| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/16/2006 | US20060032049 Circuit device manufacturing method |
| 02/16/2006 | DE19712551B4 Zuleitungsrahmen und darauf angewendetes Herstellungsverfahren für Halbleitergehäuse in Chipgröße Lead frame and on-applied method for manufacturing semiconductor packages in chip size |
| 02/16/2006 | DE112004000533T5 Elektronikbaugruppe mit Fluidkühlung und assoziierte Verfahren Electronics module with fluid cooling and associated method |
| 02/16/2006 | DE102005033916A1 Ausrichtung eines MTJ-Stapels an Leiterbahnen in Abwesenheit von Topographie Orientation of a MTJ stack of printed conductors in the absence of topography |
| 02/16/2006 | DE102005028494A1 Circuit substrate for preparing a semiconductor chip carrier by flip chip technique has contact lead frame and flip chip lead frame |
| 02/16/2006 | DE102005015036A1 Verfahren zur Montage eines Chips auf einer Unterlage und nach diesem Verfahren hergestellte Anordnung A method of mounting a chip on a substrate and produced by this process arrangement |
| 02/16/2006 | DE102004060442A1 Passivation film forming method for semiconductor device e.g. flash memory, involves forming buffer oxide film on metal wires before forming high density plasma film |
| 02/16/2006 | DE102004057504A1 Halbleitervorrichtung und Herstellungsverfahren für diese A semiconductor device and manufacturing method for this |
| 02/16/2006 | DE102004037191A1 Halbleiterbautelement mit einer Passivierungsschicht und Verfahren zu seiner Herstellung Halbleiterbautelement with a passivation layer and process for its preparation |
| 02/16/2006 | DE102004036520A1 Bauelementanordnung mit einer Auswerteschaltung zur Detektion eines Verschleißes von Anschlussverbindungen Component assembly with an evaluation circuit for detection of wear of connections |
| 02/16/2006 | DE102004035746A1 Power semiconductor module has heat conductive element in baseplate with connection to cooling element and components mounted on the opposite face |
| 02/16/2006 | DE102004035745A1 Integrierter Schaltkreis Integrated circuit |
| 02/16/2006 | DE102004035368A1 Substrat mit Leiterbahnen und Herstellung der Leiterbahnen auf Substraten für Halbleiterbauteile Substrate with conductor tracks and manufacture of the conductor tracks on substrates for semiconductor devices |
| 02/16/2006 | DE102004034937A1 Thermoelectric heat dissipation device fabricating method, involves adhering thermoelectric semiconductive unit to be sandwiched between base plate and heat sink so that P-N posts are electrically connected with conductive lines |
| 02/16/2006 | DE102004026159B3 Production of an electronic component used in the production of integrated circuits comprises forming an insulating layer as a metal oxide layer by plasma-electrolytic oxidation of the metal |
| 02/16/2006 | DE102004018468A1 Verfahren zum strukturierten Aufbringen einer laminierbaren Folie auf ein Substrat für ein Halbleitermodul Method for structured application of a laminatable film on a substrate for a semiconductor module |
| 02/16/2006 | DE102004018144B4 Cooler for e.g. graphics card, has discharge channels that are formed in nozzle plate and fluidly connected with discharge pipe connection for conduction of cooling medium e.g. water, on base plate |
| 02/16/2006 | DE102004005022B4 Verfahren zur Herstellung von metallischen Leitbahnen auf elektronischen Bauelementen A process for the production of metallic interconnects to electronic components |
| 02/15/2006 | EP1626615A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same |
| 02/15/2006 | EP1626239A1 Heat exchanger and method of production thereof |
| 02/15/2006 | EP1626065A1 Resin composition, method of its composition, and cured formulation |
| 02/15/2006 | EP1625623A2 A novel packaging method for microstructure and semiconductor devices |
| 02/15/2006 | EP1625619A1 Interconnection pattern design |
| 02/15/2006 | EP1625618A1 Semiconductor package having filler metal of gold/silver/copper alloy |
| 02/15/2006 | EP1625616A2 Use of voids between elements in semiconductor structures for isolation |
| 02/15/2006 | EP1625095A2 Microelectromechanical device packages with integral heaters |
| 02/15/2006 | EP1247293A4 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby |
| 02/15/2006 | CN2759113Y Heat radiation module for electronic apparatus |
| 02/15/2006 | CN2758980Y LED lamp source structure |
| 02/15/2006 | CN2758979Y LED illuminant heart radiation structure |
| 02/15/2006 | CN2758976Y Direct jointed chip packaging structure |
| 02/15/2006 | CN2758975Y Improvement of soaking plate structure |
| 02/15/2006 | CN2758974Y Fan-stirring type liquid metal core plate radiator |
| 02/15/2006 | CN2758973Y Air guiding hood for CPU radiator |
| 02/15/2006 | CN2758972Y Chip package for IC |
| 02/15/2006 | CN2758851Y Modularized radiator |
| 02/15/2006 | CN2758849Y Side blowing type CPU radiator |
| 02/15/2006 | CN2758848Y Air guiding hood with sponge strip |
| 02/15/2006 | CN2758847Y Circular fan for CPU radiator |
| 02/15/2006 | CN1735967A Post CMP porogen burn out process |
| 02/15/2006 | CN1735966A Column adsorption head and column loading method |
| 02/15/2006 | CN1735965A Method for producing microsystems |
| 02/15/2006 | CN1735964A Semiconductor device |
| 02/15/2006 | CN1735963A Semiconductor packaging with partially patterned lead frames and its making methods |
| 02/15/2006 | CN1735958A Space-efficient package for laterally conducting device |
| 02/15/2006 | CN1735945A Gas layer formation materials |
| 02/15/2006 | CN1735853A Tamper-resistant packaging and approach using magnetically-set data |
| 02/15/2006 | CN1734803A Semiconductor light-emitting device and method of manufacturing the same |
| 02/15/2006 | CN1734801A Optical semiconductor module and semiconductor device including the same |
| 02/15/2006 | CN1734767A Integrated circuit devices including passive device shielding structures and methods of forming the same |
| 02/15/2006 | CN1734761A Fuse circuit and electrical fuse circuit with electrostatic discharge (ESD) protection |
| 02/15/2006 | CN1734760A 半导体元件及其制造方法 Semiconductor device and manufacturing method |
| 02/15/2006 | CN1734759A Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof |
| 02/15/2006 | CN1734758A LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device |
| 02/15/2006 | CN1734757A 电子回路装置 Electronic circuit devices |
| 02/15/2006 | CN1734756A 电子回路装置 Electronic circuit devices |
| 02/15/2006 | CN1734755A Method for metallization and passivation of solderable topmost part of source packaging semiconductor die |
| 02/15/2006 | CN1734754A Integrated circuit packaging structure and manufacturing method thereof |
| 02/15/2006 | CN1734753A Joining device for fin type heat radiator and heat spreader |
| 02/15/2006 | CN1734752A Heat radiator and manufacturing method thereof |
| 02/15/2006 | CN1734751A Thermal module and manufacturing method thereof |
| 02/15/2006 | CN1734742A Layer arrange forming method and layer arrange |
| 02/15/2006 | CN1734741A Method for manufacturing semiconductor devices |
| 02/15/2006 | CN1734349A Photosensitive dielectric compositions, tapes, and method of application of a dielectric sheet using the same |
| 02/15/2006 | CN1242661C Method for mfg. multilayer ceramic plate |
| 02/15/2006 | CN1242496C Substrate for LED |
| 02/15/2006 | CN1242486C Semiconductor memory device and making method thereof |
| 02/15/2006 | CN1242479C Semiconductor integrated circuit and D/A converter and A/D converter |
| 02/15/2006 | CN1242476C Semiconductor device and photoelectric device including same |
| 02/15/2006 | CN1242474C Power module and air conditioner |
| 02/15/2006 | CN1242473C Semiconductor device and manufacture method thereof |
| 02/15/2006 | CN1242472C Welding spot structure for increasing packing reliability |
| 02/15/2006 | CN1242471C Semiconductor device and mfg. method thereof |
| 02/15/2006 | CN1242470C Capsulation body of semiconductor ship |
| 02/15/2006 | CN1242469C Radiator and its manufacturing method |
| 02/15/2006 | CN1242468C Locked CPU radiator and method thereof |
| 02/15/2006 | CN1242467C Semiconductor device and its mfg. method |
| 02/15/2006 | CN1242463C Method for mfg. stacked semiconductor device |
| 02/15/2006 | CN1242442C Protection element |
| 02/15/2006 | CN1241989C Resin composition for coating external layer of flexible circuit |
| 02/15/2006 | CN1241976C Semiconductor having themosetting dielectric material and manufacture thereof |
| 02/15/2006 | CN1241827C Making process of sealed cavity for micro electromechanical chip |
| 02/14/2006 | US7000201 Evaluation TEG for semiconductor device and method of evaluation |
| 02/14/2006 | US7000162 Integrated circuit phase partitioned power distribution for stress power reduction |
| 02/14/2006 | US6999806 High temperature superconducting josephson junctin, superconducting electronic device provided with the former and method of manufacturing high temperature superconducting josephson junction |
| 02/14/2006 | US6999375 Synchronous semiconductor device and method of preventing coupling between data buses |
| 02/14/2006 | US6999332 Semiconductor package with a controlled impedance bus and method of forming same |
| 02/14/2006 | US6999317 Thermally enhanced electronic module with self-aligning heat sink |
| 02/14/2006 | US6999316 Liquid cooling system |
| 02/14/2006 | US6999314 Cooling device, electronic equipment device, and method of manufacturing cooling device |
| 02/14/2006 | US6999312 Heatsink apparatus |
| 02/14/2006 | US6999299 Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board |
| 02/14/2006 | US6999150 Electro-optical device, method for making the same, and electronic apparatus |
| 02/14/2006 | US6998953 High performance RF inductors and transformers using bonding technique |
| 02/14/2006 | US6998952 Inductive device including bond wires |
| 02/14/2006 | US6998943 High-frequency power amplifier |
| 02/14/2006 | US6998868 Test key for bridge and continuity testing |
| 02/14/2006 | US6998721 A first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first |
| 02/14/2006 | US6998720 Semiconductor package device and method for fabricating the same |
| 02/14/2006 | US6998719 Power grid layout techniques on integrated circuits |