| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/02/2006 | WO2005104188A3 Polymer dielectrics for memory element array interconnect |
| 03/02/2006 | WO2005098945A3 Top finger having a groove and semiconductor device having the same |
| 03/02/2006 | WO2005094438A3 Complete mold system |
| 03/02/2006 | WO2005045934A3 Method and device for connecting chips |
| 03/02/2006 | WO2005006437A8 Security-sensitive semiconductor product, particularly a smart-card chip |
| 03/02/2006 | WO2005004207A3 Semi-fusible link system for a multi-layer integrated circuit and method of making same |
| 03/02/2006 | US20060046479 Adhesion improvement for low k dielectrics to conductive materials |
| 03/02/2006 | US20060046462 Circuitized substrate, method of making same and information handling system using same |
| 03/02/2006 | US20060046445 Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method |
| 03/02/2006 | US20060046436 Manufacturing method of stack-type semiconductor device |
| 03/02/2006 | US20060046351 Methods for packaging image sensitive electronic devices |
| 03/02/2006 | US20060046345 Method for fabricating a silicon carbide interconnect for semiconductor components using heating and oxidizing |
| 03/02/2006 | US20060044929 Magnetic shielding for magnetic random access memory card |
| 03/02/2006 | US20060044762 Vehicular power converter |
| 03/02/2006 | US20060044749 High density memory module using stacked printed circuit boards |
| 03/02/2006 | US20060043983 Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method |
| 03/02/2006 | US20060043882 Method and apparatus for providing a substrate coating having predetermined resistivity, and uses therefor |
| 03/02/2006 | US20060043615 Methods and systems of enhancing stepper alignment signals and metrology alignment target signals |
| 03/02/2006 | US20060043614 Underfill and mold compounds including siloxane-based aromatic diamines |
| 03/02/2006 | US20060043613 Surface-mounting semiconductor device and method of making the same |
| 03/02/2006 | US20060043612 Wire sweep resistant semiconductor package and manufacturing method thereof |
| 03/02/2006 | US20060043611 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same |
| 03/02/2006 | US20060043610 Power controller with bond wire fuse |
| 03/02/2006 | US20060043609 Integrated circuit with substantially perpendicular wire bonds |
| 03/02/2006 | US20060043608 Low stress conductive polymer bump |
| 03/02/2006 | US20060043607 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufactring semiconductor device |
| 03/02/2006 | US20060043606 Semiconductor device having laminated structure |
| 03/02/2006 | US20060043605 Semiconductor device |
| 03/02/2006 | US20060043604 High-reliable semiconductor device using hermetic sealing of electrodes |
| 03/02/2006 | US20060043603 Low temperature PB-free processing for semiconductor devices |
| 03/02/2006 | US20060043602 Flip chip ball grid array package with constraint plate |
| 03/02/2006 | US20060043601 Hermetically encapsulated component and waferscale method for the production thereof |
| 03/02/2006 | US20060043600 Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device |
| 03/02/2006 | US20060043599 Through-wafer interconnects for photoimager and memory wafers |
| 03/02/2006 | US20060043598 Methods of manufacture of a via structure comprising a plurality of conductive elements, semiconductor die, multichip module, and system including same |
| 03/02/2006 | US20060043597 Solder composition, connecting process with soldering, and connection structure with soldering |
| 03/02/2006 | US20060043596 Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
| 03/02/2006 | US20060043595 Memory device and method of production and method of use of same and semiconductor device and method of production of same |
| 03/02/2006 | US20060043594 Top layers of metal for high performance IC's |
| 03/02/2006 | US20060043593 Connecting apparatus, semiconductor chip inspecting apparatus, and method for manufacturing semiconductor device |
| 03/02/2006 | US20060043592 Substlate, electro-optical device, electronic apparatus, method of forming substlate, method of forming electro-optical device, and method of forming electronic apparatus |
| 03/02/2006 | US20060043591 Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) |
| 03/02/2006 | US20060043590 Maintaining uniform cmp hard mask thickness |
| 03/02/2006 | US20060043589 Electronic device and method for fabricating the same |
| 03/02/2006 | US20060043588 Semiconductor device including a low-k metallization layer stack for enhanced resistance against electromigration |
| 03/02/2006 | US20060043587 Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages |
| 03/02/2006 | US20060043586 Board level solder joint support for BGA packages under heatsink compression |
| 03/02/2006 | US20060043585 Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
| 03/02/2006 | US20060043584 Device and method for applying semiconductor chips to carriers |
| 03/02/2006 | US20060043583 Semiconductor device |
| 03/02/2006 | US20060043582 Method for heat dissipation on semiconductor device |
| 03/02/2006 | US20060043581 IC package with power and singal lines on opposing sides |
| 03/02/2006 | US20060043580 Bandpass filter within a multilayerd low temperature co-fired ceramic substrate |
| 03/02/2006 | US20060043579 Transistor performance enhancement using engineered strains |
| 03/02/2006 | US20060043578 Semiconductor device having heat sink |
| 03/02/2006 | US20060043577 Structure and process of semiconductor package with an exposed heatsink |
| 03/02/2006 | US20060043576 Structures and methods for heat dissipation of semiconductor integrated circuits |
| 03/02/2006 | US20060043575 Chip module |
| 03/02/2006 | US20060043574 Aluminum/ceramic bonding substrate |
| 03/02/2006 | US20060043573 Semiconductor and method for producing a semiconductor |
| 03/02/2006 | US20060043571 Multilayer silicon over insulator device |
| 03/02/2006 | US20060043570 Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating method |
| 03/02/2006 | US20060043569 Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
| 03/02/2006 | US20060043568 Semiconductor device having multilayer printed wiring board and manufacturing method of the same |
| 03/02/2006 | US20060043567 Substrate having a functionally gradient coefficient of thermal expansion |
| 03/02/2006 | US20060043566 Electronic component package |
| 03/02/2006 | US20060043565 Laser removal of plating tails for high speed packages |
| 03/02/2006 | US20060043564 Air pocket resistant semiconductor package |
| 03/02/2006 | US20060043563 Stacked microelectronic layer and module with three-axis channel T-connects |
| 03/02/2006 | US20060043562 Circuit device and manufacture method for circuit device |
| 03/02/2006 | US20060043561 Semiconductor apparatus having stacked semiconductor components |
| 03/02/2006 | US20060043560 Multichip module package and fabrication method |
| 03/02/2006 | US20060043559 Stacked die packaging and fabrication method |
| 03/02/2006 | US20060043558 Stacked integrated circuit cascade signaling system and method |
| 03/02/2006 | US20060043557 Apparatus for improved power distribution in wirebond semiconductor packages |
| 03/02/2006 | US20060043556 Stacked packaging methods and structures |
| 03/02/2006 | US20060043555 Sensor package |
| 03/02/2006 | US20060043554 Method of making a semiconductor device adapted to remove noise from a signal |
| 03/02/2006 | US20060043553 Chip package having a heat spreader and method for packaging the same |
| 03/02/2006 | US20060043552 Semiconductor device and process for manufacturing the same |
| 03/02/2006 | US20060043551 Electronic control device |
| 03/02/2006 | US20060043550 Hermetic semiconductor package |
| 03/02/2006 | US20060043549 Micro-electronic package structure and method for fabricating the same |
| 03/02/2006 | US20060043548 Semiconductor device having stiffener |
| 03/02/2006 | US20060043547 Circuit board and method for producing a circuit board |
| 03/02/2006 | US20060043546 Optoelectronic component and housing |
| 03/02/2006 | US20060043545 SMT three phase inverter package and lead frame |
| 03/02/2006 | US20060043544 Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| 03/02/2006 | US20060043543 Solder composition, connecting process with soldering, and connection structure with soldering |
| 03/02/2006 | US20060043542 Floating lead finger on a lead frame, method of making, and lead frame strip and lead frame assembly including same |
| 03/02/2006 | US20060043540 Silicon package for piezoelectric device |
| 03/02/2006 | US20060043539 Electronic component comprising a multilayer wiring frame and method for producing the same |
| 03/02/2006 | US20060043538 Bump structure of an opto-electronic chip |
| 03/02/2006 | US20060043537 Routing differential signal lines in a substrate |
| 03/02/2006 | US20060043536 Implanted photoresist to reduce etch erosion during the formation of a semiconductor device |
| 03/02/2006 | US20060043535 Pass through via technology for use during the manufacture of a semiconductor device |
| 03/02/2006 | US20060043514 Semiconductor device with simplified constitution |
| 03/02/2006 | US20060043491 Electrostatic discharge protection device and method for its manufacture |
| 03/02/2006 | US20060043490 Electrostatic discharge (ESD) detection and protection |
| 03/02/2006 | US20060043489 Diode and applications thereof |