| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/16/2006 | US20060059445 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly |
| 03/16/2006 | US20060058473 Epoxy resin composition for sealing optical semiconductor |
| 03/16/2006 | US20060057866 Microelectronic packaging and components |
| 03/16/2006 | US20060057834 Semiconductor device and fabrication process thereof |
| 03/16/2006 | US20060057832 Wafer level packages and methods of fabrication |
| 03/16/2006 | US20060057830 Method for producing bumps on an electrical component |
| 03/16/2006 | US20060057820 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
| 03/16/2006 | US20060057807 Method of fabricating a semiconductor device having a silicon oxide layer, a method of fabricating a semiconductor device having dual spacers, a method of forming a silicon oxide layer on a substrate, and a method of forming dual spacers on a conductive material layer |
| 03/16/2006 | US20060057801 Thin films and methods for the preparation thereof |
| 03/16/2006 | US20060057797 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs |
| 03/16/2006 | US20060057789 Method for manufacturing semiconductor device |
| 03/16/2006 | US20060057778 Fabricating method of wafer protection layers |
| 03/16/2006 | US20060057775 Method of forming a wafer backside interconnecting wire |
| 03/16/2006 | US20060057774 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
| 03/16/2006 | US20060057772 Method for forming a redistribution layer in a wafer structure |
| 03/16/2006 | US20060057768 Semiconductor element heat dissipating member, semiconductor device using same and manufacturing same |
| 03/16/2006 | US20060057404 Laminating a plurality of unit layers, consisting of Zn, Bi or Sn single metal layer or alloy layer, by vapor deposition, plating; solder junction connects a semiconductor device; lead-free, uniformity as melting point, thickness |
| 03/16/2006 | US20060057364 Thermal interface materials |
| 03/16/2006 | US20060057334 Structure for encapsulating a liquid crystal display device |
| 03/16/2006 | US20060056159 Locking device for heat sink |
| 03/16/2006 | US20060056158 Heat dissipating device for an integrated circuit chip |
| 03/16/2006 | US20060056152 Fan holder |
| 03/16/2006 | US20060055064 Semiconductor device |
| 03/16/2006 | US20060055063 Leadframe designs for plastic overmold packages |
| 03/16/2006 | US20060055062 Sensor device having stopper for limitting displacement |
| 03/16/2006 | US20060055061 Semiconductor device and a method of assembling a semiconductor device |
| 03/16/2006 | US20060055060 Copper interconnect |
| 03/16/2006 | US20060055059 Copper interconnect |
| 03/16/2006 | US20060055058 Copper interconnect |
| 03/16/2006 | US20060055057 Copper interconnect |
| 03/16/2006 | US20060055056 Semiconductor equipment having a pair of heat radiation plates |
| 03/16/2006 | US20060055055 Semiconductor chip with flexible contacts at a face |
| 03/16/2006 | US20060055054 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 03/16/2006 | US20060055053 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 03/16/2006 | US20060055052 Semiconductor packages |
| 03/16/2006 | US20060055050 Semiconductor device and manufacturing method thereof |
| 03/16/2006 | US20060055049 Routing vias in a substrate from bypass capacitor pads |
| 03/16/2006 | US20060055048 Method of wet etching vias and articles formed thereby |
| 03/16/2006 | US20060055046 Semiconductor device and method for manufacturing the same |
| 03/16/2006 | US20060055044 Semiconductor device |
| 03/16/2006 | US20060055042 Method and device for the detection of at least one luminescent substance |
| 03/16/2006 | US20060055041 Bonding wire and bonded connection |
| 03/16/2006 | US20060055040 Cavity ball grid array apparatus having improved inductance characteristics |
| 03/16/2006 | US20060055038 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package |
| 03/16/2006 | US20060055037 Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip |
| 03/16/2006 | US20060055036 Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device |
| 03/16/2006 | US20060055035 Bump structure |
| 03/16/2006 | US20060055034 Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
| 03/16/2006 | US20060055033 Methods of forming semiconductor packages |
| 03/16/2006 | US20060055032 Packaging with metal studs formed on solder pads |
| 03/16/2006 | US20060055031 Assembled structure and clamping device thereof |
| 03/16/2006 | US20060055030 Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 03/16/2006 | US20060055029 Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
| 03/16/2006 | US20060055028 Semiconductor device |
| 03/16/2006 | US20060055027 Semiconductor device |
| 03/16/2006 | US20060055026 Apparatus for and method of packaging semiconductor devices |
| 03/16/2006 | US20060055025 Method of forming a low capacitance semiconductor device and structure therefor |
| 03/16/2006 | US20060055024 Adapted leaded integrated circuit module |
| 03/16/2006 | US20060055023 Chip carrier and chip package structure thereof |
| 03/16/2006 | US20060055022 Routing power and ground vias in a substrate |
| 03/16/2006 | US20060055021 Wiring board, method of manufacturing the same, and semiconductor device |
| 03/16/2006 | US20060055020 Stackable ball grid array |
| 03/16/2006 | US20060055019 Multi-chip package structure |
| 03/16/2006 | US20060055018 Semiconductor device |
| 03/16/2006 | US20060055017 Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip package are mounted |
| 03/16/2006 | US20060055016 Chip package assembly produced thereby |
| 03/16/2006 | US20060055015 Surface mount hermetic package for power semiconductor die |
| 03/16/2006 | US20060055014 Wireless chip and manufacturing method of the same |
| 03/16/2006 | US20060055013 Electronic component, circuit board, electronic apparatus, and method for manufacturing electronic component |
| 03/16/2006 | US20060055012 LED package with zener diode protection circuit |
| 03/16/2006 | US20060055011 Robust power semiconductor package |
| 03/16/2006 | US20060055010 Semiconductor packages |
| 03/16/2006 | US20060055009 Chip scale package with open substrate |
| 03/16/2006 | US20060055008 Electronic devices with edge connectors and methods of using the same |
| 03/16/2006 | US20060055007 Seal ring structure for integrated circuit chips |
| 03/16/2006 | US20060055006 Field device incorporating circuit card assembly as environmental and EMI/RFI shield |
| 03/16/2006 | US20060055005 Semiconductor device |
| 03/16/2006 | US20060055004 Low K and ultra low K SiCOH dielectric films and methods to form the same |
| 03/16/2006 | US20060055003 Bonded SOI substrate, and method for manufacturing the same |
| 03/16/2006 | US20060055002 Methods for enhancing die saw and packaging reliability |
| 03/16/2006 | US20060055001 Semiconductor device having multiple substrates |
| 03/16/2006 | US20060054990 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same |
| 03/16/2006 | US20060054974 Compact SCR device and method for integrated circuits |
| 03/16/2006 | US20060054936 Nanosensors |
| 03/16/2006 | US20060054915 Led package |
| 03/16/2006 | US20060054914 Composite heat conductive structure for a LED package |
| 03/16/2006 | US20060054870 Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 03/16/2006 | US20060054711 IC card and method of manufacturing the same |
| 03/16/2006 | US20060054707 Non-contact id card and the like and method for manufacturing same |
| 03/16/2006 | US20060054667 Method for supplying solder |
| 03/16/2006 | US20060054608 Method and system for calibrating a laser processing system and laser marking system utilizing same |
| 03/16/2006 | US20060054353 Method and device for protection of a component or module |
| 03/16/2006 | US20060054351 Substrate structure, a method and an arrangement for producing such substrate structure |
| 03/16/2006 | US20060054349 Cof film carrier tape and its manufacturing method |
| 03/16/2006 | US20060054338 Using special visibility materials proximate candidate component locations to enhance recognition |
| 03/16/2006 | US20060054311 Heat sink device with independent parts |
| 03/16/2006 | US20060054307 Heat sink |
| 03/16/2006 | DE4342817B4 Verfahren zur Bildung eines Kontaktloches für eine Metall-Leitung in einem Halbleiter-Bauelement A method of forming a contact hole for a metal line in a semiconductor device |
| 03/16/2006 | DE202005017572U1 Light emitting diode matrix, has mounting plates attached in housing, and space between plates for contact legs of diodes, which are stuck over plates, where cooling medium flows over legs of diode during operation after housing is closed |
| 03/16/2006 | DE19835840B4 Herstellungsverfahren für einen Halbleiterchip Manufacturing method of a semiconductor chip |