| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/14/2006 | US6998718 Wafer level chip scale packaging structure and method of fabricating the same |
| 02/14/2006 | US6998717 Multi-dice chip scale semiconductor components |
| 02/14/2006 | US6998716 Diamond metal-filled patterns achieving low parasitic coupling capacitance |
| 02/14/2006 | US6998715 Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same |
| 02/14/2006 | US6998714 Selectively coating bond pads |
| 02/14/2006 | US6998713 Wiring board and method for producing same |
| 02/14/2006 | US6998712 Semiconductor device and method for manufacturing the same |
| 02/14/2006 | US6998711 Method of forming a micro solder ball for use in C4 bonding process |
| 02/14/2006 | US6998710 High-frequency device |
| 02/14/2006 | US6998709 RFIC die-package configuration |
| 02/14/2006 | US6998708 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
| 02/14/2006 | US6998707 Semiconductor device having radiation structure |
| 02/14/2006 | US6998706 Relaxed tolerance flip chip assembly |
| 02/14/2006 | US6998705 Semiconductor device, method for mounting the same, and method for repairing the same |
| 02/14/2006 | US6998704 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 02/14/2006 | US6998703 Thin package for stacking integrated circuits |
| 02/14/2006 | US6998702 Front edge chamfer feature for fully-molded memory cards |
| 02/14/2006 | US6998701 Resin sealing-type semiconductor device and method for manufacturing the same |
| 02/14/2006 | US6998700 Notched compound semiconductor wafer |
| 02/14/2006 | US6998699 Redundant interconnect high current bipolar device and method of forming the device |
| 02/14/2006 | US6998691 Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
| 02/14/2006 | US6998688 Arrangement for protecting a chip and checking its authenticity |
| 02/14/2006 | US6998685 Electrostatic discharge protection device with complementary dual drain implant |
| 02/14/2006 | US6998664 Integrated semiconductor circuit having a cell array having a multiplicity of memory cells |
| 02/14/2006 | US6998654 Semiconductor integrated circuit device |
| 02/14/2006 | US6998653 Semiconductor device |
| 02/14/2006 | US6998650 Replaceable light emitting diode module |
| 02/14/2006 | US6998638 Test structure for detecting bonding-induced cracks |
| 02/14/2006 | US6998533 Electronic device and method of manufacturing same |
| 02/14/2006 | US6998532 Electronic component-built-in module |
| 02/14/2006 | US6998344 Method for fabricating semiconductor components by forming conductive members using solder |
| 02/14/2006 | US6998342 Electronic device manufacturing method |
| 02/14/2006 | US6998340 Method of manufacturing semiconductor device |
| 02/14/2006 | US6998339 Method of forming conductor wiring pattern |
| 02/14/2006 | US6998338 Method of producing an integrated circuit configuration |
| 02/14/2006 | US6998335 Structure and method for fabricating a bond pad structure |
| 02/14/2006 | US6998334 Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
| 02/14/2006 | US6998328 Method for creating neo-wafers from singulated integrated circuit die and a device made according to the method |
| 02/14/2006 | US6998325 Method for manufacturing semiconductor device |
| 02/14/2006 | US6998321 Method for forming inductor in semiconductor device |
| 02/14/2006 | US6998320 Passivation layer for group III-V semiconductor devices |
| 02/14/2006 | US6998308 Substrate for carrying a semiconductor chip and a manufacturing method thereof |
| 02/14/2006 | US6998297 Wafer level packaging |
| 02/14/2006 | US6998296 Electronic component and method for its production |
| 02/14/2006 | US6998293 Flip-chip bonding method |
| 02/14/2006 | US6998292 Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier |
| 02/14/2006 | US6998290 Economical high density chip carrier |
| 02/14/2006 | US6998216 Mechanically robust interconnect for low-k dielectric material using post treatment |
| 02/14/2006 | US6998180 Package with a substrate of high thermal conductivity |
| 02/14/2006 | US6998148 Porous materials |
| 02/14/2006 | US6998036 an alkylsulfonic acid surfactant; water soluble tin (II) and silver (I) salts; linear, organic thioether compounds as complexing agents; electrodeposition; oxidation resistance; solder is suitable for high and low current densities; nontoxic |
| 02/14/2006 | US6998002 Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure |
| 02/14/2006 | US6997247 Multiple-pass heat exchanger with gaps between fins of adjacent tube segments |
| 02/14/2006 | US6997233 Mold and method for manufacturing metal-ceramic composite member |
| 02/14/2006 | US6996996 Sealed spray cooling system |
| 02/14/2006 | US6996899 Electronic assembly and a method of constructing an electronic assembly |
| 02/14/2006 | US6996897 Method of making a mount for electronic devices |
| 02/09/2006 | WO2006015187A2 System and method for assembly of semiconductor dies to flexible circuits |
| 02/09/2006 | WO2006014690A2 Power semiconductor package |
| 02/09/2006 | WO2006014418A2 Encapsulated semiconductor device with reliable down bonds |
| 02/09/2006 | WO2006014196A1 System and method for encapsulation and protection of components |
| 02/09/2006 | WO2006013644A1 Production system |
| 02/09/2006 | WO2006013507A1 Chip with light protection layer |
| 02/09/2006 | WO2006013302A1 Device for making secure components |
| 02/09/2006 | WO2006013230A2 Manufacture of a layer including a component |
| 02/09/2006 | WO2006013197A1 Surface-mounted microwave miniature package and method for making same |
| 02/09/2006 | WO2006012847A1 Vertical power semiconductor component comprising a semiconductor chip, and method for producing the same |
| 02/09/2006 | WO2005091968A3 Compact radiator for an electronic device |
| 02/09/2006 | WO2005045888A3 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
| 02/09/2006 | WO2005038869A3 Electronically programmable antifuse and circuits made therewith |
| 02/09/2006 | US20060031068 Analysis method |
| 02/09/2006 | US20060030170 Micro-bumps to enhance LGA interconnections |
| 02/09/2006 | US20060030153 Apparatus and method for manufacturing semiconductor device incorporating fuse elements |
| 02/09/2006 | US20060030150 Packaged microelectronic devices and methods for packaging microelectronic devices |
| 02/09/2006 | US20060030147 Selectively coating bond pads |
| 02/09/2006 | US20060030144 Method of fabricating integrated circuitry |
| 02/09/2006 | US20060030127 Method of fabricating semiconductor device |
| 02/09/2006 | US20060030099 Beta control using a rapid thermal oxidation |
| 02/09/2006 | US20060030083 Semiconductor device and fabricating method thereof |
| 02/09/2006 | US20060030082 Semiconductor device and fabricating method thereof |
| 02/09/2006 | US20060030081 Method for fabricating semiconductor package with circuit side polymer layer |
| 02/09/2006 | US20060030078 Methods of fabricating integrated circuitry |
| 02/09/2006 | US20060030077 Substrate comprising a plurality of integrated circuitry die, and a substrate |
| 02/09/2006 | US20060030076 Semiconductor device |
| 02/09/2006 | US20060030074 Method for connecting substrate and composite element |
| 02/09/2006 | US20060030073 Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components |
| 02/09/2006 | US20060030063 Package structure for light emitting diode and method thereof |
| 02/09/2006 | US20060030061 Process for locating, displaying, analyzing, and optionally monitoring potential transient defect sites in one or more integrated circuit chips of a semiconductor substrate |
| 02/09/2006 | US20060029781 Circuitized substrate and method of making same |
| 02/09/2006 | US20060029731 Conductive inks for metalization in integrated polymer microsystems |
| 02/09/2006 | US20060028806 Leadframe-based module DC bus design to reduce module inductance |
| 02/09/2006 | US20060028801 Multiple integrated circuit package module |
| 02/09/2006 | US20060028799 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| 02/09/2006 | US20060028798 Heat-radiating device assembly |
| 02/09/2006 | US20060028655 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
| 02/09/2006 | US20060028631 Exposure apparatus and exposure method |
| 02/09/2006 | US20060027937 Electrical contact encapsulation |
| 02/09/2006 | US20060027935 Semiconductor device with semiconductor components connected to one another |
| 02/09/2006 | US20060027934 Silicon chip carrier with conductive through-vias and method for fabricating same |
| 02/09/2006 | US20060027933 Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints |