| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/14/2006 | US7012336 Semiconductor device with a fluorinated silicate glass film as an interlayer metal dielectric film, and manufacturing method thereof |
| 03/14/2006 | US7012335 Semiconductor device wiring and method of manufacturing the same |
| 03/14/2006 | US7012334 Semiconductor chip with bumps and method for manufacturing the same |
| 03/14/2006 | US7012333 Lead free bump and method of forming the same |
| 03/14/2006 | US7012332 Semiconductor device having sealing structure for wide gap type semiconductor chip |
| 03/14/2006 | US7012331 Device for mounting a semiconductor package on a support plate via a base |
| 03/14/2006 | US7012330 Integrated circuit device having I/O structures with reduced input loss |
| 03/14/2006 | US7012328 Semiconductor die attachment for high vacuum tubes |
| 03/14/2006 | US7012326 Lid and method of employing a lid on an integrated circuit |
| 03/14/2006 | US7012325 Ultra-thin semiconductor package device and method for manufacturing the same |
| 03/14/2006 | US7012324 Lead frame with flag support structure |
| 03/14/2006 | US7012323 Microelectronic assemblies incorporating inductors |
| 03/14/2006 | US7012322 Method for reducing harmonic distortion in comb drive devices |
| 03/14/2006 | US7012321 Stacked semiconductor device including improved lead frame arrangement |
| 03/14/2006 | US7012320 Semiconductor device and process for fabrication thereof |
| 03/14/2006 | US7012315 Frame scale package using contact lines through the elements |
| 03/14/2006 | US7012312 Semiconductor device with multilayer conductive structure formed on a semiconductor substrate |
| 03/14/2006 | US7012308 Diode |
| 03/14/2006 | US7012307 Output buffer with good ESD protection |
| 03/14/2006 | US7012306 Electrochemical device |
| 03/14/2006 | US7012305 Electro-static discharge protection circuit for dual-polarity input/output pad |
| 03/14/2006 | US7012304 Diode and transistor design for high speed I/O |
| 03/14/2006 | US7012289 Memory cell having a thin insulation collar and memory module |
| 03/14/2006 | US7012282 Bumped integrated circuits for optical applications |
| 03/14/2006 | US7012243 Photo-sensor and method for manufacturing the photo-sensor |
| 03/14/2006 | US7012192 Feedthrough terminal assembly with lead wire bonding pad for human implant applications |
| 03/14/2006 | US7012031 Photoresist pattern, method of fabricating the same, and method of assuring the quality thereof |
| 03/14/2006 | US7012030 Very low dielectric constant plasma-enhanced CVD films |
| 03/14/2006 | US7012029 Method of forming a lamination film pattern and improved lamination film pattern |
| 03/14/2006 | US7012023 Semiconductor device and method of manufacturing the same |
| 03/14/2006 | US7012022 Self-patterning of photo-active dielectric materials for interconnect isolation |
| 03/14/2006 | US7012020 Multi-layered metal routing technique |
| 03/14/2006 | US7012019 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| 03/14/2006 | US7012018 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices |
| 03/14/2006 | US7012017 Partially etched dielectric film with conductive features |
| 03/14/2006 | US7012015 Wafer-level thick film standing-wave clocking |
| 03/14/2006 | US7012011 Wafer-level diamond spreader |
| 03/14/2006 | US7011994 Method of forming wiring and method of manufacturing image display system by using the same |
| 03/14/2006 | US7011989 Method for producing encapsulated chips |
| 03/14/2006 | US7011988 Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing |
| 03/14/2006 | US7011985 Method for producing miniature amplifier and signal processing unit |
| 03/14/2006 | US7011862 Method for producing wiring substrate |
| 03/14/2006 | US7011804 Effecting combustion by igniting a structure filled with aluminum powder, a diluent and metal nitride positioned in an evacuated chamber having recirculating nitrogen gas throughout and a coolant circulating between the inner and outer walls |
| 03/14/2006 | US7011725 High performance embedded RF filters |
| 03/14/2006 | US7011146 Microchannel heat pipe with parallel grooves for recycling coolant |
| 03/14/2006 | US7010930 Method and system for cooling high power density devices |
| 03/14/2006 | US7010854 Re-assembly process for MEMS structures |
| 03/09/2006 | WO2006026372A1 Package having integral lens and wafer-scale fabrication method therefor |
| 03/09/2006 | WO2006025852A2 Cooling of high power density devices using electrically conducting fluids |
| 03/09/2006 | WO2006025501A1 Method for manufacturing semiconductor device and semiconductor device manufactured by such method |
| 03/09/2006 | WO2006025500A1 Method for manufacturing semiconductor device and semiconductor device manufactured by such method |
| 03/09/2006 | WO2006025429A1 Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin |
| 03/09/2006 | WO2006025347A1 Copper alloy and liquid-crystal display |
| 03/09/2006 | WO2006024989A1 Chip comprising at least one test contact configuration |
| 03/09/2006 | WO2006024261A2 Connection element for a semiconductor component, a semiconductor component with several connection elements and method for the production thereof |
| 03/09/2006 | WO2006010903A3 Multiple chip semiconductor device |
| 03/09/2006 | WO2005119765A3 Assembly including vertical and horizontal joined circuit panels |
| 03/09/2006 | WO2005117107A3 Power semiconductor module and method for cooling a power semiconductor module |
| 03/09/2006 | WO2005112583A3 Integrated ball and via package and formation process |
| 03/09/2006 | WO2005112576A3 Method of bumping die pads for wafer testing |
| 03/09/2006 | WO2005096375A3 Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips |
| 03/09/2006 | WO2005083803A3 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 03/09/2006 | WO2005081309A3 Cooling system for devices comprising power semi-conductors and method for cooling said type of device |
| 03/09/2006 | WO2005069378A3 Power semiconductor device and method therefor |
| 03/09/2006 | WO2005020288A3 Multiple cavity/compartment package |
| 03/09/2006 | US20060053402 Pattern data correcting method, photo mask manufacturing method, semiconductor device manufacturing method, program and semiconductor device |
| 03/09/2006 | US20060052566 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
| 03/09/2006 | US20060051966 In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber |
| 03/09/2006 | US20060051955 Top layers of metal for high performance IC's |
| 03/09/2006 | US20060051953 Module assembly and method for stacked BGA packages |
| 03/09/2006 | US20060051949 Semiconductor device manufacturing method and electronic equipment using same |
| 03/09/2006 | US20060051936 Mask and production method therefor and production for semiconductor device |
| 03/09/2006 | US20060051897 Technique for attaching die to leads |
| 03/09/2006 | US20060051895 Method for manufacturing electronic component-mounted board |
| 03/09/2006 | US20060051894 Method for bonding flip chip on leadframe |
| 03/09/2006 | US20060051892 Methods for packaging image sensitive electronic devices |
| 03/09/2006 | US20060051891 Methods for packaging image sensitive electronic devices |
| 03/09/2006 | US20060051890 Methods for packaging image sensitive electronic devices |
| 03/09/2006 | US20060051610 A bright tin or bright lead-free tin-alloy having no whiskers after 4 months storage at 52 degrees C. and 98% relative humidity; preferred alloying elements are nickel, copper, bismuth, zinc, silver or indium; prepared from a solution of acidic electrolytes and carboxylated polyalkyleneimines |
| 03/09/2006 | US20060051584 Process for producing a product having a structured surface |
| 03/09/2006 | US20060050599 Memory device and method for burn-in test |
| 03/09/2006 | US20060050484 Using the wave soldering process to attach motherboard chipset heat sinks |
| 03/09/2006 | US20060049885 MEMS-based, computer systems, clock generation and oscillator circuits and LC-tank apparatus for use therein |
| 03/09/2006 | US20060049532 Chip module |
| 03/09/2006 | US20060049531 Semiconductor package having a partial slot cover for encapsulation process |
| 03/09/2006 | US20060049530 Method of embedding semiconductor chip in support plate and embedded structure thereof |
| 03/09/2006 | US20060049529 Flip chip metal bonding to plastic leadframe |
| 03/09/2006 | US20060049528 Semiconductor chip stack structure and method for forming the same |
| 03/09/2006 | US20060049527 Electronic device and method of manufacturing the same |
| 03/09/2006 | US20060049526 Processing methods of forming an electrically conductive plug to a node location |
| 03/09/2006 | US20060049525 Post passivation interconnection process and structures |
| 03/09/2006 | US20060049524 Post passivation interconnection process and structures |
| 03/09/2006 | US20060049523 Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby |
| 03/09/2006 | US20060049522 Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 03/09/2006 | US20060049521 Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 03/09/2006 | US20060049520 Semiconductor device mounting structure for reducing thermal stress and warpage |
| 03/09/2006 | US20060049519 Semiconductor device and method for manufacturing semiconductor device |
| 03/09/2006 | US20060049518 Semiconductor device and method for manufacturing the same |
| 03/09/2006 | US20060049517 Flip chip semiconductor device and manufacturing method thereof |
| 03/09/2006 | US20060049516 Nickel/gold pad structure of semiconductor package and fabrication method thereof |