| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/2006 | CN1241250C Method for making copper damascene structure in porous dielectric |
| 02/08/2006 | CN1241249C Method and structure for adhering MSQ to liner oxide |
| 02/08/2006 | CN1241244C Method for mounting semiconductor element |
| 02/08/2006 | CN1241157C LED display module with high radiation property |
| 02/08/2006 | CN1241089C Method for constituting multi-computer system and the multi-computer system thereof |
| 02/08/2006 | CN1241087C Desk computer with direct heat radiating layout system structure |
| 02/08/2006 | CN1240780C Organosilicon precursor for interlayer medium film with low dielectric constant |
| 02/08/2006 | CN1240772C Phosphorus-containing epoxy resin composition and its uses |
| 02/07/2006 | US6996484 Sequential unique marking |
| 02/07/2006 | US6996304 Small form factor transceiver with externally modulated laser |
| 02/07/2006 | US6996147 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 02/07/2006 | US6995981 Heat sink assembly with combined parallel fins |
| 02/07/2006 | US6995980 Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
| 02/07/2006 | US6995979 Heat-dissipating fan module of electronic apparatus |
| 02/07/2006 | US6995931 Temperature controlled optoelectronic device |
| 02/07/2006 | US6995691 Bonded structure using reacted borosilicate mixture |
| 02/07/2006 | US6995476 Semiconductor device, circuit board and electronic instrument that include an adhesive with conductive particles therein |
| 02/07/2006 | US6995475 I/C chip suitable for wire bonding |
| 02/07/2006 | US6995474 Electrical conducting structure and liquid crystal display device comprising the same |
| 02/07/2006 | US6995473 Stacked semiconductor transistors |
| 02/07/2006 | US6995472 Insulating tube |
| 02/07/2006 | US6995471 Self-passivated copper interconnect structure |
| 02/07/2006 | US6995470 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 02/07/2006 | US6995469 Semiconductor apparatus and fabricating method for the same |
| 02/07/2006 | US6995468 Semiconductor apparatus utilizing a preparatory stage for a chip assembly |
| 02/07/2006 | US6995467 Semiconductor component |
| 02/07/2006 | US6995466 Semiconductor device having passivation cap and method for manufacturing the same |
| 02/07/2006 | US6995465 Silicon building block architecture with flex tape |
| 02/07/2006 | US6995464 Pressure-contact type semiconductor device |
| 02/07/2006 | US6995463 Integrated chip package having intermediate substrate and multiple semiconductor chips |
| 02/07/2006 | US6995462 Image sensor packages |
| 02/07/2006 | US6995461 Semiconductor device |
| 02/07/2006 | US6995460 Leadless plastic chip carrier with etch back pad singulation |
| 02/07/2006 | US6995459 Semiconductor package with increased number of input and output pins |
| 02/07/2006 | US6995458 Cavity down no lead package |
| 02/07/2006 | US6995457 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board |
| 02/07/2006 | US6995455 Semiconductor device |
| 02/07/2006 | US6995450 Semiconductor device with a frequency selective guard ring |
| 02/07/2006 | US6995448 Semiconductor package including passive elements and method of manufacture |
| 02/07/2006 | US6995443 Integrated circuits using optical fiber interconnects formed through a semiconductor wafer |
| 02/07/2006 | US6995432 Semiconductor device having a gate oxide film with some NTFTS with LDD regions and no PTFTS with LDD regions |
| 02/07/2006 | US6995431 System and method to reduce noise in a substrate |
| 02/07/2006 | US6995425 Semiconductor memory device having memory cell section and peripheral circuit section and method of manufacturing the same |
| 02/07/2006 | US6995422 High-density three-dimensional memory |
| 02/07/2006 | US6995414 Semiconductor memory device including multi-layer gate structure |
| 02/07/2006 | US6995413 Semiconductor memory device |
| 02/07/2006 | US6995410 NAND flash memory with unequal spacing between signal lines |
| 02/07/2006 | US6995409 Module for high voltage power for converting a base of IGBT components |
| 02/07/2006 | US6995393 Apparatus and methods for semiconductor IC failure detection |
| 02/07/2006 | US6995392 Test structure for locating electromigration voids in dual damascene interconnects |
| 02/07/2006 | US6995322 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
| 02/07/2006 | US6995320 Wiring board and a packaging assembly using the same |
| 02/07/2006 | US6995315 Current sensor |
| 02/07/2006 | US6995093 Polysilicon etching method |
| 02/07/2006 | US6995084 Method for forming robust solder interconnect structures by reducing effects of seed layer underetching |
| 02/07/2006 | US6995082 Bonding pad of a semiconductor device and formation method thereof |
| 02/07/2006 | US6995074 Method for manufacturing a semiconductor wafer |
| 02/07/2006 | US6995073 Air gap integration |
| 02/07/2006 | US6995049 Method for forming semiconductor device |
| 02/07/2006 | US6995044 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
| 02/07/2006 | US6995043 Methods for fabricating routing elements for multichip modules |
| 02/07/2006 | US6995042 Method for fabricating preplated nickel/palladium and tin leadframes |
| 02/07/2006 | US6995041 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
| 02/07/2006 | US6995039 Method and apparatus for electrostatically aligning integrated circuits |
| 02/07/2006 | US6995038 Method of manufacturing semiconductor device |
| 02/07/2006 | US6995037 Structure and method of high performance two layer ball grid array substrate |
| 02/07/2006 | US6995029 Fabricating surface mountable semiconductor components with leadframe strips |
| 02/07/2006 | US6995027 Integrated semiconductor structure for reliability tests of dielectrics |
| 02/07/2006 | US6995026 Methods for coupling a flowable conductive material to microelectronic substrates |
| 02/07/2006 | US6994917 Composite material and method for manufacturing the same |
| 02/07/2006 | US6994802 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices |
| 02/07/2006 | US6994570 High performance interposer for a chip package using deformable button contacts |
| 02/07/2006 | US6994158 Multi-load thermal regulating system having electronic valve control |
| 02/07/2006 | US6994152 Brazed wick for a heat transfer device |
| 02/07/2006 | US6994151 Vapor escape microchannel heat exchanger |
| 02/07/2006 | US6993926 Method and apparatus for high heat flux heat transfer |
| 02/07/2006 | CA2342726C Apparatus and method for assembling optical devices |
| 02/02/2006 | WO2006012339A1 Micro or below scale multi-layered heteostructure |
| 02/02/2006 | WO2006012300A1 Semiconductor device-based sensors and methods associated with the same |
| 02/02/2006 | WO2006012195A1 Optoelectronic flip-chip package with optical waveguide accomodated in upper layers of substrate board |
| 02/02/2006 | WO2006012167A1 Bottom heat spreader |
| 02/02/2006 | WO2006012127A2 Microelectronic packages and methods therefor |
| 02/02/2006 | WO2006012113A2 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin |
| 02/02/2006 | WO2006012110A2 Integrated transistor module and method of fabricating same |
| 02/02/2006 | WO2006012012A2 Chip-to-chip trench circuit structure |
| 02/02/2006 | WO2006011960A1 Integrated circuit chip that supports through-chip electromagnetic communication |
| 02/02/2006 | WO2006011942A1 Angled elongated features for improved alignment process integration |
| 02/02/2006 | WO2006011662A1 Epoxy resin composition and semiconductor device |
| 02/02/2006 | WO2006011655A1 Single-layer carbon nanotube and alinged single-layer carbon nanotube bulk structure, and their production process, production apparatus and use |
| 02/02/2006 | WO2006011601A1 Function element and manufacturing method thereof, and function element mounting structure |
| 02/02/2006 | WO2006011483A1 Non-contact ic card-use inlet and non-contact ic card |
| 02/02/2006 | WO2006011477A1 Semiconductor device |
| 02/02/2006 | WO2006011068A1 Electronic device comprising an integrated circuit and a capacitance element |
| 02/02/2006 | WO2006011013A2 An active protection device for protecting circuit against mechanical and electromagnetic attack. |
| 02/02/2006 | WO2006010903A2 Multiple chip semiconductor device |
| 02/02/2006 | WO2006010822A2 Improved cooling devices for different applications |
| 02/02/2006 | WO2006010821A1 Calibrating device on a silicon substrate |
| 02/02/2006 | WO2006010639A2 Method of manufacturing an electronic circuit device through a direct write technique |
| 02/02/2006 | WO2006001943A3 Multi-layered thermally conductive sheet |
| 02/02/2006 | WO2005114727A3 Semiconductor die attachment for high vaccum tubes |