031391A1 Gehäuse für ein elektronisches Bauteil Housing for an electronic component |
| 01/26/2006 | DE102004030800A1 Verfahren zur Herstellung einer keramischen Leiterplatte A process for producing a ceramic circuit board |
| 01/26/2006 | DE102004026100A1 ESD-Schutzstrukturen für Halbleiterbauelemente ESD protection structures for semiconductor devices |
| 01/26/2006 | DE102004009055B4 Kühlanordnung für Geräte mit Leistungshalbleitern und Verfahren zum Kühlen derartiger Geräte A cooling arrangement for units with power semiconductors and method for cooling such equipment |
| 01/26/2006 | DE10154878B4 Halteelement zur Fixierung eines elektronischen Leistungsbauteils an einem Kühlkörper Holding member for fixing an electronic power component to a heat sink |
| 01/26/2006 | CA2578687A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/26/2006 | CA2574230A1 Heat pipe heat sink |
| 01/26/2006 | CA2574200A1 Hybrid wicking materials for use in high performance heat pipes |
| 01/25/2006 | EP1619722A1 Method for manufacturing backside-illuminated optical sensor |
| 01/25/2006 | EP1618712A2 Signal isolators using micro-transformers |
| 01/25/2006 | EP1618609A1 Programmable semiconductor device |
| 01/25/2006 | EP1618607A2 Semiconductor device comprising a field-effect transistor and method of operating the same |
| 01/25/2006 | EP1618606A2 Circuit device with at least partial packaging and method for forming |
| 01/25/2006 | EP1618605A1 Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | EP1144973B1 Method of producing calibration structures in semiconductor substrates |
| 01/25/2006 | EP1112125B1 Metallization structures for microelectronic applications and process for forming the structures |
| 01/25/2006 | EP1062618A4 Non-lot based method for assembling integrated circuit devices |
| 01/25/2006 | CN2754213Y Base board for upside-down mounting LED chip |
| 01/25/2006 | CN1726638A Single package multi-chip RF power amplifier |
| 01/25/2006 | CN1726592A Poly-silicon stringer fuse |
| 01/25/2006 | CN1726591A Electronic device and method of manufacturing same |
| 01/25/2006 | CN1726399A Integrated circuit and associated packaged integrated circuit |
| 01/25/2006 | CN1725945A Heat spreader for display device |
| 01/25/2006 | CN1725932A Conductive base material with resistance layer and circuit board material with resistance layer |
| 01/25/2006 | CN1725518A Packing base for large power semiconductor LED |
| 01/25/2006 | CN1725511A Semiconductor device and method of fabricating the same |
| 01/25/2006 | CN1725500A Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus |
| 01/25/2006 | CN1725489A Integrated circuit package |
| 01/25/2006 | CN1725487A Power supply wiring structure |
| 01/25/2006 | CN1725486A Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same |
| 01/25/2006 | CN1725485A Lead frame with built-in passive element and its manufacturing method |
| 01/25/2006 | CN1725484A Semiconductor device and power supply unit utilizing the same |
| 01/25/2006 | CN1725483A High density package with wrap around interconnect |
| 01/25/2006 | CN1725482A Wiring structure for a pad section in a semiconductor device |
| 01/25/2006 | CN1725481A Column heat pipe |
| 01/25/2006 | CN1725480A Heat pipe cooler |
| 01/25/2006 | CN1725479A Heat pipe and manufacturing method thereof |
| 01/25/2006 | CN1725478A 热管 Heat pipe |
| 01/25/2006 | CN1725477A Heat sink for ball single array packaged chip and its application |
| 01/25/2006 | CN1725476A Heat sink device |
| 01/25/2006 | CN1725475A Heat sink |
| 01/25/2006 | CN1725474A Circuit apparatus and method of manufacturing the same |
| 01/25/2006 | CN1725473A Power electronic power device module |
| 01/25/2006 | CN1725466A Pad redistribution layer and method for fabricating pad redistribution layer |
| 01/25/2006 | CN1725459A Semiconductor substrate structure and process method thereof |
| 01/25/2006 | CN1724252A Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same |
| 01/25/2006 | CN1724192A Method for mfg. heat sink |
| 01/25/2006 | CN1239060C Element mounting base plate and its producing method |
| 01/25/2006 | CN1239057C Multi-chip integrated circuit carrier |
| 01/25/2006 | CN1239056C Flip chip package, circuit thereof and packaging method thereof |
| 01/25/2006 | CN1238941C An integrated circuit carrier |
| 01/25/2006 | CN1238928C Socket connector and contact for use in socket connector |
| 01/25/2006 | CN1238898C 三维器件 3D device |
| 01/25/2006 | CN1238897C Semiconductor device and its Manufacturing method |
| 01/25/2006 | CN1238896C Semiconductor switch circuit device |
| 01/25/2006 | CN1238895C Low-inductance gate-controlled thyristor |
| 01/25/2006 | CN1238889C Method for forming electronic element sealing device |
| 01/25/2006 | CN1238700C Geothermal heat exchanger heating assaying method and device |
| 01/25/2006 | CN1238571C Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 01/25/2006 | CN1238458C Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 01/25/2006 | CN1238425C Low permittivity insulating film composition, insulating film forming process and electronic parts |
| 01/25/2006 | CN1238421C Epoxy resin composition for packaging semiconductor and semiconductor device thereof |
| 01/24/2006 | US6990366 Analyte monitoring device and methods of use |
| 01/24/2006 | US6990226 Pattern recognition method |
| 01/24/2006 | US6989991 Thermal management system and method for electronic equipment mounted on coldplates |
| 01/24/2006 | US6989990 High serviceability liquid cooling loop using tubing hinge |
| 01/24/2006 | US6989989 Power converter cooling |
| 01/24/2006 | US6989988 Duct for cooling multiple components in a processor-based device |
| 01/24/2006 | US6989608 Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits |
| 01/24/2006 | US6989607 Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers |