| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/09/2006 | US20060049515 Memory module having memory chips protected from excessive heat |
| 03/09/2006 | US20060049514 Semiconductor device with reduced contact resistance |
| 03/09/2006 | US20060049513 Thin module system and method with thermal management |
| 03/09/2006 | US20060049512 Thin module system and method with skew reduction |
| 03/09/2006 | US20060049511 Integrated semiconductor circuit and method for producing an integrated semiconductor circuit |
| 03/09/2006 | US20060049510 Semiconductor device and method of manufacturing semiconductor device |
| 03/09/2006 | US20060049509 Printed wiring board |
| 03/09/2006 | US20060049508 Semiconductor device, lead frame, and methods for manufacturing the same |
| 03/09/2006 | US20060049507 Semiconductor device and wire bonding chip size package therefor |
| 03/09/2006 | US20060049506 Capacitance type semiconductor sensor |
| 03/09/2006 | US20060049505 High density interconnect power and ground strap and method therefor |
| 03/09/2006 | US20060049504 Module assembly and method for stacked BGA packages |
| 03/09/2006 | US20060049503 Substrate-based housing component with a semiconductor chip |
| 03/09/2006 | US20060049502 Module thermal management system and method |
| 03/09/2006 | US20060049501 Package having dummy package substrate and method of fabricating the same |
| 03/09/2006 | US20060049500 Thin module system and method |
| 03/09/2006 | US20060049499 Semiconductor device and its manufacturing method |
| 03/09/2006 | US20060049498 Methods of making microelectronic assemblies including compliant interfaces |
| 03/09/2006 | US20060049497 Physical quantity sensor |
| 03/09/2006 | US20060049496 System and method for providing scalability in an integrated circuit |
| 03/09/2006 | US20060049495 Semiconductor package and laminated semiconductor package |
| 03/09/2006 | US20060049494 Semiconductor device |
| 03/09/2006 | US20060049493 Lead frame and method of manufacturing the same |
| 03/09/2006 | US20060049492 Reduced foot print lead-less package with tolerance for thermal and mechanical stresses and method thereof |
| 03/09/2006 | US20060049490 Displaying apparatus |
| 03/09/2006 | US20060049489 Surface acoustic wave device and manufacturing method of the same |
| 03/09/2006 | US20060049486 Method of self-assembling electronic circuitry and circuits formed thereby |
| 03/09/2006 | US20060049482 System and method for providing a low frequency filter pole |
| 03/09/2006 | US20060049481 Planar inductive component and an integrated circuit comprising a planar inductive component |
| 03/09/2006 | US20060049468 Interconnection architecture and method of assessing interconnection architecture |
| 03/09/2006 | US20060049463 High voltage operating electrostatic discharge protection device |
| 03/09/2006 | US20060049462 High voltage transistor and method for fabricating the same |
| 03/09/2006 | US20060049446 Method for manufacturing a semiconductor device |
| 03/09/2006 | US20060049413 Array substrate with reduced pixel defect, method of manufacturing the same and liquid crystal display panel having the same |
| 03/09/2006 | US20060049400 Semiconductor device |
| 03/09/2006 | US20060048918 Cooling device for heat source |
| 03/09/2006 | US20060048889 Method for connecting a chip and a substrate |
| 03/09/2006 | DE19723431B4 Mit einer ESD-Schutzschaltung versehenes Halbleiterbauelement With an ESD protection circuit provided semiconductor component |
| 03/09/2006 | DE10393629T5 Verfahren und Vorrichtung für eine effiziente vertikale Fluidzufuhr zum Kühlen einer Wärme erzeugenden Vorrichtung Method and apparatus for efficient vertical fluid supply for cooling a heat-generating device |
| 03/09/2006 | DE102005041577A1 Sensor für eine physikalische Grösse Sensor for a physical quantity |
| 03/09/2006 | DE102005040213A1 Manufacturing semiconductor device involves depositing photosensitive layer to cover exposed portion of electrode, and subjecting photosensitive layer to photolithography to partially remove photosensitive layer |
| 03/09/2006 | DE102004042755A1 Optical sensor unit, comprises a housing, a frame, an optical sensor chip, wire connections for the chips, and a pacifying agent |
| 03/09/2006 | DE102004042367A1 Leistungshalbleitermodul The power semiconductor module |
| 03/09/2006 | DE102004042348A1 Electrostatic discharge semiconductor element has bipolar transistor embedded in semiconductor body with wiring region and a resistance between emitter and base zones |
| 03/09/2006 | DE102004041088A1 Halbleiterbauteil in Flachleitertechnik mit einem Halbleiterchip Semiconductor device in flat wire technology with a semiconductor chip |
| 03/09/2006 | DE102004030354B3 Method of manufacturing an integrated semiconductor circuit with a conductor structure embedded in the substrate in which the concentrations of dopant in overlapping regions are greatly varied by diffusion |
| 03/09/2006 | DE10024516B4 Leistungshalbleitermodul The power semiconductor module |
| 03/08/2006 | EP1633179A2 Electromagnetic wave shielding structure |
| 03/08/2006 | EP1633025A2 Cap for semiconductor device |
| 03/08/2006 | EP1633002A2 Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| 03/08/2006 | EP1632999A1 Battery-mounted integrated circuit device |
| 03/08/2006 | EP1632998A1 High power electronic package with enhanced cooling characteristics |
| 03/08/2006 | EP1632797A1 Three dimensional structure and method of manufacturing the same |
| 03/08/2006 | EP1632118A1 Apparatus and method for a cooling solution fastening assembly |
| 03/08/2006 | EP1631987A2 Semiconductor device, method of authentifying and system |
| 03/08/2006 | EP1631985A1 Method of manufacturing a substrate, having a porous dielectric layer and air gaps, and a substrate |
| 03/08/2006 | EP1540736A4 Wafer-level seal for non-silicon-based devices |
| 03/08/2006 | EP1472915B1 Circuit carrier and production thereof |
| 03/08/2006 | EP1428260B1 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 03/08/2006 | EP1342294A4 I-channel surface-mount connector |
| 03/08/2006 | EP1305829A4 Solder bar for high power flip chips |
| 03/08/2006 | EP1167559B1 Composite material and use thereof |
| 03/08/2006 | EP0608335B1 Structure for suppression of field inversion caused by charge build-up in the dielectric |
| 03/08/2006 | CN2764053Y Oil-imersion water-cooling type soft starting box for motor of submerged pump |
| 03/08/2006 | CN2763979Y Multi-row matrix type lead frame for IC |
| 03/08/2006 | CN2763978Y Welding wire-leading frame for IC |
| 03/08/2006 | CN2763977Y Chip package |
| 03/08/2006 | CN2763976Y Heat radiator |
| 03/08/2006 | CN2763975Y Heat-pipe radiator |
| 03/08/2006 | CN2763974Y Radiator |
| 03/08/2006 | CN2763973Y 散热器 Heat sink |
| 03/08/2006 | CN2763972Y Radiation device assembly |
| 03/08/2006 | CN2763971Y Radiation fins assembling structure |
| 03/08/2006 | CN2763970Y 散热器 Heat sink |
| 03/08/2006 | CN2763899Y Glass substrate |
| 03/08/2006 | CN2763887Y Liquid cooling heat sink |
| 03/08/2006 | CN2763756Y Semiconductor refrigerator |
| 03/08/2006 | CN1745480A Array board liquid crystal display and method for producing array board |
| 03/08/2006 | CN1745477A Electrostatic discharge protection circuits capable of testing |
| 03/08/2006 | CN1745476A Interconnect structures incorporating low-k dielectric barrier films |
| 03/08/2006 | CN1745475A Method, system and apparatus for cooling high power density devices |
| 03/08/2006 | CN1745469A Method for fabrication of semiconductor device |
| 03/08/2006 | CN1745459A 半导体装置 Semiconductor device |
| 03/08/2006 | CN1745120A Composition and method to achieve reduced thermal expansion in polyarylene networks |
| 03/08/2006 | CN1744806A Top-blown heat pipe radiator and its manufacturing method |
| 03/08/2006 | CN1744315A Method for manufacturing semiconductor device and semiconductor device |
| 03/08/2006 | CN1744313A Semiconductor apparatus having stacked semiconductor components |
| 03/08/2006 | CN1744312A Semiconductor apparatus having stacked semiconductor components |
| 03/08/2006 | CN1744310A Electrostatic discharge conduction device and mixed power integrated circuits using same |
| 03/08/2006 | CN1744309A Semiconductor device and wire bonding chip size package therefor |
| 03/08/2006 | CN1744308A Flip chip semiconductor device and manufacturing method thereof |
| 03/08/2006 | CN1744307A Radiating module and fluid moving structure thereof |
| 03/08/2006 | CN1744306A Semiconductor device and process for manufacturing the same |
| 03/08/2006 | CN1744305A Semiconductor device with improved radiating |
| 03/08/2006 | CN1744304A High-reliable semiconductor device using hermetic sealing of electrodes |
| 03/08/2006 | CN1744303A Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device |
| 03/08/2006 | CN1744302A Semiconductor device, semiconductor module, and manufacturing method of semiconductor device |
| 03/08/2006 | CN1744301A Sapphire substrate, epitaxial substrate and semiconductor device |
| 03/08/2006 | CN1744299A Memory cell with an asymmetrical area |
| 03/08/2006 | CN1744286A Semiconductor manufacturing method and its structure |