| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/02/2006 | US20060043488 Method and system for a programmable electrostatic discharge (ESD) protection circuit |
| 03/02/2006 | US20060043487 Bi-directional ESD protection circuit |
| 03/02/2006 | US20060043477 Interposers for chip-scale packages and intermediates thereof |
| 03/02/2006 | US20060043432 Thin-layer chemical transistor and making method |
| 03/02/2006 | US20060043413 Pressed-contact type semiconductor device |
| 03/02/2006 | US20060043404 Cap for semiconductor device |
| 03/02/2006 | US20060043378 Front substrate of plasma display panel and fabrication method thereof |
| 03/02/2006 | US20060043367 Semiconductor device and method of fabricating a low temperature poly-silicon layer |
| 03/02/2006 | US20060043364 Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices |
| 03/02/2006 | US20060042824 Printed wiring board and method of manufacturing the same |
| 03/02/2006 | US20060042787 Heat dissipation device having cap for protecting thermal interface material thereon |
| 03/02/2006 | DE4135189B4 Verfahren zur Montage des Gehäuses eines Halbleiter-Bauelements Method for mounting of the housing of a semiconductor device |
| 03/02/2006 | DE19918671B4 Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung Vertically integrated circuit, and processes for their preparation |
| 03/02/2006 | DE19538019B4 Verfahren zur Bildung einer Metallverdrahtung einer Halbleitereinrichtung A method of forming a metal wiring of a semiconductor device |
| 03/02/2006 | DE112004000163T5 Elektrochemisches Verdrängungsablagerungsverfahren zur Herstellung von Metallverbundpulvern Electrochemical displacement deposition method for producing composite metal powders |
| 03/02/2006 | DE10339559B4 Verfahren zur Lagebestimmung von Bauelementträgern Method for position determination of component carriers |
| 03/02/2006 | DE10310536B4 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 03/02/2006 | DE102005040217A1 Halbleiterchip-Herstellungsverfahren, Halbleiterchip, Halbleiterbauteil-Herstellungsverfahren und Halbleiterbauteil A semiconductor chip manufacturing method, the semiconductor chip, semiconductor device manufacturing method and semiconductor device |
| 03/02/2006 | DE102005028902A1 Heat exchanger for cooling heat source e.g. integrated circuit, has interface layer, and manifold layer with first set of individualized fluid paths positioned to minimize pressure drop within heat exchanger |
| 03/02/2006 | DE102004061853A1 Combined support structure and manufacturing jig panel for integrated circuit with chip, jig panel and supporting circuit board |
| 03/02/2006 | DE102004054062B3 Soldering system for heavy-duty semiconductor circuit uses spray of solder droplets in stream of hot gas to build up deposit of solder on area to be soldered |
| 03/02/2006 | DE102004042154A1 Radiator assembly has lateral sides of radiator having curved joint portion corresponding to bent portions of heat guiding tubes so that radiator and heat guiding tubes are joined without clearance |
| 03/02/2006 | DE102004042145A1 Chipmodul Chip module |
| 03/02/2006 | DE102004042104A1 Verbindungselement eines Halbleiterbauteils und Halbleiterbauteil mit mehreren derartigen Verbindungselementen, sowie Verfahren zu deren Herstellung Connecting element of a semiconductor device and semiconductor device comprising a plurality of such connecting elements, as well as processes for their preparation |
| 03/02/2006 | DE102004041911A1 Fan module for heat dissipating device, has tubular air guiding unit mounted on connecting seat, comprising air passage that is in fluid contact with through-hole of connecting seat |
| 03/02/2006 | DE102004041904A1 Leistungstransistor Power transistor |
| 03/02/2006 | DE102004041889A1 Halbleitervorrichtung mit gestapelten Halbleiterbauelementen A semiconductor device with stacked semiconductor devices |
| 03/02/2006 | DE102004041888A1 Halbleitervorrichtung mit gestapelten Halbleiterbauelementen A semiconductor device with stacked semiconductor devices |
| 03/02/2006 | DE102004041417A1 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate |
| 03/02/2006 | DE102004041198A1 Lateral semiconductor component to act as a field-effect transistor has a semiconductor body with first and second sides forming front and rear sides respectively |
| 03/02/2006 | DE102004040973A1 Integrierte Schaltkreis-Anordnung und Schaltkreis-Array Integrated circuit arrangement and circuit array |
| 03/02/2006 | DE102004040513A1 Power semiconductor module with several coupling pins of such shape that they protrude through corresponding circuit board |
| 03/02/2006 | DE102004040414A1 Verdrahtungssubstrat eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte und Verfahren zur Herstellung desselben Of the same wiring substrate of a semiconductor device with external contact pads for external contacts and processes for preparing |
| 03/02/2006 | DE102004039897A1 Element mit einer Vielzahl von Leuchtdioden Member having a plurality of light emitting diodes |
| 03/02/2006 | DE102004026596A1 Active semiconductor arrangement with at least one module plane and having a raised geometry with a conductive layer to make contact with an upper plane |
| 03/02/2006 | DE102004016920B4 Verfahren zum Schalten einer Spannungsversorgung von Spannungsdomänen einer Halbleiterschaltung und entsprechende Halbleiterschaltung A method for switching a power supply voltage domains of a semiconductor circuit, and corresponding semiconductor circuit |
| 03/02/2006 | DE10155802B4 Halbleiterchip mit FIB-Schutz Semiconductor chip having FIB protection |
| 03/02/2006 | CA2577626A1 Machinable metallic composites |
| 03/01/2006 | EP1631137A1 Module component and method for manufacturing the same |
| 03/01/2006 | EP1631132A2 Aluminium/ceramic bonding substrate |
| 03/01/2006 | EP1631130A2 Transmission circuit board |
| 03/01/2006 | EP1630866A1 Packaging method for integrated circuits |
| 03/01/2006 | EP1630865A1 Adhesion of a Chip on a leadframe |
| 03/01/2006 | EP1630864A2 Substrate with many via contact means disposed therein |
| 03/01/2006 | EP1630128A1 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body |
| 03/01/2006 | EP1629534A2 Selective reference plane bridge(s) on folded package |
| 03/01/2006 | EP1629533A2 Semiconductor device and method of fabricating the same |
| 03/01/2006 | EP1629532A2 Integrated heat spreader lid |
| 03/01/2006 | EP1629530A1 Electronic component as well as semiconductor wafer and component support for the production of said component |
| 03/01/2006 | EP1629062A2 Foamable underfill encapsulant |
| 03/01/2006 | EP1156705B1 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| 03/01/2006 | EP1048060B1 Method of forming a semiconductor body having a surface provided with a coil having a magnetic core |
| 03/01/2006 | EP0848423B1 Resin-encapsulated semiconductor device and method of manufacturing the same |
| 03/01/2006 | CN2762514Y Bent radiating plate cooling structure |
| 03/01/2006 | CN2762506Y Punching structure of cooling fin |
| 03/01/2006 | CN2762357Y LED device and LED cooling device |
| 03/01/2006 | CN2762350Y Combined fin |
| 03/01/2006 | CN2762349Y Heat sink |
| 03/01/2006 | CN2762348Y Heat sink |
| 03/01/2006 | CN2762347Y Temp. equalization plate |
| 03/01/2006 | CN2762346Y Fastening for fixing heat sink |
| 03/01/2006 | CN2762345Y Heat sink |
| 03/01/2006 | CN2762052Y Combining structure of cooling fin and heat pipe |
| 03/01/2006 | CN1742416A Electrostatic discharge circuit and method therefor |
| 03/01/2006 | CN1742372A 集成电路组合件 IC assembly |
| 03/01/2006 | CN1742371A Area array package with non-electrically connected solder balls |
| 03/01/2006 | CN1742370A Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| 03/01/2006 | CN1742369A Underfill film for printed wiring assemblies |
| 03/01/2006 | CN1742364A Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
| 03/01/2006 | CN1742231A Patterning layers comprised of spin-on ceramic films |
| 03/01/2006 | CN1741292A Light-emitting diode packaging technology with temperature sensing |
| 03/01/2006 | CN1741291A Light emitting device |
| 03/01/2006 | CN1741286A Integrated ball grid array optical mouse sensor packaging |
| 03/01/2006 | CN1741274A Integrated circuit component and forming method thereof |
| 03/01/2006 | CN1741270A Stereo-stacking packaging structure |
| 03/01/2006 | CN1741269A Substrate-triggered ESD circuit by using triple-well |
| 03/01/2006 | CN1741268A 电子部件封装 Electronic component package |
| 03/01/2006 | CN1741267A Substrate with many via contact means disposed therein |
| 03/01/2006 | CN1741261A Voltage reducing packaged test socket |
| 03/01/2006 | CN1741204A Method and apparatus for providing a substrate coating having predetermined resistivity, and uses therefor |
| 03/01/2006 | CN1740230A Material for insulating substrate and products therefrom |
| 03/01/2006 | CN1244263C Socket of semiconductor package |
| 03/01/2006 | CN1244258C Circuit device and its manufacturing method |
| 03/01/2006 | CN1244152C Semiconductor device |
| 03/01/2006 | CN1244151C Semiconductor component comprising ESD protection |
| 03/01/2006 | CN1244149C Semiconductor structure with copper fuse wire and its forming process |
| 03/01/2006 | CN1244148C Electronic element and its producing method |
| 03/01/2006 | CN1244147C Socket for semiconductor package |
| 03/01/2006 | CN1244144C Method for forming low dielectric constant dielectric layer and conductive interconnector structure |
| 03/01/2006 | CN1244139C Semiconductor device and semiconductor assembly |
| 02/28/2006 | US7007265 Method for generating mask data, masks, recording media, and method for manufacturing semiconductor devices |
| 02/28/2006 | US7007260 Method for fabricating an integrated semiconductor circuit |
| 02/28/2006 | US7006360 Stack-type semiconductor package having one or more semiconductor packages stacked therein |
| 02/28/2006 | US7006354 Heat radiating structure for electronic device |
| 02/28/2006 | US7006341 Multichip module and multichip shutdown method |
| 02/28/2006 | US7006270 Optical scanning device, image forming apparatus, and optical scanning method |
| 02/28/2006 | US7006030 Semiconductor integrated circuit device and audio appliance employing it |
| 02/28/2006 | US7005755 Semiconductor device and fabrication process thereof |
| 02/28/2006 | US7005754 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly |
| 02/28/2006 | US7005753 Optimization of routing layers and board space requirements for a ball grid array land pattern |