Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/22/2014CA2633906C Arrangement having at least one electronic component
04/17/2014WO2014059032A1 Embedding thin chips in polymer
04/17/2014WO2014058836A1 Stacked multi-chip integrated circuit package
04/17/2014WO2014057902A1 Semiconductor device, ceramic circuit board, and semiconductor device manufacturing method
04/17/2014WO2014057858A1 Sealant composition for electrical and electronic parts, coating material for electrical and electronic parts, and led device
04/17/2014WO2014057771A1 Metal substrate
04/17/2014WO2014057622A1 Power converter
04/17/2014WO2014057035A1 Wireless power transfer system
04/17/2014WO2014056976A1 Integrated circuit for operation in an area with ionising radiation and with output possibility for damage information dependent on a dose of radiation and warning alarm and corresponding method
04/17/2014WO2014056960A1 A flow distribution module with a patterned cover plate
04/17/2014WO2014036456A3 Method and apparatus for routing die signals using external interconnects
04/17/2014WO2014031547A3 Method of temporarily or permanently attaching microelectronic devices or interposers to substrate for mounting, handling or testing and components useful therefor
04/17/2014WO2014026675A3 Method for producing hollow bodies, particularly for coolers, and electrical or electronic components containing hollow bodies and/or coolers
04/17/2014WO2012112912A3 Side-mounted controller and methods for making the same
04/17/2014US20140107295 Epoxy resin composition, cured object and optical semiconductor sealing material
04/17/2014US20140106560 Debond interconnect structures
04/17/2014US20140106511 Flip-chip packaging techniques and configurations
04/17/2014US20140106510 Die mounting substrate and method of fabricating the same
04/17/2014US20140106509 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
04/17/2014US20140106507 System and process for fabricating semiconductor packages
04/17/2014US20140106142 Adhesive transfer
04/17/2014US20140104968 Metallization scheme for integrated circuit
04/17/2014US20140103989 Semiconductor power modules and devices
04/17/2014US20140103902 Semiconductor Device Having Sensing Functionality
04/17/2014US20140103547 Alignment key of semiconductor device and method of fabricating the same
04/17/2014US20140103546 Silicone polymers with high refractive indices and extended pot life
04/17/2014US20140103545 Semiconductor structure and method of generating masks for making integrated circuit
04/17/2014US20140103544 Semiconductor device
04/17/2014US20140103543 Semiconductor device
04/17/2014US20140103542 Semiconductor package with bonding wires of reduced loop inductance
04/17/2014US20140103541 Semiconductor device, circuit substrate, and electronic device
04/17/2014US20140103540 Cooling Channels in 3DIC Stacks
04/17/2014US20140103539 Semiconductor device and method of fabricating the same
04/17/2014US20140103538 Enhanced electrochemical deposition filling
04/17/2014US20140103537 Nitride semiconductor device
04/17/2014US20140103536 Semiconductor device
04/17/2014US20140103535 Stub minimization for assemblies without wirebonds to package substrate
04/17/2014US20140103533 Extremely thin semiconductor-on-insulator with back gate contact
04/17/2014US20140103532 Chip-level humidity protection
04/17/2014US20140103531 Bonded structure
04/17/2014US20140103530 Three dimensional stacked semiconductor structure and method for manufacturing the same
04/17/2014US20140103529 Semiconductor device manufacturing method, semiconductor device, semiconductor device manufacturing apparatus and storage medium
04/17/2014US20140103528 Semiconductor device
04/17/2014US20140103527 Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units
04/17/2014US20140103526 Self-aligned protection layer for copper post structure
04/17/2014US20140103525 Semiconductor device and a method of manufacturing the same
04/17/2014US20140103524 Electronic device
04/17/2014US20140103523 Semiconductor package
04/17/2014US20140103522 Semiconductor substrate, semiconductor device, and method of manfacturing semiconductor substrate
04/17/2014US20140103521 Electronic device having a contact recess and related methods
04/17/2014US20140103520 Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs
04/17/2014US20140103519 Power Semiconductor Module
04/17/2014US20140103518 Structure and method for air cavity packaging
04/17/2014US20140103517 Package substrate structure and semiconductor package including the same
04/17/2014US20140103516 Semiconductor device and method of manufacturing the same
04/17/2014US20140103515 Semiconductor device
04/17/2014US20140103514 Power Quad Flat No-Lead (PQFN) Package Having Bootstrap Diodes on a Common Integrated Circuit (IC)
04/17/2014US20140103513 Semiconductor device with lead terminals having portions thereof extending obliquely
04/17/2014US20140103512 Dual-leadframe Multi-chip Package
04/17/2014US20140103511 Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
04/17/2014US20140103510 Semiconductor device and method of manufacturing the same
04/17/2014US20140103509 Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages
04/17/2014US20140103508 Encapsulating package for an integrated circuit
04/17/2014US20140103507 Optical Device Package And System
04/17/2014US20140103506 Semiconductor chip device with polymeric filler trench
04/17/2014US20140103505 Die down integrated circuit package with integrated heat spreader and leads
04/17/2014US20140103504 Semiconductor device
04/17/2014US20140103503 Semiconductor Device and Method of Forming Non-Linear Interconnect Layer with Extended Length for Joint Reliability
04/17/2014US20140103502 Semiconductor device
04/17/2014US20140103501 Circuit board with twinned cu circuit layer and method for manufacturing the same
04/17/2014US20140103500 Microelectronic assembly with impedance controlled wirebond and conductive reference element
04/17/2014US20140103499 Advanced handler wafer bonding and debonding
04/17/2014US20140103498 Selective wet etching of hafnium aluminum oxide films
04/17/2014US20140103496 Seal ring structures with reduced moisture-induced reliability degradation
04/17/2014US20140103495 Wafer and method for processing a wafer
04/17/2014US20140103485 Antifuse device for integrated circuit
04/17/2014US20140103483 Semiconductor device
04/17/2014US20140103448 Methods of forming secured metal gate antifuse structures
04/17/2014US20140103393 Surface Mountable Power Components
04/17/2014US20140103390 Curable compositon
04/17/2014US20140103334 Oxide Semiconductor Thin Film Transistor, Manufacturing Method, And Display Device Thereof
04/17/2014US20140103286 Integrated circuit tamper detection and response
04/17/2014US20140103096 Wire bonding machine and method for testing wire bond connections
04/17/2014DE112012002654T5 Integration sekundärer Bauelemente in kernlose mikroelektronische Bauelement-Packages Integration of secondary components in seedless microelectronic device packages
04/17/2014DE112012002633T5 System und Verfahren zum Bearbeiten von horizontal ausgerichteten Nanofasern aus Graphit in einem in 3D Chip-Stapeln verwendeten Material für eine thermische Grenzfläche System and method for processing horizontally oriented graphite nanofibers in a material used in 3D Chip Stack for a thermal interface
04/17/2014DE102013220846A1 Energieversorgungsmodul Power supply module
04/17/2014DE102013111293A1 Wafer und Verfahren zur Bearbeitung eines Wafers Wafer and method of processing a wafer
04/17/2014DE102013111225A1 Halbleitervorrichtung mit Abtastfunktionalität A semiconductor device with scanning functionality
04/17/2014DE102013111113A1 Ausgangstreiber mit verbesserter elektromagnetischer Verträglichkeit (EMC) und zugehörige Verfahren Output driver with improved electromagnetic compatibility (EMC) and related methods
04/17/2014DE102013111004A1 Ausrichtungsmarken und Halbleiter-Werkstück Alignment marks and semiconductor workpiece
04/17/2014DE102013103580A1 Dreidimensional gestapelte Gehäuseanordnung und Verfahren zum Herstellen derselben Three-dimensional stacked housing assembly and method of making same
04/17/2014DE102012218932A1 Electronic component for heating electronic power components, has electronic components connected with cooling body by using connector, and heat transfer element arranged between electronic components and cooling body
04/17/2014DE102012218561A1 Electronic module of multiple modules for use in tetrahedral coolant container, has metal layer that comprises edge region which is directly connected to support
04/17/2014DE102012218538A1 Verfahren zur Herstellung einer Lichterzeugungseinheit A method for manufacturing a light generating unit
04/17/2014DE102012217105A1 Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung Electrical circuit and method for establishing an electrical circuit
04/17/2014DE102012109144A1 Method of manufacturing optical components e.g. LEDs of component assembly, involves applying electromagnetic radiation to transparent or translucent molding compound on one side of component assembly
04/16/2014EP2720520A1 Circuit board and electronic device provided with same
04/16/2014EP2720264A1 Microchip charge patterning
04/16/2014EP2720263A1 Semiconductor device
04/16/2014EP2720262A1 Cooler
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