| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/16/2006 | DE19541039B4 Chip-Modul sowie Verfahren zu dessen Herstellung -Chip module and method of producing the |
| 03/16/2006 | DE10394220T5 Modifizierte Cycloolefin-Copolymere, Verfahren zu deren Herstellung und Verwendungen dieser Polymere Modified cycloolefin copolymers, processes for their production and uses of these polymers |
| 03/16/2006 | DE10297818T5 Anbringen von Flipchips an Substraten Attaching flip chips to substrates |
| 03/16/2006 | DE102005043907A1 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 03/16/2006 | DE102005043013A1 Sensoranordnung mit einem Stopper zur Begrenzung einer Verschiebung Sensor array with a stopper to limit movement |
| 03/16/2006 | DE102005041051A1 Fahrzeugleistungswandler Car power converter |
| 03/16/2006 | DE102005036264A1 Mikrovorrichtung mit einer Mikrosystemstruktur und Verfahren zur Herstellung derselben Micro device having a micro-structure system and method for producing same |
| 03/16/2006 | DE102005035083A1 Semiconductor device package connecting system, has two sets of bonding regions positioned along two guide lines and correspond to two sets of adjacent bonding pads at central region of die, respectively |
| 03/16/2006 | DE102005034386A1 Tiefe Justiermarken auf Rand-Chips zum anschließenden Ausrichten von opaken Schichten Depth marks on edge chips for subsequent alignment of opaque layers |
| 03/16/2006 | DE102005034182A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 03/16/2006 | DE102005031262A1 Kühlkörpervorrichtung Heat sink device |
| 03/16/2006 | DE102004044686A1 Integrierte Schaltungsanordnung mit Vias, die zwei Abschnitte haben, und Herstellungsverfahren An integrated circuit device with vias, which have two portions, and manufacturing processes |
| 03/16/2006 | DE102004042488A1 Elektrische Baugruppe Electrical assembly |
| 03/16/2006 | DE102004042168A1 Halbleiterelement mit einem Metallisierungsschichtstapel mit kleinem ε mit erhöhter Widerstandsfähigkeit gegen Elektromigration Semiconductor element with a metallization layer with small ε with increased resistance to electromigration |
| 03/16/2006 | DE102004041598A1 Semiconductor arrangement`s bending reducing method, involves desorbing vaporizable substances present in wiring carrier by temperature treatment before encasing and/or mounting of chips on carrier |
| 03/16/2006 | DE102004039803A1 Production of conductor systems with high capacitive coupling comprises forming dielectric on substrate, forming trench structure and applying conductive layer and forming capacitor dielectric to produce conductor zone and capacitor zone |
| 03/16/2006 | DE102004039620A1 Integrierte Schaltung, die eine vorgegebene Spannungsfestigkeit besitzt Integrated circuit having a predetermined dielectric strength |
| 03/16/2006 | DE102004038094A1 Electrical component on a substrate, e.g. a microelectronic interdigital converter for a surface acoustic wave filter, has a dielectric in the smallest gap between component structures |
| 03/16/2006 | DE102004037817A1 Elektrisches Bauelement in Flip-Chip-Bauweise The electrical component in flip-chip-type |
| 03/16/2006 | DE102004037656A1 Bauteilanordnung mit optimierter Montagefähigkeit Component assembly with improved mounting capability |
| 03/16/2006 | DE102004037610B3 Integrated circuit connection method e.g. for substrate and circuit assembly, involves planning flexible intermediate layer on integrated circuit and or substrate with flexible layer structured in raised and lower ranges |
| 03/16/2006 | DE102004037461A1 Electronic component e.g. dynamic RAM, has Peltier component with two structural units having different Peltier coefficients, where region between units provided along semiconductor module periphery is cooled as current flows between units |
| 03/16/2006 | DE102004034821A1 Halbleiter und Verfahren zu dessen Herstellung Semiconductor and process for its preparation |
| 03/16/2006 | DE102004029765A1 Substratbasiertes Die-Package mit BGA- oder BGA-ähnlichen Komponenten The substrate-based package with BGA or BGA-like components |
| 03/16/2006 | CA2579062A1 Capacitor layer-forming material and printed circuit board having internal capacitor circuit obtained by using capacitor layer-forming material |
| 03/15/2006 | EP1635460A1 Piezoelectric device |
| 03/15/2006 | EP1635398A2 Semiconductor devices having an interfacial dielectric layer and related methods |
| 03/15/2006 | EP1635391A2 Wireless chip and manufacturing method of the same |
| 03/15/2006 | EP1635387A1 Electronic device with a chip on a pedestal and method of manufacturing the same |
| 03/15/2006 | EP1635317A1 Plasma display apparatus including electrode pads |
| 03/15/2006 | EP1634331A1 Electronic device, information processor, and electromagnetic radiation suppressing member |
| 03/15/2006 | EP1634330A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 03/15/2006 | EP1634329A1 Cooling apparatus of electric device |
| 03/15/2006 | EP1634328A2 Microelectromechanical systems, and methods for encapsulating and fabricating same |
| 03/15/2006 | EP1634326A2 Method for producing a ceramic/metal substrate |
| 03/15/2006 | EP1634039A1 Octagonal pedestal for stabilizing filling |
| 03/15/2006 | EP1633830A2 Silicon composition which can be crosslinked into an adhesive gel |
| 03/15/2006 | EP1456859B1 Inductive component |
| 03/15/2006 | EP0929592B1 Thermosetting resin compositions useful as underfill sealants |
| 03/15/2006 | CN2765440Y Plate type air heat pipe radiator |
| 03/15/2006 | CN2765326Y Lining dielectric layer of semiconductor assembly and semiconductor assembly |
| 03/15/2006 | CN2765325Y Radiating fin assembly |
| 03/15/2006 | CN2765324Y Thermoelectric cooling device with remote pre-radiation function |
| 03/15/2006 | CN2765323Y Packaging assembly with all ducting holes formed below the bottom sealing layer |
| 03/15/2006 | CN1748328A Peltier cooler integrated with electronic device(s) |
| 03/15/2006 | CN1748319A Uv-blocking layer for reducing uv-induced charging of sonos dual-bit flash memory devices in beol processing |
| 03/15/2006 | CN1748311A Integrated component |
| 03/15/2006 | CN1748309A Low voltage nmos-based electrostatic discharge clamp |
| 03/15/2006 | CN1748308A Semiconductor die package with reduced inductance and reduced die attach flow out |
| 03/15/2006 | CN1748307A Alternative flip chip in leaded molded package design and method for manufacture |
| 03/15/2006 | CN1748306A 半导体装置 Semiconductor device |
| 03/15/2006 | CN1748305A Method of manufacturing a slice of semiconductor |
| 03/15/2006 | CN1748304A Thin multiple semiconductor die package |
| 03/15/2006 | CN1748303A Cover glass for semiconductor package and method for producing same |
| 03/15/2006 | CN1748300A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1748299A Semiconductor device and radiation detector employing it |
| 03/15/2006 | CN1748297A Metal etching method for an interconnect structure and metal interconnect structure obtained by such method |
| 03/15/2006 | CN1748270A Protecting resin-encapsulated components |
| 03/15/2006 | CN1748011A Flexible heat sink |
| 03/15/2006 | CN1747262A Semiconductor laser device and optical pickup device having the device |
| 03/15/2006 | CN1747182A 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method thereof |
| 03/15/2006 | CN1747170A Semiconductor device |
| 03/15/2006 | CN1747168A Mould set structure with multiple package and fins |
| 03/15/2006 | CN1747167A 半导体器件 Semiconductor devices |
| 03/15/2006 | CN1747166A Semiconductor device |
| 03/15/2006 | CN1747165A Electronic device and method of manufacturing the same |
| 03/15/2006 | CN1747164A Physical quantity sensor, lead frame, and manufacturing method therefor |
| 03/15/2006 | CN1747163A Semiconductor device, lead frame, and methods for manufacturing the same |
| 03/15/2006 | CN1747162A Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 03/15/2006 | CN1747161A Semiconductor device and method of manufacturing semiconductor device |
| 03/15/2006 | CN1747160A Bottom substrate structure of welding pad and its welding pad structure |
| 03/15/2006 | CN1747159A Hot pipe and production thereof |
| 03/15/2006 | CN1747158A Semiconductor device |
| 03/15/2006 | CN1747157A Crystal-coated packing substrate plate with high-density wiring |
| 03/15/2006 | CN1747156A Ball-grid array packed substrate plate and its structure thereof |
| 03/15/2006 | CN1747155A Substrate plated with enhanced welding pad structure |
| 03/15/2006 | CN1747154A Wafer supporting device, thin wafer holding method and manufacture of semiconductor device |
| 03/15/2006 | CN1747153A Substrate plate structure with tin-ball fixed welding pad and combination structure therewith |
| 03/15/2006 | CN1747141A Production of precision unit structure for chip wire rack |
| 03/15/2006 | CN1747099A Semiconductor device |
| 03/15/2006 | CN1746511A Fan |
| 03/15/2006 | CN1245854C Panel and its making method and installation method for electronic circuit component |
| 03/15/2006 | CN1245758C Electrostatic discharge protection circuit |
| 03/15/2006 | CN1245757C Card-type storage device |
| 03/15/2006 | CN1245756C Base for producing semiconductor device by using three element alloy |
| 03/15/2006 | CN1245755C Film substrate, semiconductor device, circuit substrate and manufacture method thereof |
| 03/15/2006 | CN1245751C Method for producing semiconductor device and semiconductor device thereby |
| 03/15/2006 | CN1245744C Manufacturing method for semiconductor device and semiconductor thereof |
| 03/15/2006 | CN1245743C Coating treatment method and method for manufacturing semiconductor device using the same |
| 03/15/2006 | CN1245431C Epoxy resin and resin sealed semiconductor device |
| 03/15/2006 | CN1245272C Wire welding tech. for copper metallized integrated circuit |
| 03/14/2006 | US7013446 Method, program, and apparatus for designing a semiconductor device |
| 03/14/2006 | US7013437 High data rate differential signal line design for uniform characteristic impedance for high performance integrated circuit packages |
| 03/14/2006 | US7013123 Wireless communication system |
| 03/14/2006 | US7012810 Leadframe-based module DC bus design to reduce module inductance |
| 03/14/2006 | US7012490 High frequency signal transmission structure |
| 03/14/2006 | US7012439 Multiple directional scans of test structures on semiconductor integrated circuits |
| 03/14/2006 | US7012339 Semiconductor chip with passive element in a wiring region of the chip |
| 03/14/2006 | US7012338 Semiconductor device, liquid crystal display device and method of manufacturing the semiconductor device |
| 03/14/2006 | US7012337 Semiconductor device including a photosensitive resin covering at least a portion of a substrate having a via hole |