| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/22/2006 | CN1246900C Semiconductor device and manufacture method |
| 03/22/2006 | CN1246899C 半导体装置 Semiconductor device |
| 03/22/2006 | CN1246898C High wet sensitive electronic device element |
| 03/22/2006 | CN1246897C Multi chip assemble and multi chip closing method |
| 03/22/2006 | CN1246893C Contact structure member and production method thereof, and probe contact assembly using said contact structure member |
| 03/22/2006 | CN1246891C Package of semiconductor device and its manufacturing method |
| 03/22/2006 | CN1246889C Diode making process and structure |
| 03/21/2006 | US7017137 Topological global routing for automated IC package interconnect |
| 03/21/2006 | US7017128 Concurrent electrical signal wiring optimization for an electronic package |
| 03/21/2006 | US7017059 Methods and apparatus for replacing cooling systems in operating computers |
| 03/21/2006 | US7016236 Semiconductor memory device and defect remedying method thereof |
| 03/21/2006 | US7016200 Module support for electrical/electronic components |
| 03/21/2006 | US7016196 Radiating structural body of electronic part and radiating sheet used for the radiating structural body |
| 03/21/2006 | US7015795 Self-identifying integrated circuits and method for fabrication thereof |
| 03/21/2006 | US7015627 Piezoelectric device and manufacturing method therefor |
| 03/21/2006 | US7015593 Semiconductor device having contact prevention spacer |
| 03/21/2006 | US7015592 Marking on underfill |
| 03/21/2006 | US7015591 Exposed pad module integrating a passive device therein |
| 03/21/2006 | US7015590 Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/21/2006 | US7015589 Semiconductor device having low-k dielectric film in pad region |
| 03/21/2006 | US7015588 Semiconductor device |
| 03/21/2006 | US7015587 Stacked die package for semiconductor devices |
| 03/21/2006 | US7015586 Stacked structure of integrated circuits |
| 03/21/2006 | US7015585 Packaged integrated circuit having wire bonds and method therefor |
| 03/21/2006 | US7015584 High force metal plated spring structure |
| 03/21/2006 | US7015583 Submount and semiconductor device |
| 03/21/2006 | US7015582 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics |
| 03/21/2006 | US7015581 Low-K dielectric material system for IC application |
| 03/21/2006 | US7015580 Roughened bonding pad and bonding wire surfaces for low pressure wire bonding |
| 03/21/2006 | US7015579 Semiconductor device for fingerprint recognition |
| 03/21/2006 | US7015578 Semiconductor unit with cooling system |
| 03/21/2006 | US7015577 Flip chip package capable of measuring bond line thickness of thermal interface material |
| 03/21/2006 | US7015576 Semiconductor device which prevents light from entering therein |
| 03/21/2006 | US7015575 LSI package |
| 03/21/2006 | US7015574 Electronic device carrier adapted for transmitting high frequency signals |
| 03/21/2006 | US7015573 Method and apparatus for molding module electronic devices and a module electronic device molded thereby |
| 03/21/2006 | US7015572 Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system |
| 03/21/2006 | US7015571 Multi-chips module assembly package |
| 03/21/2006 | US7015570 Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
| 03/21/2006 | US7015569 Method and apparatus for implementing a co-axial wire in a semiconductor chip |
| 03/21/2006 | US7015568 System for ultraviolet atmospheric seed layer remediation |
| 03/21/2006 | US7015567 Method for fabricating a semiconductor structure using a protective layer, and semiconductor structure |
| 03/21/2006 | US7015566 Semiconductor wafer and a method for manufacturing a semiconductor wafer |
| 03/21/2006 | US7015559 Method and system for electrically coupling a chip to chip package |
| 03/21/2006 | US7015556 Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and saw device |
| 03/21/2006 | US7015552 Dual work function semiconductor structure with borderless contact and method of fabricating the same |
| 03/21/2006 | US7015418 Method and system for calibrating a laser processing system and laser marking system utilizing same |
| 03/21/2006 | US7015336 Sub-nanoscale electronic devices and processes |
| 03/21/2006 | US7015168 Low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation |
| 03/21/2006 | US7015143 Structure including multiple wire-layers and methods for forming the same |
| 03/21/2006 | US7015138 Multi-layered barrier metal thin films for Cu interconnect by ALCVD |
| 03/21/2006 | US7015137 Semiconductor device with reduced interconnection capacity |
| 03/21/2006 | US7015133 Dual damascene structure formed of low-k dielectric materials |
| 03/21/2006 | US7015132 Forming an electrical contact on an electronic component |
| 03/21/2006 | US7015131 Semiconductor device using bumps, method for fabricating same, and method for forming bumps |
| 03/21/2006 | US7015130 Method for making UBM pads and bumps on wafer |
| 03/21/2006 | US7015129 Bond pad scheme for Cu process |
| 03/21/2006 | US7015127 Semiconductor device and a method of manufacturing the same |
| 03/21/2006 | US7015110 Method and structure of manufacturing high capacitance metal on insulator capacitors in copper |
| 03/21/2006 | US7015109 Interdigital capacitor and method for adjusting the same |
| 03/21/2006 | US7015093 Capacitor integration at top-metal level with a protection layer for the copper surface |
| 03/21/2006 | US7015074 Vacuum package fabrication of integrated circuit components |
| 03/21/2006 | US7015073 Method of forming heat spreader with down set leg attachment feature |
| 03/21/2006 | US7015072 Method of manufacturing an enhanced thermal dissipation integrated circuit package |
| 03/21/2006 | US7015069 Method of manufacturing a semiconductor device and a semiconductor device |
| 03/21/2006 | US7015068 Partial wafer processing for random size wafers |
| 03/21/2006 | US7015066 Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly |
| 03/21/2006 | US7015065 Manufacturing method of ball grid array package |
| 03/21/2006 | US7015050 Misalignment test structure and method thereof |
| 03/21/2006 | US7014731 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| 03/21/2006 | US7014537 Method of processing a semiconductor substrate |
| 03/21/2006 | US7014479 Electrical contact and connector and method of manufacture |
| 03/21/2006 | US7014451 Molding assembly for wafer scale molding of protective caps |
| 03/21/2006 | US7014093 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| 03/21/2006 | US7013965 Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
| 03/21/2006 | US7013960 Heat dissipation device |
| 03/21/2006 | US7013959 Integrated liquid cooling system for electrical components |
| 03/21/2006 | US7013564 Method of producing an electronic device having a PB free solder connection |
| 03/21/2006 | US7013561 Method for producing a capacitor-embedded circuit board |
| 03/21/2006 | US7013559 Method of fabricating a semiconductor device package |
| 03/21/2006 | US7013555 Method of applying phase change thermal interface materials |
| 03/21/2006 | US7013537 Detent means for a heat sink |
| 03/21/2006 | CA2356938C Semiconductor device and method of manufacturing the same |
| 03/16/2006 | WO2006029169A2 Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 03/16/2006 | WO2006029091A2 Thermally controlled fluidic self-assembly method and support |
| 03/16/2006 | WO2006028942A2 Thermally controlled self-assembly method and support |
| 03/16/2006 | WO2006028693A2 Stacked integrated circuit cascade signaling system and method |
| 03/16/2006 | WO2006028668A1 Tin/indium lead-free solders for low stress chip attachment |
| 03/16/2006 | WO2006028511A1 Composite heat sink with metal base and graphite fins |
| 03/16/2006 | WO2006028260A1 Method and apparatus for forming metal film |
| 03/16/2006 | WO2006028195A1 Wireless chip |
| 03/16/2006 | WO2006028081A1 Semiconductor device |
| 03/16/2006 | WO2006028066A1 Pattern generation method |
| 03/16/2006 | WO2006026951A1 Semi-conductor sensor component provided with a cavity housing and sensor chip and method for the production thereof |
| 03/16/2006 | WO2005112112A3 Captive socket actuator |
| 03/16/2006 | WO2005104324A3 Folded, fully buffered memory module |
| 03/16/2006 | WO2005101497A3 Method and apparats for lubricating microelectromechanical devices in packages |
| 03/16/2006 | WO2005091365A3 Coupling substrate for semiconductor components and method for the production thereof |
| 03/16/2006 | WO2005038995A3 Memory link processing with picosecond lasers |
| 03/16/2006 | WO2005027200A3 Method and device for contacting vo semiconductor chips on a metallic substrate |