| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/01/2006 | EP1620294A2 Chemical vapor deposition epitaxial growth |
| 02/01/2006 | EP1346615A4 A multi-chip integrated circuit carrier |
| 02/01/2006 | CN2755786Y Radiating stand structure of LED |
| 02/01/2006 | CN2755783Y Chip packer without wire rack |
| 02/01/2006 | CN2755782Y Fixed base structure of improved radiator clamp |
| 02/01/2006 | CN2755781Y Integrated radiator |
| 02/01/2006 | CN2755780Y Complex radiating fins |
| 02/01/2006 | CN2755779Y Radiator structure with air-guide channel |
| 02/01/2006 | CN2755778Y Radiator with noise reduction |
| 02/01/2006 | CN1729731A Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board |
| 02/01/2006 | CN1729570A Electronic device and use thereof |
| 02/01/2006 | CN1729569A Method of producing semiconductor elements using a test structure |
| 02/01/2006 | CN1729568A Semiconductor device having clips for connecting to external elements |
| 02/01/2006 | CN1729567A Sealed and pressurized liquid cooling system for microprocessor |
| 02/01/2006 | CN1729566A Electronic part manufacturing method and electronic part |
| 02/01/2006 | CN1729562A Electronic device and method of manufacturing same |
| 02/01/2006 | CN1729540A Tamper-resistant packaging and approach |
| 02/01/2006 | CN1728921A Wiring board and magnetic disk apparatus |
| 02/01/2006 | CN1728573A Radio communicator |
| 02/01/2006 | CN1728572A Portable communication terminal having parts cooling way and its cooling method |
| 02/01/2006 | CN1728548A Airtight package, piezoelectric device, and piezoelectric oscillator |
| 02/01/2006 | CN1728411A Bse for packaging high-powered semiconductor light emiitting diode with high thermolysis efficiency |
| 02/01/2006 | CN1728394A 半导体集成电路器件 The semiconductor integrated circuit device |
| 02/01/2006 | CN1728382A 半导体器件 Semiconductor devices |
| 02/01/2006 | CN1728380A 半导体器件 Semiconductor devices |
| 02/01/2006 | CN1728378A Encapsulation of flash memory chips in pile type, and method |
| 02/01/2006 | CN1728377A Packaging base plate of improving thermolysis structure, and electronic device |
| 02/01/2006 | CN1728376A Bump ball device and placing method thereof |
| 02/01/2006 | CN1728375A Semiconductor device and manufacturing method therefor |
| 02/01/2006 | CN1728374A Reliability of low-k dielectric devices with energy dissipative layer |
| 02/01/2006 | CN1728373A Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
| 02/01/2006 | CN1728372A 半导体器件 Semiconductor devices |
| 02/01/2006 | CN1728371A Semiconductor device |
| 02/01/2006 | CN1728370A Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby |
| 02/01/2006 | CN1728369A Relocated chip with original metal pads |
| 02/01/2006 | CN1728368A Liquid cooling thermolysis device |
| 02/01/2006 | CN1728367A Thermolysis modules possessing guidance air pipe |
| 02/01/2006 | CN1728366A Thermolysis modules possessing guidance air pipe and fan housing |
| 02/01/2006 | CN1728365A Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
| 02/01/2006 | CN1728364A Optical semiconductor device, optical connector and electronic equipment |
| 02/01/2006 | CN1728354A Wiring structure to minimize stress induced void formation |
| 02/01/2006 | CN1728043A Electronic apparatus with cooling device |
| 02/01/2006 | CN1240258C Electronic circuit unit |
| 02/01/2006 | CN1240256C High capacity memory module with higher density and improved manufacturability |
| 02/01/2006 | CN1240255C Power supply module and mfg. method thereof |
| 02/01/2006 | CN1240139C Semiconductor device and its making method |
| 02/01/2006 | CN1240130C Semiconductor integrated circuit device, mounting substrate and mounting body |
| 02/01/2006 | CN1240129C 倒装片衬底设计 Flip chip substrate design |
| 02/01/2006 | CN1240124C 半导体集成电路 The semiconductor integrated circuit |
| 02/01/2006 | CN1239664C Resin composition for sealing semiconductor, semiconductor device, semiconductor chip and semiconductor mounting structural body |
| 02/01/2006 | CN1239607C Thermal-setting resin composition and semiconcutor apparatus using same |
| 02/01/2006 | CN1239283C Die-casting die of 3D columnar fin type radiator and its die-casting method |
| 01/31/2006 | US6993313 Integrated structure of inductances with shared values on a semiconductor substrate |
| 01/31/2006 | US6992945 Fuse circuit |
| 01/31/2006 | US6992896 Stacked chip electronic package having laminate carrier and method of making same |
| 01/31/2006 | US6992894 Method and apparatus for EMI shielding |
| 01/31/2006 | US6992893 Heat sink attachment |
| 01/31/2006 | US6992892 Method and apparatus for efficient temperature control using a contact volume |
| 01/31/2006 | US6992891 Metal ball attachment of heat dissipation devices |
| 01/31/2006 | US6992890 Heat sink |
| 01/31/2006 | US6992889 Retention module, heat sink and electronic device |
| 01/31/2006 | US6992887 Liquid cooled semiconductor device |
| 01/31/2006 | US6992871 Microtransformer for system-on-chip power supply |
| 01/31/2006 | US6992548 RF module and method for arranging through holes in RF module |
| 01/31/2006 | US6992532 IGFET and tuning circuit |
| 01/31/2006 | US6992528 Semiconductor device |
| 01/31/2006 | US6992400 Encapsulated electronics device with improved heat dissipation |
| 01/31/2006 | US6992399 Die connected with integrated circuit component for electrical signal passing therebetween |
| 01/31/2006 | US6992398 produced via stereolithography/purging; semiconductors |
| 01/31/2006 | US6992397 comprises ball grid array composed of doped eutectic lead/tin solder composition; mixing phosphorus residue prevents degradation of the solder/under bump metallization bond' printed circuits |
| 01/31/2006 | US6992396 Semiconductor device and method for fabricating the same |
| 01/31/2006 | US6992395 Semiconductor device and semiconductor module having external electrodes on an outer periphery |
| 01/31/2006 | US6992394 Multi-level conductive lines with reduced pitch |
| 01/31/2006 | US6992393 Interconnect structure and method for fabricating the same |
| 01/31/2006 | US6992392 Semiconductor device and method for manufacturing the same |
| 01/31/2006 | US6992391 Dual-damascene interconnects without an etch stop layer by alternating ILDs |
| 01/31/2006 | US6992390 Liner with improved electromigration redundancy for damascene interconnects |
| 01/31/2006 | US6992389 Barrier for interconnect and method |
| 01/31/2006 | US6992388 Formation of micro rough polysurface for low sheet resistant salicided sub-quarter micron polylines |
| 01/31/2006 | US6992387 Capacitor-related systems for addressing package/motherboard resonance |
| 01/31/2006 | US6992386 Semiconductor device and a method of manufacturing the same |
| 01/31/2006 | US6992385 Semiconductor device, a method of manufacturing the same and an electronic device |
| 01/31/2006 | US6992384 High performance multi-chip flip chip package |
| 01/31/2006 | US6992383 Semiconductor device having radiation structure |
| 01/31/2006 | US6992382 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
| 01/31/2006 | US6992381 Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 01/31/2006 | US6992380 Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area |
| 01/31/2006 | US6992379 Electronic package having a thermal stretching layer |
| 01/31/2006 | US6992378 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
| 01/31/2006 | US6992377 Semiconductor package with crossing conductor assembly and method of manufacture |
| 01/31/2006 | US6992376 Electronic package having a folded package substrate |
| 01/31/2006 | US6992375 for holding getter materials in place within micromechanical device package substrate; microelectronics; semiconductors/integrated circuits; lithography |
| 01/31/2006 | US6992374 Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors |
| 01/31/2006 | US6992373 Stacked land grid array package |
| 01/31/2006 | US6992372 Film carrier tape for mounting electronic devices thereon |
| 01/31/2006 | US6992371 Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication |
| 01/31/2006 | US6992370 Memory cell structure having nitride layer with reduced charge loss and method for fabricating same |
| 01/31/2006 | US6992366 Stacked variable inductor |
| 01/31/2006 | US6992356 Semiconductor device |
| 01/31/2006 | US6992340 Semiconductor device |