| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/23/2006 | US20060038301 Micro structure with interlock configuration |
| 02/23/2006 | US20060038300 Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device |
| 02/23/2006 | US20060038299 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 02/23/2006 | US20060038298 Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
| 02/23/2006 | US20060038297 Semiconductor device |
| 02/23/2006 | US20060038296 Integrated low-k hard mask |
| 02/23/2006 | US20060038295 Selectively encased surface metal structures in a semiconductor device |
| 02/23/2006 | US20060038294 Metallization performance in electronic devices |
| 02/23/2006 | US20060038293 Inter-metal dielectric fill |
| 02/23/2006 | US20060038292 Semiconductor device having wires that vary in wiring pitch |
| 02/23/2006 | US20060038291 Electrode structure of a semiconductor device and method of manufacturing the same |
| 02/23/2006 | US20060038289 Integrated inductors and compliant interconnects for semiconductor packaging |
| 02/23/2006 | US20060038288 Substrate with many via contact means disposed therein |
| 02/23/2006 | US20060038287 LSI package equipped with interface module, interface module and connection holding mechanism |
| 02/23/2006 | US20060038286 Package, method for producing a package and a device for producing a package |
| 02/23/2006 | US20060038285 Electronic apparatus |
| 02/23/2006 | US20060038284 Fluid cooled encapsulated microelectronic package |
| 02/23/2006 | US20060038283 Integrated circuit with increased heat transfer |
| 02/23/2006 | US20060038282 Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages |
| 02/23/2006 | US20060038281 Multiple power density chip structure |
| 02/23/2006 | US20060038280 Substrate for producing semiconductor packages |
| 02/23/2006 | US20060038279 System-on-a-chip with multi-layered metallized through-hole interconnection |
| 02/23/2006 | US20060038278 Submember mounted on a chip of electrical device for electrical connection |
| 02/23/2006 | US20060038277 Semiconductor device and electronic apparatus using the same |
| 02/23/2006 | US20060038276 Methods and systems for attaching die in stacked-die packages |
| 02/23/2006 | US20060038275 Method and apparatus for manufacturing stacked-type semiconductor device |
| 02/23/2006 | US20060038274 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules |
| 02/23/2006 | US20060038273 Electronic packages with dice landed on wire bonds |
| 02/23/2006 | US20060038272 Stacked wafer scale package |
| 02/23/2006 | US20060038271 Substrate isolation design |
| 02/23/2006 | US20060038270 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment |
| 02/23/2006 | US20060038269 Method and apparatus for lubricating microelectromechanical devices in packages |
| 02/23/2006 | US20060038268 Semiconductor module |
| 02/23/2006 | US20060038267 Display device with characteristic data stored therein |
| 02/23/2006 | US20060038266 QFN package and method therefor |
| 02/23/2006 | US20060038265 Multi-path bar bond connector for an integrated circuit assembly |
| 02/23/2006 | US20060038264 Printed circuit board |
| 02/23/2006 | US20060038263 Semiconductor chip arrangement |
| 02/23/2006 | US20060038262 Semiconductor processing methods |
| 02/23/2006 | US20060038260 Semiconductor wafer and method of manufacturing semiconductor device |
| 02/23/2006 | US20060038253 Pressed-contact type semiconductor device |
| 02/23/2006 | US20060038250 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment |
| 02/23/2006 | US20060038245 Semiconductor device and method of producing the same |
| 02/23/2006 | US20060038239 Semiconductor device and method of manufacturing the same |
| 02/23/2006 | US20060038231 Post passivation interconnection schemes on top of the IC chips |
| 02/23/2006 | US20060038172 Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages |
| 02/23/2006 | US20060038171 Semiconductor integrated circuit design tool, computer implemented method for designing semiconductor integrated circuit, and method for manufacturing semiconductor integrated circuit |
| 02/23/2006 | US20060038168 Terahertz interconnect system and applications |
| 02/23/2006 | US20060037738 Heat-dissipating device with heat pipe |
| 02/23/2006 | US20060037735 Bi-level heat sink |
| 02/23/2006 | DE19746641B4 Verdrahtungsverfahren für Halbleiter-Bauelemente zur Verhinderung von Produktpiraterie und Produktmanipulation und Verwendung des Halbleiter-Bauelements in einer Chipkarte Wiring method for semiconductor devices to prevent piracy and product manipulation and use of the semiconductor device in a smart card |
| 02/23/2006 | DE19733702B4 Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses Semiconductor package and method for manufacturing a semiconductor package |
| 02/23/2006 | DE19726308B4 Verfahren zur Bildung einer Polycidschicht bei einem Halbleiterbauelement sowie Halbleiterbauelement A method for forming a polycide layer on a semiconductor device and semiconductor device |
| 02/23/2006 | DE19709259B4 Mehrlagiges Bodenanschlussgehäuse A multi-layer floor connection housing |
| 02/23/2006 | DE19608208B4 Verfahren zur Herstellung von Metallzwischenverbindungen in Halbleitereinrichtungen A process for the production of metal interconnections in semiconductor devices |
| 02/23/2006 | DE10393588T5 Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch Optimal propagation system, apparatus and method for liquid-cooled micro-scaled heat exchange |
| 02/23/2006 | DE10393585T5 Verteiler zur Reduzierung des Druckabfalls in Mikrokanal-Wärmetauschern Manifold for the reduction of the pressure drop in the microchannel heat exchangers |
| 02/23/2006 | DE10393583T5 Rippen-Wärmetauschsystem mit Kanal-Flachplatten, Vorrichtung und Verfahren Fin heat exchanger system with channel flat plate, Device and method |
| 02/23/2006 | DE102005038452A1 Halbleiterwafer und Prüfverfahren Semiconductor wafer and test methods |
| 02/23/2006 | DE102005032280A1 Silberinsel-Antifuse Silver island anti-fuse |
| 02/23/2006 | DE102005030517A1 Control method for controlling temperature of heat source, e.g. microprocessor, involves channeling two temperature fluids to and from heat exchange surface, respectively, wherein fluid is channeled to minimize temperature differences along |
| 02/23/2006 | DE102004059031A1 Gehäusestruktur Housing structure |
| 02/23/2006 | DE102004040503A1 Semiconductor element such as a conductive bridging RAM has chip in housing with screening layer on chip and housing for electric and or magnetic shielding |
| 02/23/2006 | DE102004039693A1 Chipmodul Chip module |
| 02/23/2006 | DE102004039565A1 Mehrlagige Wärmeleitfolie Multi-layer thermal pad |
| 02/23/2006 | DE102004039228A1 Kühlvorrichtung Cooler |
| 02/23/2006 | DE102004038970A1 HF intermediate connection for multiple wiring structures comprises an electrically conducting filler or coating on the wall of a via |
| 02/23/2006 | DE102004037826A1 Halbleitervorrichtung mit miteinander verbundenen Halbleiterbauelementen A semiconductor device having interconnected semiconductor devices |
| 02/23/2006 | DE102004037588A1 Elektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Bauelements An electrical component and method for manufacturing an electrical component |
| 02/23/2006 | DE102004037336A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 02/23/2006 | DE102004012819B4 Leistungshalbleiterbauelement mit erhöhter Robustheit Power semiconductor component with improved durability |
| 02/23/2006 | DE10164049B4 Passive Bauelementstruktur und diese enthaltendes integriertes Schaltkreisbauelement und Halbleiterbauelement Passive component structure and containing these integrated circuit device and semiconductor device |
| 02/23/2006 | DE10125407B4 Verbesserte elektronische Sicherungen durch die lokale Verschlechterung der schmelzbaren Verbindung Improved electronic fuses by the local deterioration of the fusible link |
| 02/23/2006 | DE10111708B4 Halbleitervorrichtung und Herstellungsverfahren für dieselbe A semiconductor device and manufacturing method for the same |
| 02/23/2006 | DE10041565B4 Metallzwischenverbindung, Halbleitervorrichtung, Verfahren zum Bilden einer Metallzwischenverbindung und Verfahren zum Herstellen einer Halbleitervorrichtung Interconnect metal, semiconductor device, method for forming a metal interconnect and method for making a semiconductor device |
| 02/23/2006 | DE10024111B4 Verfahren zur Herstellung eines Bauelements aus übereinander gestapelten miteinander verlöteten Platten A method for producing a component of stacked plates soldered together |
| 02/23/2006 | CA2577681A1 Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| 02/22/2006 | EP1628509A2 Electronic module with form in-place pedestal |
| 02/22/2006 | EP1628347A1 Semiconductor chip leadframe module |
| 02/22/2006 | EP1628346A2 Multi-path bar bond connector for an integrated circuit assembly |
| 02/22/2006 | EP1628345A2 Fluid cooled encapsulated micoelectronic package |
| 02/22/2006 | EP1628344A2 Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
| 02/22/2006 | EP1628343A2 Cooling device |
| 02/22/2006 | EP1628342A1 Heatsink and heatsink assembly |
| 02/22/2006 | EP1628338A1 The manufacturing method of a modularized leadframe |
| 02/22/2006 | EP1628331A1 Electrical device having a heat generating electrically resistive element and heat dissipating means therefor |
| 02/22/2006 | EP1628243A1 Ic card and ic card making method |
| 02/22/2006 | EP1627935A1 Surface treating agent for tin or tin alloy material |
| 02/22/2006 | EP1627694A1 Fly ash powder, method for producing the same, and resin composition for sealing semiconductor using the same, and semiconductor device |
| 02/22/2006 | EP1627430A1 An integrated circuit package employing a flexible substrate |
| 02/22/2006 | EP1627428A1 An integrated circuit package employing a head-spreader member |
| 02/22/2006 | EP1627427A2 An encased thermal management device and method of making such a device |
| 02/22/2006 | EP1627426A2 High density integrated circuit package architecture |
| 02/22/2006 | EP1627419A2 Package for integrated circuit die |
| 02/22/2006 | EP1627021A1 Method for applying adhesive to a substrate |
| 02/22/2006 | EP1626926A2 Method for producing a packaged integrated circuit |
| 02/22/2006 | CN2760912Y Novel heat pipe radiator |
| 02/22/2006 | CN2760911Y Special bracket of radiator |
| 02/22/2006 | CN2760910Y Heat radiation module for electronic device |
| 02/22/2006 | CN2760901Y Wiring carrier board |