| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/28/2006 | US7005752 Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion |
| 02/28/2006 | US7005751 Layered microelectronic contact and method for fabricating same |
| 02/28/2006 | US7005750 Substrate with reinforced contact pad structure |
| 02/28/2006 | US7005749 Flip chip package structure |
| 02/28/2006 | US7005748 Flip chip interface circuit of a semiconductor memory device |
| 02/28/2006 | US7005747 Semiconductor device having additional functional element and method of manufacturing thereof |
| 02/28/2006 | US7005746 Method for designing wiring connecting section and semiconductor device |
| 02/28/2006 | US7005745 Method and structure to reduce risk of gold embrittlement in solder joints |
| 02/28/2006 | US7005744 Conductor line stack having a top portion of a second layer that is smaller than the bottom portion |
| 02/28/2006 | US7005743 Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
| 02/28/2006 | US7005742 Socket grid array |
| 02/28/2006 | US7005741 Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads |
| 02/28/2006 | US7005740 Thick film millimeter wave transceiver module |
| 02/28/2006 | US7005739 High power semiconductor module |
| 02/28/2006 | US7005738 Semiconductor package with lid heat spreader |
| 02/28/2006 | US7005737 Die-up ball grid array package with enhanced stiffener |
| 02/28/2006 | US7005736 Semiconductor device power interconnect striping |
| 02/28/2006 | US7005735 Array printed circuit board |
| 02/28/2006 | US7005734 Double-sided cooling isolated packaged power semiconductor device |
| 02/28/2006 | US7005733 Anti tamper encapsulation for an integrated circuit |
| 02/28/2006 | US7005732 Methods and systems for providing MEMS devices with a top cap and upper sense plate |
| 02/28/2006 | US7005731 Plastic lead frames for semiconductor devices and packages including same |
| 02/28/2006 | US7005730 Memory module having interconnected and stacked integrated circuits |
| 02/28/2006 | US7005729 Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame |
| 02/28/2006 | US7005728 Lead configuration for inline packages |
| 02/28/2006 | US7005727 Low cost programmable CPU package/substrate |
| 02/28/2006 | US7005726 Semiconductor device with an improved transmission line |
| 02/28/2006 | US7005724 Semiconductor device and a method of manufacture therefor |
| 02/28/2006 | US7005721 RF passive circuit and RF amplifier with via-holes |
| 02/28/2006 | US7005718 Scribe line planarization layer |
| 02/28/2006 | US7005708 Minimum-dimension, fully-silicided MOS driver and ESD protection design for optimized inter-finger coupling |
| 02/28/2006 | US7005707 Electrostatic discharge protection circuit |
| 02/28/2006 | US7005670 Thin film transistor array substrate for liquid crystal display and method of fabricating the same |
| 02/28/2006 | US7005640 Method and apparatus for the characterization of a depth structure in a substrate |
| 02/28/2006 | US7005585 Mounting board and electronic device using same |
| 02/28/2006 | US7005577 Semiconductor chip package having an adhesive tape attached on bonding wires |
| 02/28/2006 | US7005375 Method to avoid copper contamination of a via or dual damascene structure |
| 02/28/2006 | US7005371 Method of forming suspended transmission line structures in back end of line processing |
| 02/28/2006 | US7005370 Method of manufacturing different bond pads on the same substrate of an integrated circuit package |
| 02/28/2006 | US7005369 Active area bonding compatible high current structures |
| 02/28/2006 | US7005367 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer |
| 02/28/2006 | US7005364 Method for manufacturing semiconductor device |
| 02/28/2006 | US7005343 Semiconductor device and method of manufacturing the same |
| 02/28/2006 | US7005327 Process and structure for semiconductor package |
| 02/28/2006 | US7005325 Semiconductor package with passive device integration |
| 02/28/2006 | US7005324 Method of fabricating stacked semiconductor chips |
| 02/28/2006 | US7005323 Method and apparatus for shielding integrated circuits |
| 02/28/2006 | US7005322 Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates |
| 02/28/2006 | US7005321 Stress-compensation layers in contact arrays, and processes of making same |
| 02/28/2006 | US7005320 Method for manufacturing flip chip package devices with a heat spreader |
| 02/28/2006 | US7005318 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 02/28/2006 | US7005307 Apparatus and method for detecting soft breakdown of a dielectric layer of a semiconductor wafer |
| 02/28/2006 | US7005248 Method of forming cavity between multilayered wirings |
| 02/28/2006 | US7005221 Method and apparatus to easily measure reticle blind positioning with an exposure apparatus |
| 02/28/2006 | US7005179 Producing three-dimensional microfluidic channels in flexible polymer substrate and filling with conductive ink |
| 02/28/2006 | US7005085 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces |
| 02/28/2006 | US7004994 Method for making a film from silver-containing particles |
| 02/28/2006 | US7004984 Resistor and, or capacitor on cermic core; firing, trimming; controlling sintering temperature |
| 02/28/2006 | US7004762 Socket for electrical parts |
| 02/28/2006 | US7004644 Hermetic chip-scale package for photonic devices |
| 02/28/2006 | US7004375 is slightly tacky at room temperature and useful for electronic component assembly; used in chip scale packages (CSP) |
| 02/28/2006 | US7004325 Resin-molded package with cavity structure |
| 02/28/2006 | US7004244 Thermal interface wafer and method of making and using the same |
| 02/28/2006 | US7004239 Cooling apparatus boiling and condensing refrigerant |
| 02/28/2006 | US7004236 Fan holder |
| 02/28/2006 | US7004035 Physical value detecting apparatus and housing for physical value detecting means |
| 02/28/2006 | US7004033 Pressure sensor contained in casing |
| 02/28/2006 | US7003970 Power module and air conditioner |
| 02/23/2006 | WO2006020822A2 Integrated circuit chip packaging assembly |
| 02/23/2006 | WO2006020488A1 Microelectronic connection structures and methods |
| 02/23/2006 | WO2006019156A1 Method for manufacturing semiconductor device having three-dimensional multilayer structure |
| 02/23/2006 | WO2006019055A1 Electronic part unit |
| 02/23/2006 | WO2006019054A1 Liquid epoxy resin composition |
| 02/23/2006 | WO2006019041A1 Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| 02/23/2006 | WO2006019035A1 Copper alloy plate for electric and electronic parts having bending workability |
| 02/23/2006 | WO2005117111A3 Adhesive/spacer island structure for multiple die package |
| 02/23/2006 | WO2005098949A3 Spacer die structure and method for attaching |
| 02/23/2006 | WO2005096731A3 Heat spreader constructions, integrated circuitry, methods of forming heat speader contruictions, and methods of forming integrated circuitry |
| 02/23/2006 | WO2005070178A3 Test result marking of electronic packages |
| 02/23/2006 | WO2004100258A3 Ribbon bonding |
| 02/23/2006 | US20060041715 Multiprocessor chip having bidirectional ring interconnect |
| 02/23/2006 | US20060040540 Socket for electric component |
| 02/23/2006 | US20060040522 Method for making a microelectronic interposer |
| 02/23/2006 | US20060040488 Method of electrically connecting a microelectronic component |
| 02/23/2006 | US20060040487 Semiconductor device, method for manufacturing the same, and plating solution |
| 02/23/2006 | US20060040478 Method of producing a calibration wafer |
| 02/23/2006 | US20060040426 Circuitized substrate, method of making same and information handling system using same |
| 02/23/2006 | US20060040425 Circuit element and method of manufacturing the same |
| 02/23/2006 | US20060040424 Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
| 02/23/2006 | US20060040423 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 02/23/2006 | US20060040422 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device |
| 02/23/2006 | US20060040202 Positive working photosensitive composition |
| 02/23/2006 | US20060040112 Thermal interconnect and interface systems, methods of production and uses thereof |
| 02/23/2006 | US20060040104 Heat spreader |
| 02/23/2006 | US20060039113 Heat dissipating device with dust-collecting mechanism |
| 02/23/2006 | US20060038630 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
| 02/23/2006 | US20060038316 Methods for forming molds |
| 02/23/2006 | US20060038304 Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent |
| 02/23/2006 | US20060038303 Etched interposer for integrated circuit devices |
| 02/23/2006 | US20060038302 Thermal fatigue resistant tin-lead-silver solder |