Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/23/2014CN103744238A Array substrate and display device
04/23/2014CN103740110A Oriented flexible heat conduction material as well as forming technology and application thereof
04/23/2014CN102574987B Solvent-free and one-pack type cyanic ester/epoxy composite resin composition
04/23/2014CN102487085B Semiconductor device and manufacture method thereof
04/23/2014CN102280414B Method for manufacturing semiconductor device
04/23/2014CN102223757B Wiring board and method for manufacturing wiring board
04/23/2014CN102132405B Methods and apparatus for integrated circuit having integrated energy storage device
04/23/2014CN102104047B Nonvolatile semiconductor memory device and method for producing the same
04/23/2014CN102077341B Packaged semiconductor product and method for manufacture thereof
04/23/2014CN102053682B Heat radiation device
04/23/2014CN101997187B Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly
04/23/2014CN101969056B Cast grid array (CGA) package and socket
04/23/2014CN101740622B Trench shielding structure for semiconductor device and method
04/23/2014CN101685817B Semiconductor chip
04/23/2014CN101681886B Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
04/23/2014CN101371356B Quasi-radial heatsink with rectangular form factor and uniform fin length
04/22/2014US8705257 Switching module including a snubber circuit connected in parallel to a series-connected unit of flowing restriction elements
04/22/2014US8705240 Embossed heat spreader
04/22/2014US8705239 Heat dissipation for electronic modules
04/22/2014US8705238 External storage device and method of manufacturing external storage device
04/22/2014US8704531 Loop element and noise analyzer
04/22/2014US8704442 Method of light dispersion and preferential scattering of certain wavelengths of light for light-emitting diodes and bulbs constructed therefrom
04/22/2014US8704385 Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device
04/22/2014US8704384 Stacked die assembly
04/22/2014US8704383 Silicon-based thin substrate and packaging schemes
04/22/2014US8704382 Film for flip chip type semiconductor back surface
04/22/2014US8704381 Very extremely thin semiconductor package
04/22/2014US8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
04/22/2014US8704379 Semiconductor die mount by conformal die coating
04/22/2014US8704378 Semiconductor device
04/22/2014US8704377 Compliant conductive nano-particle electrical interconnect
04/22/2014US8704376 Layout of memory strap cell
04/22/2014US8704375 Barrier structures and methods for through substrate vias
04/22/2014US8704374 Semiconductor device and method for manufacturing the same
04/22/2014US8704372 Integrated circuits and methods for processing integrated circuits with embedded features
04/22/2014US8704371 Semiconductor device having multiple bump heights and multiple bump diameters
04/22/2014US8704370 Semiconductor package structure having an air gap and method for forming
04/22/2014US8704369 Flip chip bump structure and fabrication method
04/22/2014US8704368 Stackable via package and method
04/22/2014US8704367 Semiconductor device and manufacturing method of semiconductor device
04/22/2014US8704366 Ultra thin bumped wafer with under-film
04/22/2014US8704365 Integrated circuit packaging system having a cavity
04/22/2014US8704364 Reducing stress in multi-die integrated circuit structures
04/22/2014US8704363 Interface plate between integrated circuits
04/22/2014US8704362 Resin-diamagnetic material composite structure
04/22/2014US8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process
04/22/2014US8704360 Top port surface mount silicon condenser microphone package
04/22/2014US8704359 Method for manufacturing an electronic module and an electronic module
04/22/2014US8704358 Method for forming an integrated circuit
04/22/2014US8704357 Semiconductor device and power supply unit utilizing the same
04/22/2014US8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads
04/22/2014US8704355 Semiconductor device comprising through-electrode interconnect
04/22/2014US8704354 Package on package structures and methods for forming the same
04/22/2014US8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects
04/22/2014US8704352 Semiconductor device having a liquid cooling module
04/22/2014US8704351 Stacked microelectronic assemblies
04/22/2014US8704350 Stacked wafer level package and method of manufacturing the same
04/22/2014US8704349 Integrated circuit package system with exposed interconnects
04/22/2014US8704348 Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
04/22/2014US8704347 Packaged semiconductor chips
04/22/2014US8704346 Semiconductor package and radiation lead frame
04/22/2014US8704345 Semiconductor package and lead frame thereof
04/22/2014US8704344 Ultra-small chip package and method for manufacturing the same
04/22/2014US8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
04/22/2014US8704341 Semiconductor packages with thermal dissipation structures and EMI shielding
04/22/2014US8704340 Stacked single crystal compound semiconductor substrates
04/22/2014US8704339 Semiconductor device
04/22/2014US8704338 Chip comprising a fill structure
04/22/2014US8704337 Semiconductor device and method for manufacturing the same
04/22/2014US8704336 Selective removal of on-die redistribution interconnects from scribe-lines
04/22/2014US8704328 High-voltage integrated circuit device
04/22/2014US8704311 Semiconductor device having epitaxial semiconductor layer above impurity layer
04/22/2014US8704309 Display panel and method of manufacturing the same
04/22/2014US8704308 Semiconductor device
04/22/2014US8704307 Device for electrostatic discharge protection comprising triple-diffused drain structure
04/22/2014US8704275 Semiconductor die micro electro-mechanical switch management method
04/22/2014US8704265 Light emitting device package and lighting apparatus using the same
04/22/2014US8704226 Three-dimensional integrated circuit having redundant relief structure for chip bonding section
04/22/2014US8704224 Semiconductor test structures
04/22/2014US8704223 Semiconductor device
04/22/2014US8704214 Organic light emitting diode display and manufacturing method thereof
04/22/2014US8704108 Inductors occupying space above circuit board components
04/22/2014US8703625 Methods to prepare silicon-containing films
04/22/2014US8703606 Method for manufacturing semiconductor device having a wiring structure
04/22/2014US8703603 Device package and methods for the fabrication and testing thereof
04/22/2014US8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
04/22/2014US8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
04/22/2014US8703543 Vertical sensor assembly method
04/22/2014US8703541 Electronic system with expansion feature
04/22/2014US8703538 Integrated circuit packaging system with external wire connection and method of manufacture thereof
04/22/2014US8703537 System and method to manufacture an implantable electrode
04/22/2014US8703518 Packaged microelectronic imagers and methods of packaging microelectronic imagers
04/22/2014US8703508 Method for wafer-level testing diced multi-chip stacked packages
04/22/2014US8703286 Polymer matrices for polymer solder hybrid materials
04/22/2014US8703271 Thermal interface material
04/22/2014US8702052 Retention structure for heat generating component
04/22/2014US8701988 IC card
04/22/2014US8701751 Heat exchanger with interface plate forming a fluid circuit
04/22/2014US8701272 Method of forming a power module with a magnetic device having a conductive clip
04/22/2014DE202013008610U1 LED-Beleuchtungseinrichtungen LED Lighting Units
1 ... 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 ... 2262