| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/21/2006 | US7001786 Semiconductor device and method for fabricating the same |
| 02/21/2006 | US7001569 Comprises shrink-suppressing layers on main surface of presintered ceramic; efficiency; electronic |
| 02/21/2006 | US7001197 Land grid array socket |
| 02/21/2006 | US7000846 Semiconductor memory device |
| 02/21/2006 | US7000843 Luminescent card device |
| 02/21/2006 | US7000821 Method and apparatus for improving an integrated circuit device |
| 02/21/2006 | US7000687 Heat dissipating device |
| 02/21/2006 | US7000686 Heat transport device and electronic device |
| 02/21/2006 | US7000684 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
| 02/21/2006 | US7000683 Heatsink device |
| 02/21/2006 | US7000315 Method of making photolithographically-patterned out-of-plane coil structures |
| 02/21/2006 | US7000312 Circuit board device and mounting method therefor |
| 02/16/2006 | WO2006017224A2 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
| 02/16/2006 | WO2006016936A1 Thermally conductive sheet |
| 02/16/2006 | WO2006016918A1 Bond pad structure for copper metallization having inceased reliability and method for fabricating same |
| 02/16/2006 | WO2006016710A1 Carbon black colorant for semiconductor sealing material and process for producing the same |
| 02/16/2006 | WO2006016678A1 Semiconductor device and its manufacturing method |
| 02/16/2006 | WO2006016479A1 Heat sink member and method for manufacture thereof |
| 02/16/2006 | WO2006016367A2 Semiconductor cooling system and process for manufacturing the same |
| 02/16/2006 | WO2006016198A1 Electronic component with stacked semiconductor chips and heat dissipating means |
| 02/16/2006 | WO2005115742A3 Improved thermal interface material |
| 02/16/2006 | WO2005098085A3 Multi-stage curing of low k nano-porous films |
| 02/16/2006 | WO2005022966A3 A method for pattern metalization of substrates |
| 02/16/2006 | WO2005004200A3 Lead frame routed chip pads for semiconductor packages |
| 02/16/2006 | US20060035613 High frequency module and manufacturing method thereof |
| 02/16/2006 | US20060035503 Invertible microfeature device packages and associated methods |
| 02/16/2006 | US20060035460 Wiring structure for integrated circuit with reduced intralevel capacitance |
| 02/16/2006 | US20060035453 Method of forming a solder ball on a board and the board |
| 02/16/2006 | US20060035438 Method and resulting structure for manufacturing semiconductor substrates |
| 02/16/2006 | US20060035416 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 02/16/2006 | US20060035413 Thermal protection for electronic components during processing |
| 02/16/2006 | US20060035412 Semiconductor attachment method |
| 02/16/2006 | US20060035406 Method of forming a composite polymer material inside trenches of a semiconductor substrate to form a composite polymer structure |
| 02/16/2006 | US20060035400 Apparatus of ion sensitive thin film transistor and method of manufacturing of the same |
| 02/16/2006 | US20060035085 Combining raw material for an organic polymer of polyamic acid and carbon particles; forming a film of particles dispersed in the organic polymer; heat treating the film; improved thermal conductivity in the layer direction, retaining the high thermal conductivity characteristsin the planar direction |
| 02/16/2006 | US20060034055 Compact cooling device |
| 02/16/2006 | US20060034054 Power converter cooling |
| 02/16/2006 | US20060033664 Integrated circuit package including miniature antenna |
| 02/16/2006 | US20060033607 System and method for sensitivity optimization of RF receiver using adaptive nulling |
| 02/16/2006 | US20060033559 Semiconductor integrated circuit having noise detect circuits detecting noise on power supply nets |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/16/2006 | US20060033503 Sensitive test structure for assessing pattern anomalies |
| 02/16/2006 | US20060033219 Low profile, chip-scale package and method of fabrication |
| 02/16/2006 | US20060033218 Plug-in Connector |
| 02/16/2006 | US20060033217 Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same |
| 02/16/2006 | US20060033216 Stacked packages |
| 02/16/2006 | US20060033215 Diffusion barrier process for routing polysilicon contacts to a metallization layer |
| 02/16/2006 | US20060033214 Semiconductor device and manufacturing method of the same |
| 02/16/2006 | US20060033213 Multilayered anisotropic conductive adhesive for fine pitch |
| 02/16/2006 | US20060033212 Wafer level package, multi-package stack, and method of manufacturing the same |
| 02/16/2006 | US20060033211 Power gridding scheme |
| 02/16/2006 | US20060033210 Fine pitch low-cost flip chip substrate |
| 02/16/2006 | US20060033209 Hybrid integrated circuit device |
| 02/16/2006 | US20060033208 Contacting structure for a semiconductor material and a method for providing such structures |
| 02/16/2006 | US20060033207 Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication |
| 02/16/2006 | US20060033206 Semiconductor cooling system and process for manufacturing the same |
| 02/16/2006 | US20060033205 Liquid metal thermal interface for an integrated circuit device |
| 02/16/2006 | US20060033204 Method of creating shielded structures to protect semiconductor devices |
| 02/16/2006 | US20060033203 Integrated circuit package and method for manufacturing same |
| 02/16/2006 | US20060033202 Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board |
| 02/16/2006 | US20060033201 Systems and methods for wafer bonding by localized induction heating |
| 02/16/2006 | US20060033200 Ceramic package, assembled substrate, and manufacturing method therefor |
| 02/16/2006 | US20060033199 Electronic circuit device |
| 02/16/2006 | US20060033198 Semiconductor device with sidewall wiring |
| 02/16/2006 | US20060033197 Power gridding scheme |
| 02/16/2006 | US20060033196 Package structure |
| 02/16/2006 | US20060033195 Electronic module with form in-place pedestal |
| 02/16/2006 | US20060033194 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 02/16/2006 | US20060033193 Methods and apparatuses for providing stacked-die devices |
| 02/16/2006 | US20060033192 Methods and systems for attaching die in stacked-die packages |
| 02/16/2006 | US20060033191 Memory card |
| 02/16/2006 | US20060033190 Vertically mountable and alignable semiconductor device packages and assemblies including the same |
| 02/16/2006 | US20060033189 Structure and method of forming capped chips |
| 02/16/2006 | US20060033188 Electronic component packaging |
| 02/16/2006 | US20060033187 Rugged CSP module system and method |
| 02/16/2006 | US20060033186 Broken die detect sensor |
| 02/16/2006 | US20060033185 Integrated circuit chip packaging assembly |
| 02/16/2006 | US20060033184 Process and lead frame for making leadless semiconductor packages |
| 02/16/2006 | US20060033181 Buried conductors |
| 02/16/2006 | US20060033180 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers and method of making |
| 02/16/2006 | US20060033177 Integrated circuit resistor |
| 02/16/2006 | US20060033164 Semiconductor device |
| 02/16/2006 | US20060033163 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process |
| 02/16/2006 | US20060033162 [metal oxide semiconductor device for electrostatic discharge protection circuit] |
| 02/16/2006 | US20060033130 Liquid crystal display device |
| 02/16/2006 | US20060033124 Method for fabrication of semiconductor device |
| 02/16/2006 | US20060033118 System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack |
| 02/16/2006 | US20060033100 Anisotropically conductive connector and production process thereof, and probe member |
| 02/16/2006 | US20060032835 Method and apparatus for simulating standard test wafers |
| 02/16/2006 | US20060032619 Heat-radiating device with a guide cap |
| 02/16/2006 | US20060032617 Heat sink electronic components |
| 02/16/2006 | US20060032615 Integrated circuit heat pipe heat spreader with through mounting holes |
| 02/16/2006 | US20060032610 Cooling fin assembly |
| 02/16/2006 | US20060032608 Micro-chimney and thermosiphon die-level cooling |
| 02/16/2006 | US20060032577 Method for the manufacture of a smart label inlet web, and a smart label inlet web |
| 02/16/2006 | US20060032530 Solution processed pentacene-acceptor heterojunctions in diodes, photodiodes, and photovoltaic cells and method of making same |
| 02/16/2006 | US20060032525 Boron carbide films with improved thermoelectric and electric properties |
| 02/16/2006 | US20060032310 Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package |
| 02/16/2006 | US20060032051 connecting multilayer printed circuits using apertures formed through layers, then sputtering or plating electroconductive plugs having contact pads |
| 02/16/2006 | US20060032050 Methods of forming a contact array in situ on a substrate |