| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/22/2006 | CN2760756Y Biphase liquid regurgitating type radiator |
| 02/22/2006 | CN2760755Y Goal array package with radiator |
| 02/22/2006 | CN2760382Y LED module and LED bulb manufactured thereby |
| 02/22/2006 | CN1739324A Multi-layer ceramic substrate and method for manufacturing thereof |
| 02/22/2006 | CN1739197A DC-DC converter implemented in a land grid array package |
| 02/22/2006 | CN1739193A Diffusion barrier and method therefor |
| 02/22/2006 | CN1738927A Metal photo-etching product and production method therefor |
| 02/22/2006 | CN1738864A Epoxy resin composition and semiconductor device using thereof |
| 02/22/2006 | CN1738521A A liquid cooling system and an electronic apparatus applying the same therein |
| 02/22/2006 | CN1738514A High thermal cycle conductor system |
| 02/22/2006 | CN1738121A Terminal box and a method of providing it |
| 02/22/2006 | CN1738043A Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing |
| 02/22/2006 | CN1738042A IC structure and its forming method |
| 02/22/2006 | CN1738041A QFN package and its method |
| 02/22/2006 | CN1738040A Cof semiconductor device and a manufacturing method for the same |
| 02/22/2006 | CN1738039A Semiconductor device and manufacturing method of the same |
| 02/22/2006 | CN1738038A Ball grid array package structure and its base plate |
| 02/22/2006 | CN1738037A Integrated circuit or discrete component flat bump combination package structure |
| 02/22/2006 | CN1738036A Integrated circuit or discrete component flat pen bump package structure |
| 02/22/2006 | CN1738035A Integrated circuit or discrete component flat array bump package structure |
| 02/22/2006 | CN1738034A Integrated circuit or discrete component flat array bump package structure |
| 02/22/2006 | CN1738033A Package structure |
| 02/22/2006 | CN1738032A Hot pipe |
| 02/22/2006 | CN1738031A Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body |
| 02/22/2006 | CN1738030A Substrate for producing semiconductor packages |
| 02/22/2006 | CN1738025A Method for manufacturing trajectory with enlarged capacitive coupling and corresponding trajectory |
| 02/22/2006 | CN1738020A Self-timed reliability and yield vehicle with gated data and clock |
| 02/22/2006 | CN1738017A Electrode structure of a semiconductor device and method of manufacturing the same |
| 02/22/2006 | CN1738015A Novel integrated circuit or discrete component flat bump package technics and its package structure |
| 02/22/2006 | CN1738014A Integrated circuit or discrete component flat bump package technics and its package structure |
| 02/22/2006 | CN1738013A Wafer level package structure of image sensing element and its package method |
| 02/22/2006 | CN1738012A Chip radiator fin-fitting method |
| 02/22/2006 | CN1738008A 半导体器件 Semiconductor devices |
| 02/22/2006 | CN1737947A Tubular radiator core combined template |
| 02/22/2006 | CN1737557A Method for packaging electrochemical working electrode by nano material toughened epoxy resin |
| 02/22/2006 | CN1737554A Humidity sensor and composite sensor having humidity detecting function |
| 02/22/2006 | CN1737078A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737077A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737076A Wiring-connecting material and process for producing circuit board with the same |
| 02/22/2006 | CN1737056A Epoxy resin compositions containing phosphorus and its uses |
| 02/22/2006 | CN1736582A Water-absorbing agent for organic el device and organic el device |
| 02/22/2006 | CN1243401C Semiconductor laser device and optical pick-up using said device |
| 02/22/2006 | CN1243263C Optical transmission receiver module and producing method, electronic device using with the same module |
| 02/21/2006 | US7003341 Analyte monitoring devices and methods of use |
| 02/21/2006 | US7003149 Method and device for optically monitoring fabrication processes of finely structured surfaces in a semiconductor production |
| 02/21/2006 | US7002866 Semiconductor memory device |
| 02/21/2006 | US7002809 Liquid crystal display driver integrated circuit package |
| 02/21/2006 | US7002807 Electronic component |
| 02/21/2006 | US7002804 Heat dissipating apparatus |
| 02/21/2006 | US7002803 Electronic product with heat radiating plate |
| 02/21/2006 | US7002802 Cooling device, electronic apparatus, display unit, and method of producing cooling device |
| 02/21/2006 | US7002801 Method of cooling semiconductor die using microchannel thermosyphon |
| 02/21/2006 | US7002800 Integrated power and cooling architecture |
| 02/21/2006 | US7002795 Low noise heatsink |
| 02/21/2006 | US7002647 Display device and method of manufacturing the same |
| 02/21/2006 | US7002257 Optical component package and packaging including an optical component horizontally attached to a substrate |
| 02/21/2006 | US7002256 Semiconductor device having wiring patterns and dummy patterns covered with insulating layer |
| 02/21/2006 | US7002255 Multi-chips stacked package |
| 02/21/2006 | US7002254 Integrated circuit package employing flip-chip technology and method of assembly |
| 02/21/2006 | US7002253 Semiconductor device and design method thereof |
| 02/21/2006 | US7002252 Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure |
| 02/21/2006 | US7002251 Semiconductor device |
| 02/21/2006 | US7002250 Semiconductor module |
| 02/21/2006 | US7002249 Microelectronic component with reduced parasitic inductance and method of fabricating |
| 02/21/2006 | US7002248 Semiconductor components having multiple on board capacitors |
| 02/21/2006 | US7002247 Thermal interposer for thermal management of semiconductor devices |
| 02/21/2006 | US7002246 Chip package structure with dual heat sinks |
| 02/21/2006 | US7002245 Semiconductor package having conductive bumps on chip and method for fabricating the same |
| 02/21/2006 | US7002244 Semiconductor device |
| 02/21/2006 | US7002243 Signal transmission circuit, CMOS semiconductor device, and circuit board |
| 02/21/2006 | US7002242 Ball grid array package semiconductor device having improved power line routing |
| 02/21/2006 | US7002240 Semiconductor leadframe for staggered board attach |
| 02/21/2006 | US7002239 Leadless leadframe packaging panel featuring peripheral dummy leads |
| 02/21/2006 | US7002238 Use of a down-bond as a controlled inductor in integrated circuit applications |
| 02/21/2006 | US7002237 Spherical shaped semiconductor device, a flexible printed wiring substrate, and mounting method thereof |
| 02/21/2006 | US7002236 Semiconductor package and method for producing the same |
| 02/21/2006 | US7002233 Integrated circuit including an inductive element having a large quality factor and being highly compact |
| 02/21/2006 | US7002225 Compliant component for supporting electrical interface component |
| 02/21/2006 | US7002223 Semiconductor device having elevated source/drain |
| 02/21/2006 | US7002221 Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same |
| 02/21/2006 | US7002220 ESD protection circuit |
| 02/21/2006 | US7002219 Electrical fuse for integrated circuits |
| 02/21/2006 | US7002218 Low capacitance ESD-protection structure under a bond pad |
| 02/21/2006 | US7002217 Electrostatic discharge mitigation structure and methods thereof using a dissipative capacitor with voltage dependent resistive material |
| 02/21/2006 | US7002216 ESD performance using separate diode groups |
| 02/21/2006 | US7002215 Floating entrance guard for preventing electrical short circuits |
| 02/21/2006 | US7002201 Semiconductor device and manufacturing method thereof |
| 02/21/2006 | US7002191 Single layer configurable logic |
| 02/21/2006 | US7002185 Semiconductor device using semiconductor chip |
| 02/21/2006 | US7002177 Test region layout for shallow trench isolation |
| 02/21/2006 | US7002080 for mounting semiconductor chips having finely pitched external connection electrodes and an essentially small thermal expansion coefficient; applicable to semiconductor chip mounting boards, motherboards, probe cards; carbon fiber core |
| 02/21/2006 | US7002075 Intermediate substrate |
| 02/21/2006 | US7001850 Method of depositing dielectric films |
| 02/21/2006 | US7001839 Semiconductor device with tapered contact hole and wire groove |
| 02/21/2006 | US7001835 Crystallographic modification of hard mask properties |
| 02/21/2006 | US7001834 Integrated circuit and method of manufacturing an integrated circuit and package |
| 02/21/2006 | US7001825 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same |
| 02/21/2006 | US7001798 Method of manufacturing semiconductor device |
| 02/21/2006 | US7001797 Optical device and method of manufacturing the same, optical module, circuit board, and electronic instrument |
| 02/21/2006 | US7001793 Method of protecting microfabricated devices with protective caps |