| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/09/2006 | US20060027932 Interconnect with composite barrier layers and method for fabricating the same |
| 02/09/2006 | US20060027931 Semiconductor device and method fabricating the same |
| 02/09/2006 | US20060027930 Copper alloy via bottom liner |
| 02/09/2006 | US20060027929 Exposed pore sealing post patterning |
| 02/09/2006 | US20060027928 Semiconductor integrated circuit device |
| 02/09/2006 | US20060027927 Design of BEOL patterns to reduce the stresses on structures below chip bondpads |
| 02/09/2006 | US20060027926 Semiconductor device, semiconductor substrate and fabrication process of a semiconductor device |
| 02/09/2006 | US20060027924 Metallization layers for crack prevention and reduced capacitance |
| 02/09/2006 | US20060027923 Coating process to enable electrophoretic deposition |
| 02/09/2006 | US20060027922 High performance metallization cap layer |
| 02/09/2006 | US20060027921 Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
| 02/09/2006 | US20060027919 Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits |
| 02/09/2006 | US20060027918 Electroplated wire layout for package sawing |
| 02/09/2006 | US20060027917 Component arrangement having an evaluation circuit for detecting wear on connections |
| 02/09/2006 | US20060027916 Mechanism and process for compressing chips |
| 02/09/2006 | US20060027915 Device packages with low stress assembly process |
| 02/09/2006 | US20060027914 Integrated heat spreader lid |
| 02/09/2006 | US20060027913 Shielding for emi-sensitive electronic components and or circuits of electronic devices |
| 02/09/2006 | US20060027912 Film carrier tape for mounting of electronic part |
| 02/09/2006 | US20060027911 Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures |
| 02/09/2006 | US20060027910 Pressure-contact type semiconductor device |
| 02/09/2006 | US20060027909 Connecting substrate, connecting structure, connection method and electronic apparatus |
| 02/09/2006 | US20060027908 3-D stackable semiconductor package |
| 02/09/2006 | US20060027907 Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices |
| 02/09/2006 | US20060027906 Exclusive memory structure applicable for multi media card and secure digital card |
| 02/09/2006 | US20060027905 Biosensor with smart card configuration |
| 02/09/2006 | US20060027904 Micro device having micro system structure and method for manufacturing the same |
| 02/09/2006 | US20060027903 Semiconductor package, method for fabricating the same, and semiconductor device |
| 02/09/2006 | US20060027902 Method and apparatus for stacked die packaging |
| 02/09/2006 | US20060027901 Stacked chip package with exposed lead-frame bottom surface |
| 02/09/2006 | US20060027900 Semiconductor device |
| 02/09/2006 | US20060027899 Structure with spherical contact pins |
| 02/09/2006 | US20060027873 Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation |
| 02/09/2006 | US20060027872 Electrostatic discharge protection device |
| 02/09/2006 | US20060027871 [electrostatic discharge protection device] |
| 02/09/2006 | US20060027852 Bitline of semiconductor device having stud type capping layer and method for fabricating the same |
| 02/09/2006 | US20060027829 Package structure for light emitting diode and method thereof |
| 02/09/2006 | US20060027809 Semiconductor device including semiconductor thin film, which is subjected to heat treatment to have alignment mark, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film |
| 02/09/2006 | US20060027740 Snap lid camera module |
| 02/09/2006 | US20060027312 Specific microdisturbances in actuator along longitudinal axis of the stack parallel and spaced to the inner electrodes are subjected to a pregiven, limited, stress-reducing growth into actuator interior during polarization; permit transmission of pressure, but not tensile stress between piezoplates |
| 02/09/2006 | US20060026983 Spray cooling system for transverse thin-film evaporative spray cooling |
| 02/09/2006 | DE202005018009U1 Semiconductor mounting structure for cooling e.g. LED chip sets includes conductive plates beneath base plate connected to a heat conductor by conductive wires |
| 02/09/2006 | DE19736685B4 Bondgerät Bonder |
| 02/09/2006 | DE10393769T5 Halbleitervorrichtung mit Klemmen zum Verbinden mit externen Elementen A semiconductor device having terminals for connection with external elements |
| 02/09/2006 | DE10317739B4 Elektrisches Bauteil Electrical component |
| 02/09/2006 | DE10213609B4 Elektrisches Bauelement mit einer Kontaktierungsfläche und Verfahren zum Ausbilden einer Kontaktierungsfläche auf einem Halbleitermaterial Electrical component with a contacting surface and method of forming a bonding pad on a semiconductor material |
| 02/09/2006 | DE102005031613A1 LED und LED-Array mit einer jeweiligen Kleberschicht LED and LED array with a respective adhesive layer |
| 02/09/2006 | DE102005029157A1 Kapselung von Elektronikbaugruppen Encapsulation of electronic components |
| 02/09/2006 | DE102005026229A1 Semiconductor device package comprises substrate, first and second chip pads, insulating layer over substrate surface, conductive reference potential line, conductive signal line, and first and second external terminals |
| 02/09/2006 | DE102004034277A1 Device to determine mechanical tension in a semiconductor substrate measures a magnetic field component compares with a reference field and outputs an information signal |
| 02/09/2006 | DE102004032708A1 Vorrichtung für eine passive Stabilisierung von Versorgungsspannungen eines Halbleiterbauelements The apparatus for passive stabilization of supply voltages of a semiconductor device |
| 02/09/2006 | DE102004031598A1 Stress-free encapsulation of inserts, in particular electrical components, in a plastic housing, involves coating insert in material with different thermal expansion coefficient to those of insert and housing plastic |
| 02/09/2006 | DE102004031592A1 Elektronikmodulanordnung und entsprechendes Herstellungsverfahren Electronics module assembly and method of manufacture |
| 02/09/2006 | DE102004029358B3 Component production method for a plastic-encapsulated electric/electromechanical component extrusion-coats a lead frame in an injection-molded shape with strip conductors |
| 02/09/2006 | DE10013013B4 Chemisch synthetisierte und aufgebaute elektronische Bauelemente Chemically synthesized and structured electronic components |
| 02/09/2006 | CA2572691A1 Semiconductor element with a passivation layer and method for production thereof |
| 02/08/2006 | EP1623463A2 Mram architecture with a bit line located underneath the magnetic tunneling junction device |
| 02/08/2006 | EP1623461A2 Thermal management materials |
| 02/08/2006 | EP1623460A2 Card with embedded ic and electrochemical cell |
| 02/08/2006 | EP1573825A4 Optical component mounting and interconnect apparatus |
| 02/08/2006 | EP1503870B1 Method and apparatus for two dimensional assembly of particles |
| 02/08/2006 | EP0956749A4 Methods and compositions for ionizing radiation shielding |
| 02/08/2006 | CN2757508Y Heat radiator |
| 02/08/2006 | CN2757334Y Heat radiation fan mounting device with shock reducing structure |
| 02/08/2006 | CN2757333Y Temperature difference electrohydraulic cold temperature controller for multiple way integrated circuit block |
| 02/08/2006 | CN2757332Y Heat radiator |
| 02/08/2006 | CN2757331Y Sealing structure of heat conductive tube |
| 02/08/2006 | CN2757330Y Heat radiator locking device |
| 02/08/2006 | CN2757329Y Heat radiator |
| 02/08/2006 | CN2757328Y Press type application combining device of package chip |
| 02/08/2006 | CN2757326Y Test pattern for shallow ditch filling hole |
| 02/08/2006 | CN1732568A RF power transistor with internal bias feed |
| 02/08/2006 | CN1732567A Semiconductor device power interconnect striping |
| 02/08/2006 | CN1732566A System and method for mounting a heat sink |
| 02/08/2006 | CN1732565A Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| 02/08/2006 | CN1732562A Electronic component unit |
| 02/08/2006 | CN1732561A Integrating metal with ultra low-K dielectrics |
| 02/08/2006 | CN1732558A Method and device for plasma-etching organic material film |
| 02/08/2006 | CN1732291A Lead free bump and method of forming the same |
| 02/08/2006 | CN1732225A Toughened epoxy-anhydride no-flow underfill encapsulant |
| 02/08/2006 | CN1732199A Curable resin composition and products of curing thereof |
| 02/08/2006 | CN1731917A Print circuit board with improved heat rejection structure and electronic device |
| 02/08/2006 | CN1731916A Print circuit board with improved heat rejection structure and electronic device |
| 02/08/2006 | CN1731915A Multi-layer circuit board device |
| 02/08/2006 | CN1731581A Equipment, system, and method for optical emission of signals in enhanced response IC |
| 02/08/2006 | CN1731580A Semiconductor package, method for fabricating the same, and semiconductor device |
| 02/08/2006 | CN1731579A Chip with buffer layer and electric engagement device applying the chip and display board |
| 02/08/2006 | CN1731578A Semiconductor device miniature radiator |
| 02/08/2006 | CN1731577A 叠层式散热器 Stacked radiators |
| 02/08/2006 | CN1731576A Power semiconductor composed by duplex-metal and china and its manufacturing method |
| 02/08/2006 | CN1731574A Circuit rewiring method and circuit structure |
| 02/08/2006 | CN1731572A Electronic component production method and electronic component produced by the method |
| 02/08/2006 | CN1730548A Resin composition, method of its composition, and cured formulation |
| 02/08/2006 | CN1241264C Semiconductor device and its mfg. method |
| 02/08/2006 | CN1241262C Static discharge protection circuit and relative metal oxide semiconductor transistor structure |
| 02/08/2006 | CN1241261C Semiconductor device and mfg. method for same |
| 02/08/2006 | CN1241260C Heat conduction intensified semiconductor structure and making process |
| 02/08/2006 | CN1241259C Manufacturing method for circuit device |
| 02/08/2006 | CN1241258C Subsupport for photoelectric module and packaging method utilizing same subsupport |
| 02/08/2006 | CN1241252C Semiconductor device and producing method thereof, circuit substrate and electronic instrument |