| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/31/2006 | US6992327 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 01/31/2006 | US6992255 Via and via landing structures for smoothing transitions in multi-layer substrates |
| 01/31/2006 | US6992251 Rectification chip terminal structure |
| 01/31/2006 | US6992250 Electronic component housing package and electronic apparatus |
| 01/31/2006 | US6992115 Preparation of crosslinked particles from polymers having activatible crosslinking groups |
| 01/31/2006 | US6992020 Method of fabricating semiconductor device |
| 01/31/2006 | US6992012 Method and apparatus for forming improved metal interconnects |
| 01/31/2006 | US6992008 Method of making a substrate having buried structure and method for fabricating a display device including the substrate |
| 01/31/2006 | US6992005 Semiconductor device and method of manufacturing the same |
| 01/31/2006 | US6992002 Shapes-based migration of aluminum designs to copper damascence |
| 01/31/2006 | US6991979 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs |
| 01/31/2006 | US6991971 Method for fabricating a triple damascene fuse |
| 01/31/2006 | US6991970 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device |
| 01/31/2006 | US6991969 Methods and apparatus for addition of electrical conductors to previously fabricated device |
| 01/31/2006 | US6991968 Method of fabricating a device for cooling a hot spot in micro system |
| 01/31/2006 | US6991967 Apparatus and method for die attachment |
| 01/31/2006 | US6991966 Method for embedding a component in a base and forming a contact |
| 01/31/2006 | US6991965 Production method for manufacturing a plurality of chip-size packages |
| 01/31/2006 | US6991964 Stacked type semiconductor device |
| 01/31/2006 | US6991963 Electronic unit integrated into a flexible polymer body |
| 01/31/2006 | US6991961 Method of forming a high-voltage/high-power die package |
| 01/31/2006 | US6991960 Method of semiconductor device package alignment and method of testing |
| 01/31/2006 | US6991959 Method of manufacturing silicon carbide film |
| 01/31/2006 | US6991754 Method for making composite particles including a polymer phase |
| 01/31/2006 | US6991704 Heating of microtitre well plates in centrifugal evaporators |
| 01/31/2006 | US6991470 Circuit carrier and production thereof |
| 01/31/2006 | US6991367 Integrated thermal sensor for microwave transistors |
| 01/31/2006 | US6991207 Molds for wafer scale molding of protective caps |
| 01/31/2006 | US6991147 dispensers comprising nozzles and power sources, used for dispensing and solidifying liquid dielectrics on conductors; miniaturization; preventing short circuiting |
| 01/31/2006 | US6991024 Electroosmotic microchannel cooling system |
| 01/31/2006 | US6990729 Method for forming an inductor |
| 01/27/2006 | CA2513956A1 Adjustable and programmable temperature coefficient - proportional to absolute temperature (aptc-ptat) circuit |
| 01/26/2006 | WO2006009850A2 Semiconductor assembly having substrate with electroplated contact pads |
| 01/26/2006 | WO2006009783A2 Low dielectric constant zinc oxide |
| 01/26/2006 | WO2006009782A2 Persistent p-type group ii-vi semiconductors |
| 01/26/2006 | WO2006009781A2 Dynamic p-n junction growth |
| 01/26/2006 | WO2006009267A1 Heat pipe heat sink |
| 01/26/2006 | WO2006009152A1 Uv-ray irradiator |
| 01/26/2006 | WO2006009147A1 Resin composition for semiconductor sealing and semiconductor device |
| 01/26/2006 | WO2006009115A1 Thermosetting resin composition, sealing material for optical device and cured product |
| 01/26/2006 | WO2006008984A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/26/2006 | WO2006008789A1 Capacitive element and its manufacturing method, and semiconductor device |
| 01/26/2006 | WO2006008315A2 A heat-sink structure for electronic devices and the like |
| 01/26/2006 | WO2006007819A1 Substrate with strip conductors and production of strip conductors on substrates for semiconductor components |
| 01/26/2006 | WO2006007803A1 Cooled integrated circuit |
| 01/26/2006 | WO2005086532A3 Packaged acoustic and electromagnetic transducer chips |
| 01/26/2006 | WO2005083784A3 Cooling apparatus |
| 01/26/2006 | WO2005066252A3 Inorganic powder, resin composition filled with the powder and use thereof |
| 01/26/2006 | WO2005038994A3 Laser-based system for memory link processing with picosecond lasers |
| 01/26/2006 | US20060020734 Signal bus arrangement |
| 01/26/2006 | US20060019486 Novel film for copper diffusion barrier |
| 01/26/2006 | US20060019483 Method for production of an integrated circuit arrangement, in particular with a capacitor arrangement, as well as an integrated circuit arrangement |
| 01/26/2006 | US20060019481 Gold bump structure and fabricating method thereof |
| 01/26/2006 | US20060019480 Method for fabricating pad redistribution layer |
| 01/26/2006 | US20060019432 Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method |
| 01/26/2006 | US20060019430 Semiconductor device with improved heat dissipation, and a method of making semiconductor device |
| 01/26/2006 | US20060019429 Method for manufacturing plastic ball grid array package with integral heatsink |
| 01/26/2006 | US20060019422 Magnetic shield for integrated circuit packaging |
| 01/26/2006 | US20060019414 Wiring structure to minimize stress induced void formation |
| 01/26/2006 | US20060019201 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device |
| 01/26/2006 | US20060019157 Thin-film battery devices and apparatus for making the same |
| 01/26/2006 | US20060019027 Method for forming microelectronic spring structures on a substrate |
| 01/26/2006 | US20060018608 Optical semiconductor device, optical connector and electronic equipment |
| 01/26/2006 | US20060018588 Layered board, and apparatus incorporated such layered board |
| 01/26/2006 | US20060017188 Semiconductor- sealing -purpose epoxy resin compound producing method |
| 01/26/2006 | US20060017180 Alignment of MTJ stack to conductive lines in the absence of topography |
| 01/26/2006 | US20060017179 Insulated structure of a chip array component and fabrication method of the same |
| 01/26/2006 | US20060017178 Wiring structure for a pad section in a semiconductor device |
| 01/26/2006 | US20060017177 Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 01/26/2006 | US20060017176 Bump ball device and placing method thereof |
| 01/26/2006 | US20060017175 Collars, support structures, and forms for protuding conductive structures |
| 01/26/2006 | US20060017174 Semiconductor device |
| 01/26/2006 | US20060017173 Flip-chip semiconductor package with lead frame and method for fabricating the same |
| 01/26/2006 | US20060017172 Die and die-package interface metallization and bump design and arrangement |
| 01/26/2006 | US20060017171 Formation method and structure of conductive bumps |
| 01/26/2006 | US20060017170 CoSb3-based thermoelectric device fabrication method |
| 01/26/2006 | US20060017169 Electroplated interconnection structures on integrated circuit chips |
| 01/26/2006 | US20060017168 Semiconductor devices to reduce stress on a metal interconnect |
| 01/26/2006 | US20060017167 Semiconductor device |
| 01/26/2006 | US20060017166 Robust fluorine containing Silica Glass (FSG) Film with less free fluorine |
| 01/26/2006 | US20060017165 Semiconductor device and manufacturing method thereof |
| 01/26/2006 | US20060017164 Semiconductor device |
| 01/26/2006 | US20060017163 Device having contact pad with a conductive layer and a conductive passivation layer |
| 01/26/2006 | US20060017162 Semiconductor device and manufacturing method of the same |
| 01/26/2006 | US20060017161 Semiconductor package having protective layer for re-routing lines and method of manufacturing the same |
| 01/26/2006 | US20060017160 Structure and formation method of conductive bumps |
| 01/26/2006 | US20060017159 Semiconductor device and method of manufacturing a semiconductor device |
| 01/26/2006 | US20060017158 Power supply wiring structure |
| 01/26/2006 | US20060017157 High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
| 01/26/2006 | US20060017156 Method for mounting a chip on a base and arrangement produced by this method |
| 01/26/2006 | US20060017155 Flip chip package capable of measuring bond line thickness of thermal interface material |
| 01/26/2006 | US20060017154 Semiconductor device and method for manufacturing same |
| 01/26/2006 | US20060017153 Interconnections of semiconductor device and method of forming the same |
| 01/26/2006 | US20060017152 Heterogeneous organic laminate stack ups for high frequency applications |
| 01/26/2006 | US20060017151 BGA package board and method for manufacturing the same |
| 01/26/2006 | US20060017150 Multi-chip module and single-chip module for chips and proximity connectors |
| 01/26/2006 | US20060017149 Substrate-based BGA package, in particular FBGA package |
| 01/26/2006 | US20060017148 Semiconductor package and method for its manufacture |
| 01/26/2006 | US20060017147 Method and apparatus for using capacitively coupled communication within stacks of laminated chips |
| 01/26/2006 | US20060017146 IC with stably mounted chip |