| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/02/2006 | WO2005112117A3 Power semiconductor assembly |
| 02/02/2006 | WO2005076353A3 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 02/02/2006 | WO2005055288A3 Method and device for the alternating contacting of two wafers |
| 02/02/2006 | WO2004095510A3 Multilayered cap barrier in microelectronic, interconnect structures |
| 02/02/2006 | US20060025500 No-flow underfill composition and method |
| 02/02/2006 | US20060025131 Method and systems for providing information to a home system regarding a wireless unit roaming in a visited system |
| 02/02/2006 | US20060024989 Helical microelectronic contact and method for fabricating same |
| 02/02/2006 | US20060024863 Chip package structure and process for fabricating the same |
| 02/02/2006 | US20060024469 Vacuum heat insulator and its manufacturing method, and body warmer and personal computer using the vacuum heat insulator |
| 02/02/2006 | US20060023439 Stacked chip electronic package having laminate carrier and method of making same |
| 02/02/2006 | US20060023431 Control unit and method for producing the same |
| 02/02/2006 | US20060023425 Electronic component cooling apparatus |
| 02/02/2006 | US20060023385 Multi-functional energy conditioner |
| 02/02/2006 | US20060022733 Voltage droop suppressing circuit |
| 02/02/2006 | US20060022710 Integrated circuit having an input/output terminal configurable within a given voltage range |
| 02/02/2006 | US20060022691 Semiconductor device |
| 02/02/2006 | US20060022357 Low dielectric constant film material, film and semiconductor device using such material |
| 02/02/2006 | US20060022356 Resin for optical-semiconductor element encapsulation |
| 02/02/2006 | US20060022354 Semiconductor device |
| 02/02/2006 | US20060022353 Probe pad arrangement for an integrated circuit and method of forming |
| 02/02/2006 | US20060022352 Front-end processing of nickel plated bond pads |
| 02/02/2006 | US20060022351 Semiconductor device and method for manufacturing the same, package for LCD driver |
| 02/02/2006 | US20060022350 Integrated circuit and methods of redistributing bondpad locations |
| 02/02/2006 | US20060022349 Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate |
| 02/02/2006 | US20060022348 Method of sealing low-k dielectrics and devices made thereby |
| 02/02/2006 | US20060022347 Amorphous carbon-based non-volatile memory |
| 02/02/2006 | US20060022346 Method for driving a semiconductor switching element in a half-bridge and circuit arrangement having a half-bridge |
| 02/02/2006 | US20060022345 Layer arrangement |
| 02/02/2006 | US20060022344 Semiconductor device capable of preventing chemical damage and method for fabricating the same |
| 02/02/2006 | US20060022343 Very thick metal interconnection scheme in IC chips |
| 02/02/2006 | US20060022342 Semiconductor device and method for manufacturing the same |
| 02/02/2006 | US20060022340 Electrical conducting structure and liquid crystal display device comprising the same |
| 02/02/2006 | US20060022339 Solder ball opening protrusion for semiconductor assembly |
| 02/02/2006 | US20060022338 Semiconductor component having a CSP housing |
| 02/02/2006 | US20060022337 Hermetic chip in wafer form |
| 02/02/2006 | US20060022336 Microelectronic packages including solder bumps and AC-coupled interconnect elements |
| 02/02/2006 | US20060022334 Power semiconductor package having integral fluid cooling |
| 02/02/2006 | US20060022333 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
| 02/02/2006 | US20060022332 Semiconductor chip-embedded substrate and method of manufacturing same |
| 02/02/2006 | US20060022331 Semiconductor device and method of manufacturing same |
| 02/02/2006 | US20060022330 Porous silicon heat sinks and heat exchangers and related methods |
| 02/02/2006 | US20060022329 Carrier device for electronic chip |
| 02/02/2006 | US20060022328 Interposer with flexible solder pad elements and methods of manufacturing the same |
| 02/02/2006 | US20060022327 Enhanced PGA interconnection |
| 02/02/2006 | US20060022326 Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
| 02/02/2006 | US20060022325 Cap wafer, semiconductor package, and fabricating method thereof |
| 02/02/2006 | US20060022324 Stacked flash memory chip package and method therefor |
| 02/02/2006 | US20060022323 Assemblies including stacked semiconductor dice having centrally located, wire bonded bond pads |
| 02/02/2006 | US20060022322 Small structure and method for fabricating the same |
| 02/02/2006 | US20060022321 Semiconductor chip having gettering layer, and method for manufacturing the same |
| 02/02/2006 | US20060022320 Semiconductor device and manufacturing method thereof |
| 02/02/2006 | US20060022318 Packaged biomedical electrode unit and method of inspecting quality thereof |
| 02/02/2006 | US20060022317 Chip-under-tape package structure and manufacture thereof |
| 02/02/2006 | US20060022316 Semiconductor package with flip chip on leadless leadframe |
| 02/02/2006 | US20060022314 LOC semiconductor assembled with room temperature adhesive |
| 02/02/2006 | US20060022313 Solderable metal finish for integrated circuit package leads and method for forming |
| 02/02/2006 | US20060022311 Chip structure with redistribution Circuit, chip package and manufacturing process thereof |
| 02/02/2006 | US20060022310 Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same |
| 02/02/2006 | US20060022309 Surface protective film |
| 02/02/2006 | US20060022295 Evaluation method and manufacturing method of semiconductor device |
| 02/02/2006 | US20060022294 High-voltage MOS transistor and corresponding manufacturing method |
| 02/02/2006 | US20060022288 Semiconductor integrate device and method for manufacturing same |
| 02/02/2006 | US20060022286 Ferromagnetic liner for conductive lines of magnetic memory cells |
| 02/02/2006 | US20060022274 Semiconductor integrated circuit device |
| 02/02/2006 | US20060022273 System and method for assembly of semiconductor dies to flexible circuits |
| 02/02/2006 | US20060022272 Electrostatic discharge protection device and circuit thereof |
| 02/02/2006 | US20060022225 Metal bond pad for integrated circuits allowing improved probing ability of small pads |
| 02/02/2006 | US20060022203 Substrate for display, method of manufacturing the same and display having the same |
| 02/02/2006 | US20060022197 Technique for evaluating local electrical characteristics in semiconductor devices |
| 02/02/2006 | US20060022196 Semiconductor substrate and semiconductor device fabrication method |
| 02/02/2006 | US20060022195 Scribe line structure |
| 02/02/2006 | US20060022194 Organic semiconductor device |
| 02/02/2006 | US20060022020 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
| 02/02/2006 | US20060021741 Fan module for a heat dissipating device |
| 02/02/2006 | US20060021734 Heat sink and heat spreader bonding structure |
| 02/02/2006 | US20060021214 Methods for making device enclosures and devices with an integrated battery |
| 02/02/2006 | DE19828391B4 Flüssigkristallanzeige Liquid-crystal display |
| 02/02/2006 | DE19827237B4 Leiterplattensubstrat für Halbleiterbauelementgehäuse und ein dasselbe verwendende Halbleiterbauelementgehäuse sowie Herstellungsverfahren für diese PCB substrate for semiconductor device package and a semiconductor device the same housing and manufacturing method used for this |
| 02/02/2006 | DE112004000395T5 Halbleiterwafer mit nichtrechteckig geformten Chips Semiconductor wafer with non-rectangular shaped chips |
| 02/02/2006 | DE112004000258T5 Alternativer Entwurf für ein Flip Chip in Leaded Molded Package und Verfahren zur Herstellung Alternative design for a Flip Chip in Leaded Molded Package and method for producing |
| 02/02/2006 | DE10394180T5 Integrierter Schaltungsbaustein und Verfahren zu seiner Herstellung Integrated circuit package and method for its preparation |
| 02/02/2006 | DE102004034224A1 Composition for cooling component e.g. electronic component, that gives off heat, comprises carrier material containing dispersed silicon carbide particles |
| 02/02/2006 | DE10140328B4 Kühlanordnung zur Kühlung elektronischer Bauelemente Cooling means for cooling electronic components |
| 02/02/2006 | DE10120408B4 Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung Electronic component having a semiconductor chip, electronic assembly of stacked semiconductor chips and processes for their preparation |
| 02/02/2006 | DE10013655B4 Halbleitervorrichtung, die Ausbreitung von Rauschen zwischen internen Schaltungen verringern kann Semiconductor device can reduce the propagation of noise between internal circuits |
| 02/01/2006 | EP1622435A1 Method of manufacturing an electronic circuit assembly using direct write techniques |
| 02/01/2006 | EP1622199A2 Power semiconductor package having integral fluid cooling |
| 02/01/2006 | EP1622198A2 Substrate mounted with electronic element thereon and liquid ejection head including the substrate |
| 02/01/2006 | EP1622197A2 Method of manufacturing a semiconductor device |
| 02/01/2006 | EP1622177A1 Soft magnetic film having a high magnetization, methof for manufacturing thereof and corresponding integrated circuit |
| 02/01/2006 | EP1621566A1 Fluxing no-flow underfill composition containing benzoxazines |
| 02/01/2006 | EP1621053A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof |
| 02/01/2006 | EP1620893A2 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof |
| 02/01/2006 | EP1620892A2 Composite material, electrical circuit or electric module |
| 02/01/2006 | EP1620890A2 Electronic component as well as system support and panel for the production thereof |
| 02/01/2006 | EP1620886A2 Fuse and method for forming |
| 02/01/2006 | EP1620879A2 Dc-dc converter implemented in a land grid array package |
| 02/01/2006 | EP1620877A2 Multilayered cap barrier in microelectronic, interconnect structures |
| 02/01/2006 | EP1620497A1 Object with a stratified composite material |
| 02/01/2006 | EP1620354A1 Vacuum package fabrication of integrated circuit components |