| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/23/2006 | US20060060951 Semiconductor device and semiconductor device unit |
| 03/23/2006 | US20060060950 Stacked land grid array package |
| 03/23/2006 | US20060060949 Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
| 03/23/2006 | US20060060948 Semiconductor package and semiconductor package mounting method |
| 03/23/2006 | US20060060947 Method and apparatus for removing molding residues from lead-frames |
| 03/23/2006 | US20060060946 Low cost programmable CPU package/substrate |
| 03/23/2006 | US20060060944 Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus |
| 03/23/2006 | US20060060939 Semiconductor apparatus having a built-in electric coil and a method of making the semiconductor apparatus |
| 03/23/2006 | US20060060885 Substrate overcoated with liquid solution containing metal particles and stabilizers |
| 03/23/2006 | US20060060883 Notched compound semiconductor wafer |
| 03/23/2006 | US20060060861 Semiconductor device and method of fabricating same |
| 03/23/2006 | US20060060844 Electrical open/short contact alignment structure for active region vs. gate region |
| 03/23/2006 | US20060060333 Methods and apparatuses for electronics cooling |
| 03/23/2006 | US20060060332 Heat dissipating device |
| 03/23/2006 | US20060060330 Vapor augmented heatsink with multi-wick structure |
| 03/23/2006 | DE19756941B4 Halbleitervorrichtung, Halbleitervorrichtungseinheit und Verfahren zum Herstellen der Halbleitervorrichtungseinheit Semiconductor device, the semiconductor device unit and method of manufacturing the semiconductor device unit |
| 03/23/2006 | DE112004000572T5 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes |
| 03/23/2006 | DE112004000564T5 Leiterrahmenstruktur mit Öffnung oder Rille für einen Flipchip in a leaded molded package Leadframe structure with hole or groove for a flip in a leaded molded package |
| 03/23/2006 | DE10357775B4 Verfahren zur Kennzeichnung einer Vielzahl von Halbleiterwafern mit Identifikationskennzeichen A method for marking a variety of semiconductor wafers with identification tag |
| 03/23/2006 | DE10343083B4 Transistor-Halbleiterbauteil Transistor semiconductor device |
| 03/23/2006 | DE10342775B4 Verfahren zur Ausrichtung eines Halbleiterwafers und Justiermarke A method of aligning a semiconductor wafer alignment mark and |
| 03/23/2006 | DE10255378B4 Teststruktur zum Bestimmen der Stabilität elektronischer Vorrichtungen die miteinander verbundene Substrate umfassen For determining the stability of electronic devices include test structure, the substrates interconnected |
| 03/23/2006 | DE10230712B4 Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger Electronic unit with a low-melting metal support |
| 03/23/2006 | DE102005040489A1 Halbleiter-IC Semiconductor IC |
| 03/23/2006 | DE102005040058A1 Leistungshalbleitermodul und Verfahren zur Herstellung desselben The power semiconductor module and method of manufacturing the same |
| 03/23/2006 | DE102005036925A1 Wärmeabschirmung mit höherer Elastizität und höherer Wärmeleitfähigkeit Heat shield with higher elasticity and higher thermal conductivity |
| 03/23/2006 | DE102005036646A1 Halbleiterchip und Herstellungsverfahren Semiconductor chip and the manufacturing method |
| 03/23/2006 | DE102005036262A1 Infrarotsensor, Infrarot-Gasdetektor und Infrarotstrahlungsquelle Infrared sensor, infrared gas detector and the infrared radiation source |
| 03/23/2006 | DE102005034667A1 Einkapseln von Leiterbahnen von Halbleiter-Einrichtungen Encapsulation of traces of semiconductor devices |
| 03/23/2006 | DE102005034649A1 Optische Halbleitervorrichtung, optischer Verbinder und damit ausgerüstete elektronische Einrichtung A semiconductor optical device, optical connector and electronic device equipped therewith |
| 03/23/2006 | DE102005033715A1 Integrated circuit has upper metal traces routed on insulating layer, which electrically connect with conductive vias, and maintain dummy conductive trace and dummy conductive vias in unused and electrically floating condition |
| 03/23/2006 | DE102005031102A1 Control method for controlling temperature of heat source, e.g. microprocessor, involves channeling two temperature fluids to and from heat exchange surface, respectively, wherein fluid is channeled to minimize temperature differences along |
| 03/23/2006 | DE102005019683A1 Verfahren zur Bildung einer Passivierungsschicht in einem Halbleiterbauelement A method of forming a passivation layer in a semiconductor device |
| 03/23/2006 | DE102004063946A1 Transistor Transistor |
| 03/23/2006 | DE102004043019A1 Baugruppe Module |
| 03/23/2006 | DE102004042563A1 Semiconductor component for e.g. personal computer, has circuit board on which RAM or logic chips are arranged, and intermediate layer provided between chips and circuit board, where layer is made up of heat conductive material |
| 03/23/2006 | DE102004037078A1 Planare Verbindungstechnik für Stromführung im Fehlerfall Planar interconnect technology for power management in case of error |
| 03/23/2006 | DE102004036982A1 Power semiconductor module, has cavity region arranged between two heat sink sections, where power semiconductor- components are arranged in cavity region so that semiconductor devices are placed in thermal contact with heat sink |
| 03/23/2006 | DE102004036971A1 Technik zur Bewertung lokaler elektrischer Eigenschaften in Halbleiterbauelementen Technique for assessing local electrical properties in semiconductor devices |
| 03/23/2006 | DE102004036960A1 Leiterplatte und Verfahren zur Herstellung einer solchen Leiterplatte Printed circuit board and method for producing such a printed circuit board |
| 03/23/2006 | DE102004036909A1 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation |
| 03/23/2006 | DE102004036905A1 Vertikales Leistungshalbleiterbauteil mit einem Halbleiterchip und Verfahren zur Herstellung desselben The same vertical power semiconductor device having a semiconductor chip and method for producing |
| 03/23/2006 | DE102004036142A1 Semiconductor component, used in power semiconductor applications, comprises a semiconductor substrate having a metallization with a barrier layer arranged between metallization layers |
| 03/23/2006 | DE102004036140A1 Halbleiterbauelement Semiconductor device |
| 03/23/2006 | DE102004012231B4 Metal-ceramic substrate for electronics switches or modules comprises a ceramic layer containing aluminum oxide, zirconium oxide and yttrium oxide with a copper foil or layer formed on both sides |
| 03/23/2006 | DE102004011667B4 Vorrichtung mit einem Halbleiterchip und einem mikrofluidischen System und Verfahren zur Herstellung Device having a semiconductor chip and a microfluidic system and method for producing |
| 03/23/2006 | DE10149885B4 Testwafer und Verfahren zu dessen Herstellung Test wafers and process for its preparation |
| 03/22/2006 | EP1638144A2 Method for designing semiconductor device and semiconductor device |
| 03/22/2006 | EP1638143A2 Heat-transfer devices |
| 03/22/2006 | EP1637974A2 Heatsink |
| 03/22/2006 | EP1637526A1 Curable polycyclic compounds and process for the production thereof |
| 03/22/2006 | EP1637019A1 Land grid array connector |
| 03/22/2006 | EP1636860A2 Methods for forming patterns of a filled dielectric material on substrates |
| 03/22/2006 | EP1636854A1 Sensor component, and panel used for the production thereof |
| 03/22/2006 | EP1636844A2 Structured semiconductor element for reducing charging effects |
| 03/22/2006 | EP1636843A1 Package for a high-frequency electronic device |
| 03/22/2006 | EP1636842A2 Stackable semiconductor device and method of manufacturing the same |
| 03/22/2006 | EP1636841A1 Power distribution network of an integrated circuit |
| 03/22/2006 | EP1636840A1 Micro lead frame package and method to manufacture the micro lead frame package |
| 03/22/2006 | EP1636839A2 Thermal interconnect system and method of production thereof |
| 03/22/2006 | EP1636838A2 Capacitor-related systems for addressing package/motherboard resonance |
| 03/22/2006 | EP1636827A2 Thermoplastic fluxing underfill composition and method |
| 03/22/2006 | EP1565938A4 Carbonaceous heat spreader and associated methods |
| 03/22/2006 | EP1518279B1 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors |
| 03/22/2006 | EP1509947B1 Nickel silicide with reduced interface roughness |
| 03/22/2006 | EP1459378B1 Cooling device for a chip and method for production thereof |
| 03/22/2006 | EP1446251A4 Highly filled composites of powdered fillers and polymer matrix |
| 03/22/2006 | EP1428256B1 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same |
| 03/22/2006 | EP1410701A4 Method of manufacturing an integrated circuit carrier |
| 03/22/2006 | EP1199795B1 Lc oscillator |
| 03/22/2006 | EP1025640B1 Integrated electronic circuit comprising an oscillator and passive circuit elements |
| 03/22/2006 | EP1020908B1 Resin-sealed surface mounting type electronic parts |
| 03/22/2006 | CN2766435Y Power-off protection device |
| 03/22/2006 | CN2766344Y Chip protection circuit |
| 03/22/2006 | CN2766343Y Radiator for processor |
| 03/22/2006 | CN2766342Y CPU radiating device with dome |
| 03/22/2006 | CN1751412A High-frequency circuit |
| 03/22/2006 | CN1751390A Lead frame with included passive devices |
| 03/22/2006 | CN1751389A Cooling assembly comprising micro-jets |
| 03/22/2006 | CN1751388A Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| 03/22/2006 | CN1751218A Heat collector with mounting plate |
| 03/22/2006 | CN1751107A Thermally-formable and cross-linkable precursor of a thermally conductive material |
| 03/22/2006 | CN1750283A Submount for light emitting diode and its manufacturing method |
| 03/22/2006 | CN1750282A Light emitting diode |
| 03/22/2006 | CN1750263A 半导体器件 Semiconductor devices |
| 03/22/2006 | CN1750261A Packaging device of ic circuit and its producing method |
| 03/22/2006 | CN1750259A Multiple chip packaged conductor frame, its producing method and its package structure |
| 03/22/2006 | CN1750258A Microelectronic device chip including hybrid au bump, package of the same, and application and production |
| 03/22/2006 | CN1750257A Packaging module with metal studs formed on solder pads, packaging, base board structure and packaging method |
| 03/22/2006 | CN1750256A Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
| 03/22/2006 | CN1750255A Semiconductor composite device, method for manufacturing it, LED head and image forming apparatus |
| 03/22/2006 | CN1750249A Semiconductor device in IC circuit and method for producing it |
| 03/22/2006 | CN1750246A Method for mounting semiconductor device, semiconductor device and its mounting structure |
| 03/22/2006 | CN1750245A Wire bond pads and its producing method |
| 03/22/2006 | CN1750244A Wiring board, method of manufacturing the same, and semiconductor device |
| 03/22/2006 | CN1750207A Semiconductor device |
| 03/22/2006 | CN1748672A Aseptic medicine composition |
| 03/22/2006 | CN1246903C Plasma indicating panel |
| 03/22/2006 | CN1246902C Electronic line chip |
| 03/22/2006 | CN1246901C 电路装置及其制造方法 Circuit device and manufacturing method thereof |