| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/08/2006 | CN1244959C Apparatus and method for passive phase change thermal management, circuit assembly cooling method and wireless communication system |
| 03/08/2006 | CN1244954C Method for producing thin film semiconductor and method for forming resist pattern thereof |
| 03/08/2006 | CN1244489C Method for manufacturing a housing for a chip having a micromechanical structure |
| 03/07/2006 | US7010766 Parallel design processes for integrated circuits |
| 03/07/2006 | US7009874 Low remanence flux concentrator for MRAM devices |
| 03/07/2006 | US7009870 Semiconductor integrated circuit apparatus |
| 03/07/2006 | US7009844 Wire form heat sink retention module |
| 03/07/2006 | US7009843 Heat sink clip with pressing post |
| 03/07/2006 | US7009842 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules |
| 03/07/2006 | US7009826 ESD protection designs with parallel LC tank for giga-hertz RF integrated circuits |
| 03/07/2006 | US7009820 Disk drive comprising depletion mode MOSFETs for protecting a head from electrostatic discharge |
| 03/07/2006 | US7009309 Semiconductor package device that includes an insulative housing with a protruding peripheral portion |
| 03/07/2006 | US7009308 Methods and apparatus for improving high frequency input/output performance |
| 03/07/2006 | US7009307 Low stress and warpage laminate flip chip BGA package |
| 03/07/2006 | US7009306 Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument |
| 03/07/2006 | US7009305 Methods and apparatus for integrated circuit ball bonding using stacked ball bumps |
| 03/07/2006 | US7009304 Resin-sealed semiconductor device |
| 03/07/2006 | US7009303 Multi-chip module |
| 03/07/2006 | US7009302 Micromachine package and method for manufacturing the same |
| 03/07/2006 | US7009301 Semiconductor package with a heat spreader |
| 03/07/2006 | US7009300 Low profile stacked multi-chip package and method of forming same |
| 03/07/2006 | US7009299 Kinetically controlled solder |
| 03/07/2006 | US7009297 Semiconductor chip assembly with embedded metal particle |
| 03/07/2006 | US7009296 Semiconductor package with substrate coupled to a peripheral side surface of a semiconductor die |
| 03/07/2006 | US7009295 Semiconductor device |
| 03/07/2006 | US7009294 Production process for semiconductor device |
| 03/07/2006 | US7009293 Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument |
| 03/07/2006 | US7009292 Package type semiconductor device |
| 03/07/2006 | US7009291 Semiconductor module and semiconductor device |
| 03/07/2006 | US7009290 Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method |
| 03/07/2006 | US7009289 Fluxless die-to-heat spreader bonding using thermal interface material |
| 03/07/2006 | US7009288 Semiconductor component with electromagnetic shielding device |
| 03/07/2006 | US7009287 Chip on photosensitive device package structure and electrical connection thereof |
| 03/07/2006 | US7009286 Thin leadless plastic chip carrier |
| 03/07/2006 | US7009285 Optoelectronic semiconductor component |
| 03/07/2006 | US7009284 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
| 03/07/2006 | US7009283 Nonexposed heat sink for semiconductor package |
| 03/07/2006 | US7009282 Packaged integrated circuit providing trace access to high-speed leads |
| 03/07/2006 | US7009281 Small volume process chamber with hot inner surfaces |
| 03/07/2006 | US7009280 Low-k interlevel dielectric layer (ILD) |
| 03/07/2006 | US7009277 Semiconductor device with improved radiation property |
| 03/07/2006 | US7009275 Method for making high density nonvolatile memory |
| 03/07/2006 | US7009274 Fuse box semiconductor device |
| 03/07/2006 | US7009272 PECVD air gap integration |
| 03/07/2006 | US7009267 Semiconductor device |
| 03/07/2006 | US7009256 Semiconductor over-voltage protection structure for integrated circuit and for diode |
| 03/07/2006 | US7009254 Electro-optical device and electronic apparatus |
| 03/07/2006 | US7009253 Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event |
| 03/07/2006 | US7009252 ESD protection devices and methods for reducing trigger voltage |
| 03/07/2006 | US7009233 Semiconductor integrated circuit device including dummy patterns located to reduce dishing |
| 03/07/2006 | US7009223 Rectification chip terminal structure |
| 03/07/2006 | US7009222 Protective metal structure and method to protect low-K dielectric layer during fuse blow process |
| 03/07/2006 | US7009116 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components |
| 03/07/2006 | US7009115 Optimization of routing layers and board space requirements for a ball grid array package |
| 03/07/2006 | US7009114 includes substrate having wiring pattern and line-shaped insulation pattern disposed on substrate so as to intersect wiring pattern and to define portion of wiring pattern for land electrode |
| 03/07/2006 | US7009008 Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities |
| 03/07/2006 | US7008873 Integrated circuit with reverse engineering protection |
| 03/07/2006 | US7008872 Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures |
| 03/07/2006 | US7008868 Passivation scheme for bumped wafers |
| 03/07/2006 | US7008867 Method for forming copper bump antioxidation surface |
| 03/07/2006 | US7008861 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 03/07/2006 | US7008849 Method for providing bitline contacts in a memory cell array and a memory cell array having bitline contacts |
| 03/07/2006 | US7008842 Process for fabricating a component, such as a capacitor in an integrated circuit, and integrated-circuit component |
| 03/07/2006 | US7008841 Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same |
| 03/07/2006 | US7008829 Alignment marks and manufacturing method for the same |
| 03/07/2006 | US7008826 Lead-frame-based semiconductor package and fabrication method thereof |
| 03/07/2006 | US7008825 Leadframe strip having enhanced testability |
| 03/07/2006 | US7008824 Method of fabricating mounted multiple semiconductor dies in a package |
| 03/07/2006 | US7008823 Die stacking scheme |
| 03/07/2006 | US7008822 Method for fabricating semiconductor component having stacked, encapsulated dice |
| 03/07/2006 | US7008821 Method of forming a wafer backside interconnecting wire |
| 03/07/2006 | US7008820 Chip scale package with open substrate |
| 03/07/2006 | US7008819 Method of fabricating an array of wafer scale polymeric caps |
| 03/07/2006 | US7008818 Flip chip packaging process employing improved probe tip design |
| 03/07/2006 | US7008817 Method for manufacturing micro electro-mechanical systems using solder balls |
| 03/07/2006 | US7008549 Circuit board, process for producing the same and a power module employing the same |
| 03/07/2006 | US7007855 Wafer identification mark |
| 03/07/2006 | US7007834 Contact bump construction for the production of a connector construction for substrate connecting surfaces |
| 03/07/2006 | US7007746 Circulative cooling apparatus |
| 03/07/2006 | US7007741 Conformal heat spreader |
| 03/07/2006 | US7007506 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
| 03/07/2006 | US7007380 TFI probe I/O wrap test method |
| 03/07/2006 | US7007375 Method for fabricating a semiconductor component |
| 03/03/2006 | CA2515714A1 Circuit module system and method |
| 03/02/2006 | WO2006023914A2 Thermal fatigue resistant tin-lead-silver solder |
| 03/02/2006 | WO2006023860A2 Thermally conductive composition and method for preparing the same |
| 03/02/2006 | WO2006023835A2 Stacked wafer scale package |
| 03/02/2006 | WO2006023255A1 Integrated low-k hard mask |
| 03/02/2006 | WO2006023034A2 Probe pad arrangement for an integrated circuit and method of forming |
| 03/02/2006 | WO2006022911A1 Integrated circuit with increased heat transfer |
| 03/02/2006 | WO2006022334A1 Method for manufacturing semiconductor device |
| 03/02/2006 | WO2006022251A1 Epoxy resin composition, novel phenol resin, novel epoxy resin, method for producing phenol resin, method for producing epoxy resin, and cured product of epoxy resin composition |
| 03/02/2006 | WO2006022152A1 Driving circuit board, method for manufacturing the same, liquid crystal display panel and liquid crystal display device |
| 03/02/2006 | WO2006021517A1 Semi-conductor switching device |
| 03/02/2006 | WO2006021512A1 Electric device comprising a housing and a cooling body |
| 03/02/2006 | WO2006021385A1 Machinable metallic composites |
| 03/02/2006 | WO2006021191A1 Planar circuit semiconductor assembly comprising a semiconductor chip |
| 03/02/2006 | WO2006006849A3 Carrier for electronic components and method for separating segments from such a carrier |
| 03/02/2006 | WO2005105894A3 SILOXANE EPOXY POLYMERS FOR LOW-κ DIELECTRIC APPLICATIONS |
| 03/02/2006 | WO2005104314A3 Method for production of electronic and optoelectronic circuits |